公开(公告)号：US07713778B2

公开(公告)日：2010-05-11

申请号：US10544801

申请日：2004-02-13

Applicant: Yang Yang Li ,  Frederique Cunin ,  Michael J. Sailor ,  Jamie R. Link ,  Ting Gao

Inventor： Yang Yang Li ,  Frederique Cunin ,  Michael J. Sailor ,  Jamie R. Link ,  Ting Gao

IPC: H01L21/00

CPC classification number: B29D11/00346 ,  B29D11/0074 ,  B81B2201/06 ,  B81B2203/0361 ,  B81C99/0085 ,  B81C2201/0115 ,  B81C2201/034 ,  Y10S977/921

Abstract: A method of generating three-dimensional nanostructures that includes providing a silicon substrate, creating a porous silicon template from the silicon substrate, wherein the template is created to have a predetermined configuration, depositing a predetermined material on the porous silicon template, and removing the porous silicon template from the deposited material to leave a freestanding nanostructure.

Abstract translation: 一种产生三维纳米结构的方法，其包括提供硅衬底，从所述硅衬底产生多孔硅模板，其中所述模板被创建为具有预定构型，在所述多孔硅模板上沉积预定材料，以及除去所述多孔硅模板 硅模板从沉积的材料离开独立的纳米结构。

公开(公告)号：US20100009142A1

公开(公告)日：2010-01-14

申请号：US12306646

申请日：2007-06-27

Applicant: Eckhard Quandt ,  Clemens Schmutz ,  Christiane Zamponi

Inventor： Eckhard Quandt ,  Clemens Schmutz ,  Christiane Zamponi

IPC: B32B3/02 ,  C23F1/02 ,  G03F7/20 ,  C23C14/34

CPC classification number: C23C14/0005 ,  A61L27/06 ,  A61L31/022 ,  B81B2201/06 ,  B81C99/008 ,  Y10T428/24917

Abstract: A method for the production of a structured metal layer (7) made from an alloy composed of titanium and nickel includes the following process steps: a sacrificial layer composite (3) is provided, which comprises a second sacrificial layer (2) applied onto a first sacrificial layer (1), the first sacrificial layer (1) is subjected for the purpose of structuring to a wet-chemical etching process in such a manner that undercutting of the sacrificial layer (1) occurs, a metal layer (7) of the alloy is applied indirectly or directly to the structured sacrificial layer composite (3). The first sacrificial layer (1) is at a greater distance from the metal layer (7). The second sacrificial layer (2) facing the metal layer (7) to be deposited is subjected to a dry etching process prior to wet-chemical etching of the first sacrificial layer (1) so that the second sacrificial layer (2) is provided with a structure that corresponds to the desired structure of the metal layer (7). The invention further relates to an object, particularly a stent or an implant, which comprises at least one metal layer (7) that is produced by applying the method for the production of the structured metal layer (7).

Abstract translation: 制造由钛和镍组成的合金制成的结构金属层（7）的方法包括以下工艺步骤：提供牺牲层复合材料（3），该牺牲层复合材料（3）包括第二牺牲层（2） 第一牺牲层（1），第一牺牲层（1）的目的是以如下方式进行湿法化学蚀刻工艺的构造：使牺牲层（1）发生底切，金属层（7） 该合金间接或直接施加到结构化牺牲层复合材料（3）上。 第一牺牲层（1）距离金属层（7）更大的距离。 在第一牺牲层（1）的湿化学蚀刻之前​​，面对要沉积的金属层（7）的第二牺牲层（2）进行干蚀刻处理，使得第二牺牲层（2）设置有 对应于金属层（7）的所需结构的结构。 本发明还涉及一种物体，特别是支架或植入物，其包括通过施加用于生产结构化金属层（7）的方法而产生的至少一个金属层（7）。

公开(公告)号：US07501241B2

公开(公告)日：2009-03-10

申请号：US10902495

申请日：2004-07-29

Applicant: Tomohiko Matsushita ,  Shigeru Aoyama ,  Takeo Nishikawa ,  Yuko Tsuda ,  Shigemi Norioka ,  Tetsuichi Wazawa

Inventor： Tomohiko Matsushita ,  Shigeru Aoyama ,  Takeo Nishikawa ,  Yuko Tsuda ,  Shigemi Norioka ,  Tetsuichi Wazawa

