公开(公告)号：US20170122799A1

公开(公告)日：2017-05-04

申请号：US15404013

申请日：2017-01-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Takafumi OKUDO ,  Takahiro MIYATAKE ,  Yoshiharu SANAGAWA ,  Masao KIRIHARA ,  Yoichi NISHIJIMA ,  Takanori AKETA ,  Ryo TOMOIDA

IPC: G01J1/04

CPC classification number: G01J1/0403 ,  G01J1/04 ,  G01J1/0407 ,  G01J1/0411 ,  G01J1/0437 ,  G01J5/0025 ,  G01J5/02 ,  G01J5/0235 ,  G01J5/06 ,  G01J5/0806 ,  G01J5/0831

Abstract: An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.

公开(公告)号：US09587978B2

公开(公告)日：2017-03-07

申请号：US14301114

申请日：2014-06-10

Applicant: PANASONIC CORPORATION

Inventor： Takafumi Okudo ,  Takahiro Miyatake ,  Yoshiharu Sanagawa ,  Masao Kirihara ,  Yoichi Nishijima ,  Takanori Aketa ,  Ryo Tomoida

IPC: G01J1/04 ,  G01J5/00 ,  G01J5/08 ,  G01J5/02 ,  G01J5/06

CPC classification number: G01J1/0411 ,  G01J1/04 ,  G01J1/0407 ,  G01J1/0437 ,  G01J5/0025 ,  G01J5/02 ,  G01J5/0235 ,  G01J5/06 ,  G01J5/0806 ,  G01J5/0831

Abstract: An infrared sensor includes: an infrared detecting device; a lens disposed above the infrared detecting device; an member that is disposed at a side of an upper surface of the lens and includes an opening; and a gap that intervenes between the member and the lens and has a wider range than the opening.

Abstract translation: 红外线传感器包括：红外线检测装置; 设置在所述红外线检测装置的上方的透镜; 设置在透镜的上表面侧并且包括开口的构件; 以及介于构件和透镜之间并且具有比开口更宽的范围的间隙。

公开(公告)号：US09163993B2

公开(公告)日：2015-10-20

申请号：US13371679

申请日：2012-02-13

Applicant: Takafumi Noda

Inventor： Takafumi Noda

IPC: G01J5/02 ,  G01J5/00 ,  G01J5/08 ,  G01J5/20

CPC classification number: G01J5/0025 ,  G01J5/023 ,  G01J5/0235 ,  G01J5/024 ,  G01J5/0896 ,  G01J5/20

Abstract: A thermal detector includes a substrate, a support member, a spacer member, a thermal detection element, a detection circuit and a wiring part. The spacer member supports the support member over the substrate with a cavity part being formed therebetween. The thermal detection element is supported on the support member. The wiring part connects between the detection circuit and the thermal detection element, and has first through third conductive layer parts and a plurality of plugs. The first conductive layer part includes at least one layer disposed in the substrate. The second conductive layer part includes at least one layer disposed in the spacer member. The third conductive layer part includes at least one layer supported by the support member. The plugs respectively connect adjacent layers of the first conductive layer part, the second conductive layer part and the third conductive layer part, in a thickness direction of the substrate.

Abstract translation: 热检测器包括基板，支撑构件，间隔构件，热检测元件，检测电路和布线部。 隔离构件在衬底上支撑支撑构件，其间形成有空腔部分。 热检测元件支撑在支撑构件上。 布线部分连接在检测电路和热检测元件之间，并且具有第一至第三导电层部分和多个插塞。 第一导电层部分包括设置在基板中的至少一层。 第二导电层部分包括设置在间隔件中的至少一层。 第三导电层部分包括由支撑构件支撑的至少一层。 插头分别在基板的厚度方向上连接第一导电层部分，第二导电层部分和第三导电层部分的相邻层。

公开(公告)号：US20130082181A1

公开(公告)日：2013-04-04

申请号：US13525397

申请日：2012-06-18

Applicant: Dan Corcos ,  Michel Despont ,  Danny Elad ,  Bernd Gotsmann ,  Lukas Kull ,  Thomas E. Morf

Inventor： Dan Corcos ,  Michel Despont ,  Danny Elad ,  Bernd Gotsmann ,  Lukas Kull ,  Thomas E. Morf

IPC: G01J5/34

CPC classification number: G01J5/34 ,  B81B3/0081 ,  G01J5/0235 ,  G01J5/024 ,  G01J5/0837 ,  G01J5/22

Abstract: A THz radiation detector comprising a vertical antenna separated from a suspended platform by an isolating thermal air gap for concentrating THz radiation energy into a smaller suspended MEMS platform upon which a thermal sensor element is located. THz photon energy is converted into electrical energy via a thermally isolated air gap between plates of a coupling capacitor separated by a plurality of nano-tip spacers that determine the gap distance. The capacitor couples energy from the antenna to the thermal sensor.

