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    Methods and compositions for dielectric materials
    41.
    发明授权
    Methods and compositions for dielectric materials 有权
    介电材料的方法和组成

    公开(公告)号：US07981504B2

    公开(公告)日：2011-07-19

    申请号：US12354482

    申请日：2009-01-15

    Applicant: Kevin G. Nelson

    Inventor： Kevin G. Nelson

    IPC: B32B5/18 ,  B32B15/08 ,  B32B15/20

    CPC classification number: H01B3/445 ,  C08K7/14 ,  C08L27/18 ,  C08L2205/025 ,  H05K1/034 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2203/1131 ,  Y10T428/24322 ,  Y10T428/249953 ,  Y10T428/249991 ,  Y10T428/26 ,  Y10T428/266 ,  Y10T428/31544 ,  Y10T428/31678

    Abstract: The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9 and/or a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C. to low temperatures of approximately −200° C., operate in wide range of atmospheric conditions and pressures (e.g., a high atmosphere, low vacuum condition such as that found in the outer-space as well as conditions similar to those found at sea level or below sea level). The dielectric materials of the present invention may be used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices such as RF interconnects.

    Abstract translation: 本发明包括介电材料的方法和组合物。 本发明的电介质材料包括介电常数大于1.0且小于1.9的材料和/或损耗系数小于0.0009的材料。 其他特征包括能够承受大范围的温度，从大约+ 260℃的高温到约-200℃的低温，在大气条件和压力的大范围（例如高气氛 ，诸如在外层空间中发现的低真空条件以及类似于海平面或海平面以下的条件的条件）。 本发明的电介质材料可以用于复合结构的制造，其可以单独使用或与其它材料组合使用，并且可以用于电子部件或诸如RF互连的装置中。

    Pressure Sensitive Adhesive For Transporting Flexible Substrate
    43.
    发明申请
    Pressure Sensitive Adhesive For Transporting Flexible Substrate 有权
    用于运输柔性基材的压敏粘合剂

    公开(公告)号：US20100059171A1

    公开(公告)日：2010-03-11

    申请号：US12087919

    申请日：2007-01-15

    Applicant: Sang-Ki Chun

    Inventor： Sang-Ki Chun

    IPC: B32B7/12 ,  C08G77/38 ,  B32B7/02 ,  B32B5/02 ,  B32B37/00

    CPC classification number: H05K3/007 ,  C08L83/00 ,  C09J7/28 ,  C09J183/04 ,  C09J2483/00 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  Y10T428/24355 ,  Y10T428/24942 ,  Y10T428/2839

    Abstract: Disclosed herein is a silicon adhesive composition for transporting a flexible substrate. The composition includes (A) 42 to 70 parts by weight of a polydiorganosiloxane containing an alkenyl group, (B) 55 to 28 parts by weight of a polyorganosiloxane copolymer including R13SiO1/2 units and SiO2 units, wherein R1 is a hydroxy group or a monovalent hydrocarbon group of 1 to 12 carbon atoms, (C) a polyorganosiloxane containing an SiH group, wherein the molar ratio of the SiH group of component (C) to the alkenyl group of component (A) is from 0.5 to 20, and (D) a platinum group catalytic compound, wherein the weight ratio of a metal component of the compound to the sum of components (A) and (B) is from 1 to 5000 ppm by weight.

    Abstract translation: 本文公开了一种用于输送柔性基板的硅粘合剂组合物。 该组合物包含（A）42〜70重量份含有烯基的聚二有机硅氧烷，（B）55〜28重量份的包含R 13 SiO 1/2单元和SiO 2单元的聚有机硅氧烷共聚物，其中R 1为羟基或 （C）含有SiH基的聚有机硅氧烷，（C）成分（C）的SiH基与成分（A）的链烯基的摩尔比为0.5〜20，（C）含有1〜 D）铂族催化剂化合物，其中化合物的金属组分与组分（A）和（B）之和的重量比为1至5000重量ppm。

    Multilayer printed wiring board with filled viahole structure
    44.
    发明授权
    Multilayer printed wiring board with filled viahole structure 有权
    多层印刷线路板，带有通孔结构

    公开(公告)号：US07622183B2

    公开(公告)日：2009-11-24

    申请号：US11385904

    申请日：2006-03-22

    Applicant: Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

    Inventor： Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

    IPC: B32B3/00

    CPC classification number: H05K3/4661 ,  H05K3/108 ,  H05K3/381 ,  H05K3/382 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/31681

    Abstract: The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.

    Abstract translation: 本发明提供了一种多层印刷线路板，其具有有利地用于在其上形成精细电路图案的填充通孔结构，并且在热冲击下或由于热循环具有优异的抗开裂性。 多层印刷布线板由交替地彼此堆叠的导体电路层和层间绝缘树脂层构成，层间绝缘树脂层各自形成有各自填充有镀层的孔，以形成通孔。 露出用于通孔的孔的镀层的表面形成为基本上平坦，并且位于与布置在层间绝缘树脂层中的导体电路的表面基本相同的水平。 导体电路层的厚度小于通孔直径的一半，小于25μm。 形成在层间绝缘树脂层中的孔的内壁变粗糙，并且在粗糙化表面上沉积化学镀层。 在包括无电镀层的孔中填充电镀层以形成通孔。 层间绝缘树脂层由显示高断裂韧性的氟树脂和耐热性热塑性树脂，氟树脂和热固性树脂的复合物或热固性和热塑性树脂的复合材料的复合材料形成。

    Composite Porous Resin Base Material and Method for Manufacturing the Same
    49.
    发明申请
    Composite Porous Resin Base Material and Method for Manufacturing the Same 审中-公开
    复合多孔树脂基材及其制造方法

    公开(公告)号：US20090081419A1

    公开(公告)日：2009-03-26

    申请号：US11988723

    申请日：2006-06-09

    Applicant: Yuichi Idomoto ,  Yasuhiro Okuda

    Inventor： Yuichi Idomoto ,  Yasuhiro Okuda

    IPC: B32B3/10

    CPC classification number: H05K1/119 ,  H01R12/7076 ,  H05K3/0058 ,  H05K3/368 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09045 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T428/24802

    Abstract: In a composite porous resin base material, a porous resin film is provided with a functional section whereupon an electrode and/or a circuit is formed. On the periphery surrounding the functional section, a step having a height different from that of the functional section is formed, and a frame plate is arranged on a plane of the step. Provided is the composite porous resin base material which has a structure wherein the frame plate having rigidity is attached to the porous resin base material whereupon the electrode and/or a circuit is formed without deteriorating characteristics such as elasticity and conductivity of the porous resin base material.

    Abstract translation: 在复合多孔树脂基材中，多孔树脂膜具有形成电极和/或电路的功能部。 在功能部周边的周边形成有与功能部不同的高度的台阶，并且在台阶的平面上配置框架板。 本发明提供一种复合多孔树脂基材，其特征在于，具有刚性的框架板附着在多孔树脂基材上，由此形成电极和/或电路，而不会导致多孔树脂基材的弹性和导电性等劣化 。

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