IPC: C12Q1/68 ,  C12M1/34 ,  C08L89/00 ,  A61K8/73

CPC classification number: B82Y20/00 ,  B01J2219/00382 ,  B01J2219/00385 ,  B01J2219/00436 ,  B01J2219/00527 ,  B01J2219/00576 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00619 ,  B01J2219/00621 ,  B81B2201/0214 ,  B81B2201/06 ,  B81C1/00206 ,  B81C99/009 ,  B82Y5/00 ,  B82Y10/00 ,  G02F2001/01791 ,  G02F2202/32 ,  H01S5/3412

Abstract: A method of mass-producing minute structures such as biochips, protein chips, quantum dots, and quantum chips involves arranging an antigen two-dimensionally on a board and arranging probes two-dimensionally facing the same direction so that the binding sites of the probes may bind to the antigen. An inorganic substance such as Ni is deposited on the board from the upper side of the probes by sputtering or evaporation to form a thin film layer and on the top surface of the flatly formed thin film layer, a supporting layer is formed by separating out the same inorganic substance using electrotyping. Then, by peeling the thin film layer and the supporting layer off of the board together, the mother stamper having cavities for the patterns of biomolecules is obtained.

Abstract translation: 大规模生产生物芯片，蛋白质芯片，量子点和量子芯片的微小结构的方法包括将二维布置在板上，并将探针二维排列成相同的方向，使得探针的结合位点 结合抗原。 无机物质如Ni通过溅射或蒸发从探针的上侧沉积在板上以形成薄膜层，并且在平坦形成的薄膜层的顶表面上，通过分离出 使用电化学的相同无机物质。 然后，通过将薄膜层和支撑层从板上剥离在一起，获得具有用于生物分子图案的空腔的母模。

公开(公告)号：US20080124719A1

公开(公告)日：2008-05-29

申请号：US11670207

申请日：2007-02-01

Applicant: Jong-suk CHUNG ,  Kyu-youn HWANG ,  Jeo-young SHIM

Inventor： Jong-suk CHUNG ,  Kyu-youn HWANG ,  Jeo-young SHIM

IPC: C12Q1/68 ,  C12M3/00 ,  B05D3/02

CPC classification number: B81C1/00206 ,  B01J19/0046 ,  B01J2219/00387 ,  B01J2219/0043 ,  B01J2219/00527 ,  B01J2219/00585 ,  B01J2219/00599 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00626 ,  B01J2219/00637 ,  B01J2219/00659 ,  B01J2219/00675 ,  B01J2219/00711 ,  B01J2219/00722 ,  B81B2201/06 ,  B82Y30/00 ,  C40B50/18

Abstract: Provided is a method of preparing a patterned spot microarray using a photocatalyst. The method comprises coating the photocatalyst on a substrate to form a photocatalyst layer, coating a composition comprising a functional group to be connected to a biomolecule on the photocatalyst layer to form an organic layer, spotting the biomolecule on the organic layer, positioning a photomask above a spot of the biomolecule; and irradiating the spot through the photomask to pattern the spot.

Abstract translation: 提供了使用光催化剂制备图案化斑点微阵列的方法。 该方法包括将光催化剂涂覆在基材上以形成光催化剂层，涂覆包含要连接到光催化剂层上的生物分子的官能团的组合物以形成有机层，将生物分子点在有机层上，将光掩模放在上面 生物分子的一个点; 并通过光掩模照射斑点以对斑点进行图案化。

公开(公告)号：US20070110962A1

公开(公告)日：2007-05-17

申请号：US10572987

申请日：2004-09-23

Applicant: Joe Tien ,  Min Tang ,  Andrew Golden

Inventor： Joe Tien ,  Min Tang ,  Andrew Golden

IPC: B32B3/00

CPC classification number: B81C1/0046 ,  A61K9/0097 ,  B81B2201/0214 ,  B81B2201/06 ,  B81C99/0085 ,  B81C2201/0153 ,  B82Y30/00 ,  Y10T428/24479 ,  Y10T428/24612

Abstract: The present invention provides three-dimensional hydrogel structures patterned by a treated micropattern mold. The treated mold is capable of transferring the inverse of its micropattern to a hydrogel by contact during formation or polymerization of the structure from a precursor. The treated micropattern mold surface allows the mold to be separated from the hydrogel without collapsing the structure or irreparably damaging its micropattern. The transferred micropattern may yield individual features and/or interconnected channels in the hydrogel. The invention also provides a hydrogel network fabricated by interfacing at least two hydrogels in which one or more of the hydrogels may be a micropatterned structure. Micropatterned hydrogel structures can also be specifically aligned to interconnect their patterns. Structures or networks of the invention comprise hydrogels that can adhere together by chemically bonding and/or mechanically entangling.