Abstract translation: 一种太赫兹辐射检测器，包括通过隔离热空气间隙与悬浮平台分离的垂直天线，用于将太赫兹辐射能量集中到位于热传感器元件的较小悬置MEMS平台上。 太赫兹光子能量通过由多个确定间隙距离的多个纳米尖端间隔物隔开的耦合电容器的板之间的隔热气隙转换成电能。 电容器将能量从天线耦合到热传感器。

公开(公告)号：US20130019461A1

公开(公告)日：2013-01-24

申请号：US13553290

申请日：2012-07-19

Applicant: Hartmut Rudmann ,  Markus Rossi

Inventor： Hartmut Rudmann ,  Markus Rossi

IPC: H05K13/00 ,  G01J1/42

CPC classification number: H01L31/16 ,  B29D11/00298 ,  B29D11/00307 ,  G01J1/0209 ,  G01J1/0233 ,  G01J1/0271 ,  G01J1/0411 ,  G01J1/06 ,  G01J1/42 ,  G01J5/00 ,  G01J5/022 ,  G01J5/0235 ,  G01J5/024 ,  G01J5/0265 ,  G01J5/045 ,  G01J5/0806 ,  G01J5/20 ,  G01J2001/061 ,  G02B3/0031 ,  G02B3/0056 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14687 ,  H01L31/02325 ,  H01L31/167 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

Abstract translation: 制造光电模块（1）包括提供其上布置有检测构件（D）的衬底晶片（PW）; 提供间隔晶片（SW）; 提供光学晶片（OW），所述光学晶片包括透明部分（t），所述透明部分（t）对于通常可由检测部件检测到的光和至少一个阻挡部分（b），用于基本上衰减或阻挡通常由检测部件可检测的入射光; 以及准备其中所述间隔晶片（SW）布置在所述衬底晶片（PW）和所述光学晶片（OW）之间的晶片堆叠（2），使得所述检测构件（D）布置在所述衬底晶片和所述光学晶片之间 。 用于发射由检测部件（D）能够通常检测的光的发射部件（E）可以布置在基板晶片（PW）上。 可以通过将晶片堆叠（2）分离成单独的模块来获得单个模块（1）。

公开(公告)号：US20110141286A1

公开(公告)日：2011-06-16

申请号：US13058968

申请日：2009-10-06

Applicant: Michel Vilain

Inventor： Michel Vilain

IPC: H04N5/33

CPC classification number: G01J5/20 ,  G01J5/02 ,  G01J5/023 ,  G01J5/0235 ,  G01J5/08 ,  G01J5/0875 ,  H01L31/09

Abstract: This electromagnetic radiation detector consists of a plurality of elementary detection micro-sites, each including a micro-detector provided with a membrane (2) that is sensitive to the radiation in question and each being provided in a micro-cavity or micro-capsule defined by a substrate (1), by an upper wall (5) used as a window that is transparent to said radiation and by side walls (4), said membrane (2) being suspended above substrate (1) by means of at least two support arms (6) that include an electrically conducting layer (17), with the ends of said arms (6) being anchored in side walls (4).

Abstract translation: 该电磁辐射检测器由多个基本检测微位点组成，每个元件包括具有对所述辐射敏感的膜（2）的微检测器，并且每个被提供在微腔或微胶囊中 通过基板（1），由用作对所述辐射透明的窗口的上壁（5）和侧壁（4），所述膜（2）借助于至少两个 支撑臂（6），其包括导电层（17），所述臂（6）的端部锚固在侧壁（4）中。

公开(公告)号：US20080237469A1

公开(公告)日：2008-10-02

申请号：US12056631

申请日：2008-03-27

Applicant: Naoki Oda ,  Susumu Komiyama ,  Iwao Hosako

Inventor： Naoki Oda ,  Susumu Komiyama ,  Iwao Hosako

IPC: G01J5/02

CPC classification number: G01J5/02 ,  G01J5/0215 ,  G01J5/0235 ,  G01J5/024 ,  G01J5/046 ,  G01J5/08 ,  G01J5/0809 ,  G01J5/0815 ,  G01J5/0837 ,  G01J5/20

Abstract: In a bolometer-type THz-wave detector in a micro-bridge structure in which a temperature detecting portion (diaphragm) including a bolometer thin film is supported by a supporting portion in a state suspended from a circuit substrate, a member (dielectric cover) made of a dielectric material for efficiently collecting a THz wave is added to an upper part of the temperature detecting portion, and when a refractive index of the dielectric cover is n, thickness is t, and a wavelength of the THz wave is λ, a setting is made so as to have nt>λ, and a gap between the dielectric cover and the temperature detecting portion is set at integral multiples of λ/2. By this arrangement, an absorption of the THz wave can be improved using a structure and manufacturing method of a bolometer-type infrared detector, and a high-performance bolometer-type THz-wave detector can be manufactured with a high yield.

