中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

85 records (took 0.02 seconds)

    Method for separating a useful layer and component obtained by said method
    41.
    发明授权
    Method for separating a useful layer and component obtained by said method 失效
    用于分离由所述方法获得的有用层和组分的方法

    公开(公告)号：US07569152B2

    公开(公告)日：2009-08-04

    申请号：US10562931

    申请日：2004-07-01

    Applicant: Hubert Grange ,  Bernard Diem ,  Sylvie Viollet Bosson ,  Michel Borel

    Inventor： Hubert Grange ,  Bernard Diem ,  Sylvie Viollet Bosson ,  Michel Borel

    IPC: C03C15/00

    CPC classification number: B81B3/001 ,  B81C2201/115

    Abstract: A useful layer (1) is initially attached by a sacrificial layer (2) to a layer (3) forming a substrate. Before etching of the sacrificial layer (2), at least a part of the surface (4, 5) of at least one of the layers in contact with the sacrificial layer (2) is doped. After etching of the sacrificial layer (2), the surface (4, 5) is superficially etched so as to increase the roughness of its doped part. After doping, a mask (9) is deposited on a part of the useful layer (1) so as to delineate a doped zone and a non-doped zone of the surface (4, 5), one of the zones forming a stop after the superficial etching phase.

    Abstract translation: 有用层（1）最初由牺牲层（2）附着到形成衬底的层（3）上。 在蚀刻牺牲层（2）之前，掺杂与牺牲层（2）接触的至少一层的表面（4,5）的至少一部分。 在蚀刻牺牲层（2）之后，表面（4,5）被表面蚀刻以增加其掺杂部分的粗糙度。 在掺杂之后，在有用层（1）的一部分上沉积掩模（9），以便描绘表面（4,5）的掺杂区和非掺杂区，其中一个区在 表面蚀刻阶段。

    MEMS DEVICES WITH PROTECTIVE COATINGS
    42.
    发明申请
    MEMS DEVICES WITH PROTECTIVE COATINGS 审中-公开
    具有保护涂层的MEMS器件

    公开(公告)号：US20090059345A1

    公开(公告)日：2009-03-05

    申请号：US12263752

    申请日：2008-11-03

    Applicant: Ming-Hau Tung ,  Lior Kogut

    Inventor： Ming-Hau Tung ,  Lior Kogut

    IPC: G02F1/21

    CPC classification number: B81C1/00801 ,  B81B3/001 ,  B81B3/0072 ,  B81B2201/042 ,  B81C2201/0109 ,  B81C2201/017 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31935

    Abstract: A microelectromechanical devices with protective coatings on one or more surfaces of the micromechanical device is disclosed. The micromechanical device includes a substrate. The micromechanical device further includes a mirror positioned over the substrate. The mirror can be at least partially reflective to incident light. The micromechanical device further includes an optical layer positioned over the substrate and spaced from the mirror. The optical layer can be at least partially transmissive to incident light. The micromechanical device can further include a protective coating. The optical layer and the mirror define a cavity and the protective coating overlies surfaces of the microelectromechanical device exposed to the cavity.

    Abstract translation: 公开了一种在微机械装置的一个或多个表面上具有保护涂层的微机电装置。 微机械装置包括基板。 微机械装置还包括位于衬底上方的反射镜。 镜子可以至少部分反射入射光。 微机械装置还包括位于基板上并与反射镜隔开的光学层。 光学层可以至少部分地透射入射光。 微机械装置还可以包括保护涂层。 光学层和反射镜限定空腔，保护涂层覆盖暴露于空腔的微机电装置的表面。

    Methods for producing MEMS with protective coatings using multi-component sacrificial layers
    43.
    发明授权
    Methods for producing MEMS with protective coatings using multi-component sacrificial layers 失效
    使用多组分牺牲层制备具有保护涂层的MEMS的方法

    公开(公告)号：US07450295B2

    公开(公告)日：2008-11-11

    申请号：US11367098

    申请日：2006-03-02

    Applicant: Ming-Hau Tung ,  Lior Kogut

    Inventor： Ming-Hau Tung ,  Lior Kogut

    IPC: G02B26/00 ,  H01L21/00

    CPC classification number: B81C1/00801 ,  B81B3/001 ,  B81B3/0072 ,  B81B2201/042 ,  B81C2201/0109 ,  B81C2201/017 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31935

    Abstract: Methods of forming a protective coating on one or more surfaces of a microelectromechanical device are disclosed comprising the steps of forming a composite layer of a sacrificial material and a protective material, and selectively etching the sacrificial material to form a protective coating. The protective coatings of the invention preferably improve one or more aspects of the performance of the microelectromechanical devices in which they are incorporated. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.

