公开(公告)号：US20160150640A1

公开(公告)日：2016-05-26

申请号：US14944949

申请日：2015-11-18

Applicant: MINEBEA CO., LTD.

Inventor： Satoshi SUGAWARA

IPC: H05K1/02 ,  F21V8/00

CPC classification number: H05K1/0274 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/009 ,  H05K1/189 ,  H05K2201/0112 ,  H05K2201/10106

Abstract: A planar illumination device includes: a light guide plate; a point light source disposed to face a light incident surface of the light guide plate; and a circuit substrate on which the point light source is mounted. The circuit substrate includes: a base film; a first conductive layer and a first coverlay film stacked in sequence on a first surface of the base film, the first conductive layer including a pair of lands to which a pair of electrode terminals of the point light source are electrically connected; and a second conductive layer and a second coverlay film stacked in sequence on a second surface of the base film the second coverlay film including a light absorber. The second coverlay film is exposed between the lands and in front of a light emitting surface of the point light source in a light emitting direction.

Abstract translation: 平面照明装置包括：导光板; 点光源，被配置为面对所述导光板的光入射面; 以及其上安装有点光源的电路基板。 电路基板包括：基膜; 第一导电层和第一覆盖膜依次层叠在所述基膜的第一表面上，所述第一导电层包括一对引线，所述一对焊盘与所述点光源的一对电极端子电连接; 以及第二导电层和第二覆盖层膜，其顺序地层叠在所述基膜的第二表面上，所述第二覆盖膜包括光吸收体。 第二覆盖膜在发光方向上在焊盘之间和点光源的发光表面之前露出。

公开(公告)号：US09175151B2

公开(公告)日：2015-11-03

申请号：US14496709

申请日：2014-09-25

Applicant: PANASONIC CORPORATION

Inventor： Yuko Konno ,  Hiromitsu Takashita ,  Tsuyoshi Takeda ,  Hiroaki Fujiwara ,  Shingo Yoshioka

IPC: C08K5/34 ,  H05K1/03 ,  H05K3/00 ,  C09D125/08 ,  C09D133/08 ,  C08K5/3475 ,  H05K3/10 ,  H05K3/18 ,  C08L33/02 ,  C08K5/00

CPC classification number: C08K5/3475 ,  C08K5/005 ,  C08L33/02 ,  C09D125/08 ,  C09D133/08 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/0026 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/184 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/0264 ,  H05K2203/0565 ,  H05K2203/0571

Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Abstract translation: 本发明涉及一种树脂组合物，其包含由含有至少一个羧基的单体单元的第一单体和可与第一单体共聚的第二单体组成的共聚物，并且还包括紫外线吸收剂。 使用的树脂组合物是树脂组合物，当∈1表示通过将溶剂中溶解在树脂组合物形成的树脂膜2中制备的溶液中的树脂膜2的每单位重量的吸光度系数作为 在要照射树脂膜2的光波长处的液体，∈1为至少0.01（L /（g·cm））。

公开(公告)号：US20140167330A1

公开(公告)日：2014-06-19

申请号：US14105535

申请日：2013-12-13

Applicant: Plastic Components and Modules Automotive S.p.A

Inventor： Enrico Parola ,  Pasquale Iacobone ,  Etienne Valentin

IPC: H01B1/18 ,  B29C71/04

CPC classification number: H01B1/18 ,  B29C71/04 ,  B82Y30/00 ,  C08J5/005 ,  C08J5/043 ,  C08K7/06 ,  C08K7/14 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0112 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/09118 ,  H05K2203/107 ,  H05K2203/1136

Abstract: A composite material for the realization of a component or a structural part, in particular for installation on-board a vehicle, adapted to integrate electrical devices and connections, includes a non-conductive polymeric matrix; a dispersed phase including at least one promoter of carbonization adapted to form carbonaceous conductive structures; and a reinforcing-fibre filler adapted to direct the distribution and orientation of the dispersed phase in the polymeric matrix.

Abstract translation: 用于实现组件或结构部件的复合材料，特别是用于车载车辆的安装，适于集成电气设备和连接件，包括非导电聚合物基体; 分散相包括至少一个适于形成碳质导电结构的碳化促进剂; 以及适于引导分散相在聚合物基质中的分布和取向的增强纤维填料。

公开(公告)号：US20130247373A1

公开(公告)日：2013-09-26

申请号：US13785348

申请日：2013-03-05

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Joji FUJII ,  Hiroaki TSUYOSHI ,  Hiroto IIDA ,  Kazuhiro YOSHIKAWA ,  Mitsuyoshi MATSUDA