Abstract translation: 在微型桥结构中的热辐射计式太赫兹波检测器中，其中包括测辐射热计薄膜的温度检测部分（隔膜）以悬挂于电路基板的状态由支撑部分支撑，构件（电介质盖） 由用于有效地收集太赫兹波的电介质材料添加到温度检测部分的上部，并且当电介质盖的折射率为n时，厚度为t，并且THz波的波长为λ，a 使nt>λ设定，电介质盖和温度检测部之间的间隔设为λ/ 2的整数倍。 通过这种布置，可以使用测辐射热计型红外线检测器的结构和制造方法来改善太赫兹波的吸收，并且可以以高产率制造高性能测辐射热计型THz波检测器。

公开(公告)号：US20070158570A1

公开(公告)日：2007-07-12

申请号：US11651054

申请日：2007-01-09

Applicant: Yoshimi Ohta ,  Masaki Hirota

Inventor： Yoshimi Ohta ,  Masaki Hirota

IPC: G01J5/00

CPC classification number: G01J5/12 ,  G01J5/02 ,  G01J5/0225 ,  G01J5/023 ,  G01J5/0235 ,  G01J5/10

Abstract: An infrared detection element is configured to prevent decreases in detection precision when a beam bends. The infrared detection element basically has a substrate structure, a light receiver configured and arranged to receive infrared rays and at least one beam having one end fixed to the substrate and another end fixed to the light receiver to support the light receiver above the substrate. At least one protuberance is provided on at least one of the substrate, the light receiver and the beam with the at least one protuberance being configured and arranged to limit direct contact between any two of the beam, the light receiver and the substrate structure during bending of the beam, except at the at least one protuberance.

Abstract translation: 红外线检测元件被配置为防止光束弯曲时的检测精度降低。 红外线检测元件基本上具有基板结构，配置和布置成接收红外线的光接收器和至少一个光束，其中一个光束的一端固定到基板，另一端固定到光接收器，以将光接收器支撑在基板上。 至少一个突起设置在至少一个基板，光接收器和光束上，其中至少一个突起被构造和布置成限制弯曲期间光束，光接收器和基板结构中的任何两个之间的直接接触 的梁，除了在至少一个突起。

公开(公告)号：US5479931A

公开(公告)日：1996-01-02

申请号：US154276

申请日：1993-11-18

Applicant: Mark Mooradian

Inventor： Mark Mooradian

IPC: G01J5/02 ,  A61B5/01 ,  G01J5/00 ,  G01J5/04 ,  G01K13/00 ,  A61B5/05 ,  A61B6/00

CPC classification number: G01J5/04 ,  G01J5/044 ,  G01J5/048 ,  G01J5/049 ,  G01J5/08 ,  G01J5/0818 ,  G01J5/0235

Abstract: A novel wave guide assembly for use in an IR thermometer of the type used in measuring temperature of the tympanic membrane of the ear for body temperature determinations. The assembly provides a unique arrangement of spacers and a protective sheath to create a durable yet inexpensive wave guide. The spacer includes radially offset contact points that induce moment arms to absorb shock and other forms of rough handling encountered in daily use.

Abstract translation: 一种用于测量耳朵鼓膜温度的类型的红外温度计的新型波导组件，用于体温测定。 组件提供了独特的间隔件和保护套的布置，以产生耐用且便宜的波导。 间隔件包括径向偏移的接触点，其引起力矩臂以吸收日常使用中遇到的冲击和其他形式的粗糙处理。

公开(公告)号：US2184169A

公开(公告)日：1939-12-19

申请号：US24334338

申请日：1938-12-29

Applicant: UNITED STATES STEEL CORP

Inventor： OSCAR SERDAHL LOUIS

IPC: G01J5/04

CPC classification number: G01J5/02 ,  G01J5/004 ,  G01J5/0235 ,  G01J5/029 ,  G01J5/04 ,  G01J5/08 ,  G01J5/0818 ,  G01J5/0831