    Abstract translation: 公开了在微机电装置的一个或多个表面上形成保护涂层的方法，其包括以下步骤：形成牺牲材料和保护材料的复合层，并选择性地蚀刻牺牲材料以形成保护涂层。 本发明的保护性涂层优选地改进了其中并入其中的微机电装置的性能的一个或多个方面。 还公开了通过本发明的方法形成的微机电装置以及包括这种装置的视觉显示装置。

    Methods for producing MEMS with protective coatings using multi-component sacrificial layers
    44.
    发明申请
    Methods for producing MEMS with protective coatings using multi-component sacrificial layers 失效
    使用多组分牺牲层制备具有保护涂层的MEMS的方法

    公开(公告)号：US20070206267A1

    公开(公告)日：2007-09-06

    申请号：US11367098

    申请日：2006-03-02

    Applicant: Ming-Hau Tung ,  Lior Kogut

    Inventor： Ming-Hau Tung ,  Lior Kogut

    IPC: G02B26/00

    CPC classification number: B81C1/00801 ,  B81B3/001 ,  B81B3/0072 ,  B81B2201/042 ,  B81C2201/0109 ,  B81C2201/017 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31935

    Abstract: Methods of forming a protective coating on one or more surfaces of a microelectromechanical device are disclosed comprising the steps of forming a composite layer of a sacrificial material and a protective material, and selectively etching the sacrificial material to form a protective coating. The protective coatings of the invention preferably improve one or more aspects of the performance of the microelectromechanical devices in which they are incorporated. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.

    Abstract translation: 公开了在微机电装置的一个或多个表面上形成保护涂层的方法，其包括以下步骤：形成牺牲材料和保护材料的复合层，并选择性地蚀刻牺牲材料以形成保护涂层。 本发明的保护性涂层优选地改进了其中并入其中的微机电装置的性能的一个或多个方面。 还公开了通过本发明的方法形成的微机电装置以及包括这种装置的视觉显示装置。

    Method and apparatus for modulating a light beam
    45.
    发明授权
    Method and apparatus for modulating a light beam 失效
    用于调制光束的方法和装置

    公开(公告)号：US5808797A

    公开(公告)日：1998-09-15

    申请号：US638605

    申请日：1996-04-26

    Applicant: David M. Bloom ,  Francisco S. A. Sandejas ,  Olav Solgaard

    Inventor： David M. Bloom ,  Francisco S. A. Sandejas ,  Olav Solgaard

    IPC: B81B3/00 ,  G02B5/18 ,  G02B26/08

    CPC classification number: B81B3/001 ,  G02B26/0808 ,  G02B5/1828 ,  B81C2201/115

    Abstract: A modulator for modulating incident rays of light, the modulator having a plurality of equally spaced apart elements, each of which includes a light reflective planar surface. The elements are arranged parallel to each other with their light reflective surfaces parallel to each other. The modulator includes means for supporting elements in relation to one another and means for moving particular ones of the elements relative to others so that the moved elements transit between a first configuration wherein the modulator acts to reflect the incident rays of light as a plane mirror, and a second configuration wherein the modulator diffracts the light reflected therefrom. In operation, the light reflective surfaces of the elements remain parallel to each other in both the first and the second configurations. The perpendicular spacing between the reflective surfaces of respective elements is equal to m/4 times the wavelength of the incident rays of light, wherein m=an even whole number or zero when the elements are in the first configuration and m=an odd whole number when the elements are in the second configuration.