IPC: H05K3/42

CPC classification number: H05K3/42 ,  H05K3/0035 ,  H05K3/0038 ,  H05K2201/0112 ,  Y10T29/49165 ,  Y10T428/12438

Abstract: An object of the present invention is to provide a method of producing a printed wiring board which reduces production steps, is excellent in infrared laser processability, and is suitable for formation of an excellent wiring pattern; and to provide a copper foil for laser processing and a copper-clad laminate. In order to achieve the object, a method of producing a printed wiring board comprises: forming a via-hole for interlayer connection in a laminate in which a copper foil for laser processing comprises a copper foil and an easily soluble laser absorption layer provided on a surface of the copper foil which has a higher etching rate to a copper etchant than the copper foil and absorbs an infrared laser beam and another conductor layer is laminated through an insulating layer, directly irradiating the infrared laser beam on the easily soluble laser absorption layer; and removing the easily soluble laser absorption layer from the surface of the copper foil in a desmear step of removing a smear in a via-hole and/or a microetching step as a pretreatment of an electroless plating step is adopted.

Abstract translation: 本发明的目的是提供一种制造印刷线路板的方法，该印刷线路板减少制造步骤，红外线激光加工性优异，适用于形成优异的布线图案; 并提供用于激光加工的铜箔和覆铜层压板。 为了实现该目的，制造印刷电路板的方法包括：在用于激光加工的铜箔包括铜箔和易于溶解的激光吸收层的叠层中形成层间连接用通孔 对铜蚀刻剂比铜箔蚀刻速度高的铜箔的吸收红外激光束和另一个导体层的铜箔的表面通过绝缘层层叠，将红外激光束直接照射在容易溶解的激光吸收层上; 采用在通孔和/或微蚀刻步骤中去除污迹的去污步骤中从铜箔表面去除容易溶解的激光吸收层作为化学镀步骤的预处理。

公开(公告)号：US20130199825A1

公开(公告)日：2013-08-08

申请号：US13817825

申请日：2011-10-21

Applicant: Alex Bruderer ,  Norbert Galster ,  Jurgen Kress ,  Michel Probst

Inventor： Alex Bruderer ,  Norbert Galster ,  Jurgen Kress ,  Michel Probst

IPC: H05K3/00 ,  H05K1/03

CPC classification number: H05K3/0085 ,  H05K1/0313 ,  H05K3/0032 ,  H05K3/4673 ,  H05K2201/0112 ,  H05K2201/0195 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T29/49155 ,  Y10T428/24967

Abstract: Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer (1), a resin layer without reinforcement (2), and a resin layer with reinforcement (3). The circuitry (9) is embedded into the resin layer without reinforcement (2).

Abstract translation: 公开了用于制造印刷电路板，IC基板，芯片封装等的复合材料堆积材料。 复合材料堆积材料适用于嵌入诸如微孔，沟槽和垫的电路。 复合堆积材料包括载体层（1），没有增强层（2）的树脂层和具有加强层（3）的树脂层。 电路（9）嵌入树脂层而不加固（2）。

公开(公告)号：US08484837B2

公开(公告)日：2013-07-16

申请号：US13273154

申请日：2011-10-13

Applicant: Andreas Nickut ,  Bernd Albrecht ,  Peter Kracht

Inventor： Andreas Nickut ,  Bernd Albrecht ,  Peter Kracht

IPC: H05K3/34 ,  H01R9/00 ,  H05K3/00

CPC classification number: H05K3/3494 ,  B23K1/0016 ,  B23K1/005 ,  B23K26/361 ,  B23K26/364 ,  B23K26/40 ,  B23K35/268 ,  B23K35/3602 ,  B23K2101/42 ,  B23K2103/172 ,  B23K2103/18 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  H01L24/81 ,  H01L2224/81192 ,  H01L2224/81224 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/0326 ,  H05K2201/10106 ,  H05K2203/107 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/81 ,  H01L2924/00

Abstract: The invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: the electrical component or the conductive layer is provided with a soldering material in the area where the component is to be connected to the conductive layer; the soldering material is provided with energy supplied by an energy source, such that the soldering material melts and a non-detachable, material-bonded conductive connection between the electrical component and the conductive layer is established.

