Abstract:
A process for producing coatings, in which (I) coating materials are applied to substrates or to uncured, part-cured and/or fully cured coating films present on said substrates, and (II) the resulting films of the coating materials are cured thermally and with actinic radiation, alone or together with the coating films, which involves (1) conducting the actinic radiation cure under an oxygen-depleted atmosphere and (2) the coating materials comprising (A) meth(acrylate) copolymers which have an OH number of from 100 to 220 mg KOH/G, a glass transition temperature of null35 to null60null C., a number-average molecular weight of from 1 000 to 10 000 daltons and a mass-average molecular weight of from 2 000 to 40 000 daltons and which contain in copolymerized form an amount of hydroxyl-containing monomers (a) that corresponds to the OH number, of which (a1) from 20 to 90% by weight are based on (a), 4-hydroxybutyl (meth)acrylate and/or 2-alkylpropane-1,3-diol mono-(meth)acrylate, and (a2) from 10 to 80% by weight are based on (a), other hydroxyl-containing olefinically unsaturated monomers; and (B) from 0.2 to 8% by weight of photoinitiators.
Abstract:
In the present invention, a protective coating is preferably formed as a plurality of dots upon a surface to be protected. The dots have a selected size, cover a selected amount of the underlying surface, and are preferably isolated from one another by uncoated surfaces. This coating not only provides the coated substrate or object (and the cured coating itself) with significantly increased flexibility and formability, but also with a wide range of possible surface finishes and textures. Due to the increased coating flexibility and formability, the coated substrate or object can be partially or even fully cured prior to forming operations such as injection molding or film shaping. The substrate or object is therefore less susceptible to damage from handling and from machine operations. One highly preferred coating embodiment is produced with ink having a controllable stipple amount for a significantly increased range of possible coating finishes and textures.
Abstract:
The invention is generally directed to techniques for reducing premature drying of solvent-based coatings, including premature drying at sites on the apparatus that applies the coatings. By introduction of solvent vapor proximate to the coating apparatus, and by passively bringing the solvent vapor to the site, the risk of premature drying is reduced. In the presence of the solvent vapor, solvent in the coating fluid tends not to evaporate quickly. The solvent vapor may be introduced by any of a variety of solvent vapor emission devices, and may be brought to the site passively by, for example, increasing the concentration of solvent vapor in a boundary layer that moves with the substrate being coated, diffusion, or natural convection.
Abstract:
A closed space is formed in a reduced pressure drying station, and the closed space is brought to a vacuum state. In this state, an EB unit irradiates a wafer mounted on a hot plate with an electron beam to foam an insulating film material. Subsequently, the hot plate is raised to a predetermined temperature, and drying processing is performed under a reduced pressure. As described above, since the foaming processing is performed in the reduced pressure drying station, bubbles remain in the insulating film, so that the existence of the bubbles can decrease the relative dielectric constant.
Abstract:
This invention provides a method for producing a CD-R optical recording medium. A first stack at a first stage is created by forming on a substrate a recording layer containing an organic dyestuff and a metal layer. At least after a formation of the metal layer; the first stack is transported from the first stage along a transport path towards a second stage through an atmosphere having a relative humidity. The relative humidity is maintained at 40% or less. To control the relative humidity, a shielding plate may be provided around the transport path. An air conditioner may locally control the relative humidity of an area encircled by this shielding plate.
Abstract:
In the present invention, a protective coating is preferably formed as a plurality of dots upon a surface to be protected. The dots have a selected size, cover a selected amount of the underlying surface, and are preferably isolated from one another by uncoated surfaces. This coating not only provides the coated substrate or object (and the cured coating itself) with significantly increased flexibility and formability, but also with a wide range of possible surface finishes and textures. Due to the increased coating flexibility and formability, the coated substrate or object can be partially or even fully cured prior to forming operations such as injection molding or film shaping. The substrate or object is therefore less susceptible to damage from handling and from machine operations. One highly preferred coating embodiment is produced with ink having a controllable stipple amount for a significantly increased range of possible coating finishes and textures.
Abstract:
A closed space is formed in a reduced pressure drying station, and the closed space is brought to a vacuum state. In this state, an EB unit irradiates a wafer mounted on a hot plate with an electron beam to foam an insulating film material. Subsequently, the hot plate is raised to a predetermined temperature, and drying processing is performed under a reduced pressure. As described above, since the foaming processing is performed in the reduced pressure drying station, bubbles remain in the insulating film, so that the existence of the bubbles can decrease the relative dielectric constant.
Abstract:
A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.
Abstract:
The present invention is a film forming method for forming a film of a coating solution on a substrate, comprising the steps of spreading the coating solution supplied to a center of the substrate by rotating the substrate, and supplying solvent vapor of the coating solution to the coating solution spread over the substrate while rotating the substrate to thin the film of the coating solution formed on the substrate. Accordingly, it becomes possible that the film of the coating solution which is formed by spreading the coating solution over the substrate is maintained at a low viscosity, and that the film can be further thinned. The necessary quantity of the coating solution can be also reduced. Moreover, since solvent vapor is supplied onto the coating film, by controlling the supply quantity or the supply position of the solvent vapor, the uniformity of the coating solution film can be obtained, and the thickness of the coating solution film can be controlled.
Abstract:
Prior to transfer of an wafer W, a mixed gas is being generated and exhausted, thereby fluctuation of concentration and temperature of a solvent component at the beginning of gas introduction into a chamber 3 is suppressed. A step of gelling after the wafer W is carried into an aging unit is divided into several steps. Until a temperature of the wafer W reaches a predetermined treatment temperature, an average concentration of the solvent component in a mixed gas is gradually raised relative to the temperature of the wafer W. Thereby, immediately after the wafer W is transferred into a sealed chamber, the gas of the solvent component is prevented from condensing.