    Abstract translation: 一种用于调制入射光线的调制器，该调制器具有多个等间隔开的元件，每个元件包括光反射平面。 元件彼此平行地布置，其光反射表面彼此平行。 调制器包括用于相对于彼此支撑元件的装置和用于相对于其它元件移动元件中的特定元件的装置，使得移动的元件在第一配置之间转换，其中调制器作用以将入射的光线反射为平面镜， 以及其中调制器衍射从其反射的光的第二配置。 在操作中，元件的光反射表面在第一和第二构造中保持彼此平行。 各个元件的反射表面之间的垂直间距等于入射光线的波长的m / 4倍，其中当元件处于第一配置时m =偶数或零，m =奇数整数 当元件处于第二配置时。

    Micromechanical structure with textured surface and method for making same
    46.
    发明授权
    Micromechanical structure with textured surface and method for making same 失效
    具有纹理表面的微机械结构及其制造方法

    公开(公告)号：US5679436A

    公开(公告)日：1997-10-21

    申请号：US447100

    申请日：1995-05-22

    Applicant: Yang Zhao

    Inventor： Yang Zhao

    IPC: B81B3/00 ,  G01P15/08 ,  G01P15/13 ,  G01P15/125

    CPC classification number: B81C1/0096 ,  B81B3/001 ,  G01P15/0802 ,  G01P15/131 ,  B81C2201/115 ,  G01P2015/0814 ,  G01P2015/0828 ,  H01J2209/0223 ,  Y10T428/24322 ,  Y10T428/24355 ,  Y10T428/24479

    Abstract: A method for forming sub-micron sized bumps on the bottom surface of a suspended microstructure or the top surface of the underlying layer in order to reduce contact area and sticking between the two layers without the need for sub-micron standard photolithography capabilities and the thus-formed microstructure. The process involves the deposition of latex spheres on the sacrificial layer which will later temporarily support the microstructure, shrinking the spheres, depositing aluminum over the spheres, dissolving the spheres to leave openings in the metal layer, etching the sacrificial layer through the openings, removing the remaining metal and depositing the microstructure material over the now textured top surface of the sacrificial layer.

    Abstract translation: 一种用于在悬浮的微结构的底表面或下层的顶表面上形成亚微米级的凸起的方法，以便减少接触面积和两层之间的粘附，而不需要亚微米标准的光刻能力，因此 形成微观结构。 该方法包括将胶乳球体沉积在牺牲层上，其将稍后暂时支撑微结构，收缩球体，在球体上沉积铝，溶解球体以在金属层中留下开口，通过开口蚀刻牺牲层，去除 剩余的金属并将微结构材料沉积在牺牲层的现在变形的顶部表面上。

    Stiction reduction system and method thereof
    48.
    发明授权
    Stiction reduction system and method thereof 有权

    公开(公告)号：US11661332B2

    公开(公告)日：2023-05-30

    申请号：US16795514

    申请日：2020-02-19

    Applicant: InvenSense, Inc.

    Inventor： Daesung Lee ,  Ian Flader ,  Alan Cuthbertson ,  Emad Mehdizadeh

    IPC: H01L21/311 ,  B81B3/00 ,  B81C1/00

    CPC classification number: B81B3/001 ,  B81C1/0092 ,  B81C1/0096 ,  B81C1/00341 ,  B81C1/00444 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C2201/013 ,  B81C2201/115

    Abstract: Methods and systems for reducing stiction through roughening the surface and reducing the contact area in MEMS devices are disclosed. A method includes fabricating bumpstops on a surface of a MEMS device substrate to reduce stiction. Another method is directed to applying roughening etchant to a surface of a silicon substrate to enhance roughness after cavity etch and before removal of hardmask. Another embodiment described herein is directed to a method to reduce contact area between proof mass and UCAV (“upper cavity”) substrate surface with minimal impact on the cavity volume by introducing a shallow etch process step and maintaining high pressure in accelerometer cavity. Another method is described as to increasing the surface roughness of a UCAV substrate surface by depositing a rough layer (e.g. polysilicon) on the surface of the substrate and etching back the rough layer to transfer the roughness.

Patent Agency Ranking