Abstract translation: 本发明涉及一种用于将电气部件与至少一个导电层导电连接的方法，由此将导电层施加到在可见光波长区域中基本上是透明的基底，包括以下步骤：电气部件或 导电层在组件要连接到导电层的区域中设置有焊接材料; 焊接材料设置有由能量源提供的能量，使得焊接材料熔化，并且建立电气部件和导电层之间的不可拆卸的材料键合的导电连接。

公开(公告)号：US20120279775A1

公开(公告)日：2012-11-08

申请号：US13542233

申请日：2012-07-05

Applicant: Chang-han Shim ,  Sung-il Kang ,  Se-chuel Park

Inventor： Chang-han Shim ,  Sung-il Kang ,  Se-chuel Park

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K3/0038 ,  H05K3/244 ,  H05K3/384 ,  H05K3/427 ,  H05K2201/0112 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the substrate; a plated layer comprising nickel and disposed on the conductive layer; and a viahole passing through the substrate, the conductive layer, and the plated layer, wherein a crystal growth direction of nickel in the plated layer is parallel to a thickness-wise direction of the substrate.

Abstract translation: 提供一种具有通孔的电路板及其制造方法。 电路板包括：由绝缘材料形成的基板; 设置在所述基板上的导电层; 包含镍并设置在导电层上的镀层; 以及穿过基板，导电层和镀层的通孔，其中镀层中的镍的晶体生长方向平行于基板的厚度方向。

公开(公告)号：US20110121280A1

公开(公告)日：2011-05-26

申请号：US13054846

申请日：2009-07-17

Applicant: Takeshi Hakii

Inventor： Takeshi Hakii

IPC: H01L51/30 ,  H01L51/40

CPC classification number: H01L51/0021 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1837 ,  H01L51/0023 ,  H01L51/0545 ,  H01L51/107 ,  H05K3/185 ,  H05K3/389 ,  H05K2201/0112

Abstract: The present invention provides a substrate with excellent thin line reproducibility and excellent adhesion with conductive wiring, a conductive pattern formation process employing the substrate and an organic thin film transistor employing the substrate. The substrate is characterized in that it has a sensitizing dye and a compound represented by the following formula (I): (R)n-—i(A)3-n-(B)  Formula (I) wherein R represents an alkyl group having a carbon atom number of not more than 8; A represents an alkoxy group or a halogen atom; B represents a substituent containing an SH group; and n is an integer of from 0 to 2.

Abstract translation: 本发明提供了具有优异的细线再现性和与导电布线的优异粘附性，使用该基板的导电图案形成工艺和使用该基板的有机薄膜晶体管的基板。 基材的特征在于其具有敏化染料和下式（I）表示的化合物：（R）n -i（A）3-正（B）式（I）其中R表示烷基 碳原子数不超过8; A表示烷氧基或卤素原子; B表示含有SH基团的取代基; n为0〜2的整数。

公开(公告)号：US20110024178A1

公开(公告)日：2011-02-03

申请号：US12579861

申请日：2009-10-15

Applicant: Tingjui CHEN

Inventor： Tingjui CHEN

IPC: H05K1/11 ,  B23K26/38

CPC classification number: H05K3/0038 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/35 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/36 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  H05K1/0366 ,  H05K2201/0112 ,  H05K2203/082

Abstract: A substrate of a wiring board is provided with at least one through-hole and includes an upper conductive layer, a lower conductive layer and an insulation layer. The lower conductive layer is opposite to the upper layer and the insulation layer is configured between the upper conductive layer and the lower conductive layer. The through-hole is formed by penetrating the upper conductive layer, the insulation layer and the lower conductive layer and is provided with a wall at the insulation layer, with a surface roughness of the wall being within 10 microns.

Abstract translation: 布线基板的基板设置有至少一个通孔，并且包括上导电层，下导电层和绝缘层。 下导电层与上层相反，绝缘层配置在上导电层和下导电层之间。 通孔是通过穿透上导电层，绝缘层和下导电层形成的，并且在绝缘层处设置有壁，其表面粗糙度在10微米以内。

公开(公告)号：US07507519B2

公开(公告)日：2009-03-24

申请号：US10898338

申请日：2004-07-26

Applicant: Naoyuki Toyoda

Inventor： Naoyuki Toyoda

IPC: G03F7/00 ,  G03C11/00

CPC classification number: H05K3/125 ,  B82Y30/00 ,  H05K3/1208 ,  H05K2201/0112 ,  H05K2203/107 ,  H05K2203/1173 ,  Y10S430/146 ,  Y10T428/24917

Abstract: Aspects of the invention can provide a patterning forming method capable of patterning a thin film by a simple and inexpensive device. The thin film can be provided on a base member including a photothermal conversion material that converts optical energy into thermal energy and light is radiated onto the base member to remove the thin film corresponding to a light-radiated region, such that the thin film is patterned.

Abstract translation: 本发明的方面可以提供一种能够通过简单廉价的装置对薄膜进行图案化的图案形成方法。 薄膜可以设置在包括将光能转换成热能的光热转换材料的基底构件上，并且将光照射到基底构件上以除去与光照射区域相对应的薄膜，使得薄膜被图案化 。