Abstract translation: 本发明提供了通过处理的微图案模具图案化的三维水凝胶结构。 经处理的模具能够在从前体形成或聚合结构期间通过接触将其微图案的倒数转移到水凝胶。 经处理的微图案模具表面允许模具与水凝胶分离，而不会破坏结构或不可修复地损坏其微图案。 转移的微图案可以在水凝胶中产生单个特征和/或互连通道。 本发明还提供了一种水凝胶网络，其通过与至少两个水凝胶接合而制造，其中一个或多个水凝胶可以是微图案结构。 微图案化的水凝胶结构也可以特别对准以互连其图案。 本发明的结构或网络包括可通过化学键合和/或机械缠结而粘合在一起的水凝胶。

公开(公告)号：US07196385B2

公开(公告)日：2007-03-27

申请号：US10524560

申请日：2003-08-25

Applicant: Christophe Bureau ,  Christophe Kergueris ,  Francois Perruchot

Inventor： Christophe Bureau ,  Christophe Kergueris ,  Francois Perruchot

IPC: H01L29/84 ,  H01L21/00

CPC classification number: G01L9/0042 ,  A61B5/00 ,  B29C2043/5825 ,  B81B3/0094 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/06 ,  B81B2203/0127 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/181 ,  Y10S977/733 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electromechanical microstructure including a first mechanical part formed in a first electrically conductive material, and which includes a zone deformable in an elastic manner having a thickness value and an exposed surface, and a first organic film having a thickness, present on all of the exposed surface of the deformable zone. The thickness of the first film is such that the elastic response of the deformable zone equipped with the first film does not change by more than 5% compared to the response of the bare deformable zone, or the thickness of the first film is less than ten times the thickness of the deformable zone.

Abstract translation: 一种机电微结构，包括形成在第一导电材料中的第一机械部件，并且包括具有厚度值和暴露表面的弹性变形区域和具有厚度的第一有机膜，存在于所有暴露的 可变形区域的表面。 第一膜的厚度使得配备有第一膜的可变形区域的弹性响应与裸露可变形区域的响应相比不变化多于5％，或者第一膜的厚度小于十 倍的可变形区域的厚度。

公开(公告)号：US20060115323A1

公开(公告)日：2006-06-01

申请号：US11267541

申请日：2005-11-04

Applicant: Jonathan Coppeta ,  Kurt Shelton ,  Norman Sheppard ,  Douglas Snell ,  Catherine Santini

Inventor： Jonathan Coppeta ,  Kurt Shelton ,  Norman Sheppard ,  Douglas Snell ,  Catherine Santini

IPC: F16B11/00

CPC classification number: B81C1/00269 ,  A61K9/0097 ,  A61M5/14276 ,  A61M2205/0244 ,  A61M2207/00 ,  B23K20/02 ,  B33Y80/00 ,  B81B2201/06 ,  B81C1/00047 ,  B81C1/00095 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/038 ,  F16B4/004 ,  F16B5/08 ,  F16B11/004 ,  H01L23/10 ,  H01L23/3142 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16237 ,  H01L2224/81193 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16315 ,  Y10T403/477 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.

Abstract translation: 提供压缩冷焊方法，接头结构和密封的密封装置。 该方法包括提供具有至少一个第一接头结构的第一基底，该第一接合结构包括第一接合表面，该表面包括第一金属; 提供具有至少一个第二接头结构的第二基底，所述第二接头结构包括第二接合表面，所述表面包括第二金属; 以及将所述至少一个第一接合结构和所述至少一个第二接头结构压在一起，以在一个或多个界面上局部变形和剪切所述接合表面，所述接合面有效地在所述第一金属和所述第二接头结构之间形成金属与金属之间的接合 金属的接合面。 在接合表面上的重叠有效地移动表面污染物并促进接合表面之间的紧密接触而不需要热量输入。 密封装置可以包含药物制剂，生物传感器或MEMS装置。

公开(公告)号：US06627965B1

公开(公告)日：2003-09-30

申请号：US09500407

申请日：2000-02-08

Applicant: Harry L. Tuller ,  Richard Mlcak ,  Dharanipal Doppalapudi

Inventor： Harry L. Tuller ,  Richard Mlcak ,  Dharanipal Doppalapudi

IPC: H01L2982

CPC classification number: B81B3/0089 ,  B81B3/0094 ,  B81B2201/06 ,  B81B2203/0127 ,  H01L41/094 ,  H01L41/18 ,  H01L41/316 ,  H01L41/331 ,  H01L41/332

Abstract: A micromechanical device includes a single crystal micromechanical structure where at least a portion of the micromechanical structure is capable of performing a mechanical motion. An epitaxial layer covers at least a portion of the micromechanical structure. In one embodiment, the micromechanical structure and the epitaxial layer are formed of different materials.

Abstract translation: 微机械装置包括单晶微机械结构，其中至少一部分微机械结构能够执行机械运动。 外延层覆盖微机械结构的至少一部分。 在一个实施例中，微机械结构和外延层由不同的材料形成。

公开(公告)号：US12067448B2

公开(公告)日：2024-08-20

申请号：US17958620

申请日：2022-10-03

Applicant: ENDOTRONIX, INC.

Inventor： Balamurugan Sundaram ,  Michael Nagy ,  Douglas Nielsen ,  Suresh Sundaram ,  Harry Rowland

IPC: G06K7/10 ,  A61B5/00 ,  A61B5/0215 ,  A61B5/318 ,  A61B90/98 ,  G16H10/65 ,  H04Q9/00

CPC classification number: G06K7/10425 ,  A61B5/0031 ,  A61B5/0215 ,  A61B90/98 ,  G06K7/10386 ,  H04Q9/00 ,  A61B5/318 ,  A61F2250/0002 ,  B81B2201/02 ,  B81B2201/06 ,  G16H10/65 ,  H04Q2209/00 ,  H04Q2209/47 ,  H04Q2209/50 ,  H04Q2209/86

Abstract: Disclosed are a reader device, system, and method for communicating with a wireless sensor. The reader device may be configured to analyze the strength of a response signal transmitted from the wireless sensor in response to an excitation pulse generated by the reader device. In one embodiment, the reader device may be configured to engage be placed in a plurality of modes to allow the reader to transmit a signal, such as a short pulse of energy or a short burst of radio frequency energy to cause the wireless sensor to output a resonant signal. The reader device may receive the resonant signal from the wireless sensor and evaluate it against predetermined values. The evaluated signals may be used to assess the strength and the proximity of the reader device relative to the wireless sensor as it is implanted in a patient.

公开(公告)号：US20180247095A1

公开(公告)日：2018-08-30

申请号：US15903809

申请日：2018-02-23

Applicant: ENDOTRONIX, INC.

Inventor： Balamurugan Sundaram ,  Michael Nagy ,  Douglas Nielsen ,  Suresh Sundaram ,  Harry Rowland

IPC: G06K7/10 ,  A61B90/98

CPC classification number: G06K7/10425 ,  A61B5/0031 ,  A61B5/0215 ,  A61B5/0402 ,  A61B90/98 ,  A61F2250/0002 ,  B81B2201/02 ,  B81B2201/06 ,  G06K7/10386 ,  G16H10/65 ,  H04Q9/00 ,  H04Q2209/00 ,  H04Q2209/47 ,  H04Q2209/50 ,  H04Q2209/86

Abstract: Disclosed are a reader device, system, and method for communicating with a wireless sensor. The reader device may be configured to analyze the strength of a response signal transmitted from the wireless sensor in response to an excitation pulse generated by the reader device. In one embodiment, the reader device may be configured to engage be placed in a plurality of modes to allow the reader to transmit a signal, such as a short pulse of energy or a short burst of radio frequency energy to cause the wireless sensor to output a resonant signal. The reader device may receive the resonant signal from the wireless sensor and evaluate it against predetermined values. The evaluated signals may be used to assess the strength and the proximity of the reader device relative to the wireless sensor as it is implanted in a patient.