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    Hybrid integrated circuit magnetic substrate for motor or generator circuit
    49.
    发明授权
    Hybrid integrated circuit magnetic substrate for motor or generator circuit 失效
    用于电机或发电机电路的混合集成电路磁性基板

    公开(公告)号：US4737672A

    公开(公告)日：1988-04-12

    申请号：US947813

    申请日：1986-12-30

    Applicant: Akira Kazami

    Inventor： Akira Kazami

    IPC: H05K1/03 ,  B32B7/02 ,  B32B15/04 ,  B32B15/08 ,  H01L25/16 ,  H02K29/00 ,  H02K29/08 ,  H05K1/05

    CPC classification number: H02K29/08 ,  H01L25/16 ,  H05K1/056 ,  H01L2924/0002 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0355 ,  Y10S310/06

    Abstract: A hybrid integrated circuit substrate for a motor is formed by an iron substrate (1), a resin layer (2) adhered on the same and a copper foil layer (3) adhered on the same. The resin layer (2) is formed of epoxy resin, and Kevlar fiber belonging to aromatic polyamide fiber is mixed therein in the form of cloth or paper. Thus, a clad formed by the resin layer (2) and the copper foil layer (3) has a thermal expansion coefficient close to that of the iron substrate (1), thereby to prevent warping caused in manufacturing of the hybrid integrated circuit substrate. The copper foil layer (3) is etched in prescribed configurations to form conductive paths (13), to which stator coils (5) and various circuit elements (14, 15) are connected.

    Abstract translation: 用于电机的混合集成电路基板由铁基板（1），粘附在其上的树脂层（2）和粘附在其上的铜箔层（3）形成。 树脂层（2）由环氧树脂形成，属于芳香族聚酰胺纤维的凯夫拉纤维以布或纸的形式混合。 因此，由树脂层（2）和铜箔层（3）形成的包层的热膨胀系数接近于铁基板（1）的热膨胀系数，从而防止混合集成电路基板的制造中产生翘曲。 以规定的构造蚀刻铜箔层（3），形成与定子线圈（5）和各种电路元件（14,15）连接的导电路径（13）。

    Plasma etching of blind vias in printed wiring board dielectric
    50.
    发明授权
    Plasma etching of blind vias in printed wiring board dielectric 失效
    印刷线路板电介质中盲孔等离子体蚀刻

    公开(公告)号：US4720322A

    公开(公告)日：1988-01-19

    申请号：US37761

    申请日：1987-04-13

    Applicant: Paula K. Tiffin

    Inventor： Paula K. Tiffin

    IPC: H05K3/46 ,  H05K3/00 ,  B44C1/22 ,  B29C37/00 ,  C03C15/00 ,  C23F1/02

    CPC classification number: H05K3/0041 ,  H05K2201/0278 ,  H05K2201/09509 ,  H05K2203/0554 ,  H05K3/46 ,  H05K3/4652 ,  Y10T29/49165

    Abstract: A method of plasma etching blind vias in printed wiring board dielectric which comprises the steps of providing a printed wiring board of organic material having a buried electrically conductive pattern in the organic material and an electrically conductive layer on the surface of the board, removing predetermined portions of the electrically conductive layer to expose the organic material thereunder and define at least one via location thereat, providing a plasma etching chamber having one or more pairs of spaced parallel electrodes, positioning the board between the said electrodes, electrically connecting the board to one of said electrodes and having the surface facing and parellel to the electrodes, filling the chamber with a mixture of an oxidizing gas and a fluorocarbon gas, etching the organic material from the exposed organic material at the surface to the buried pattern to expose the buried pattern by applying an RF signal across the electrodes, and forming an electrically conductive layer of the exposed surfaces of the organic material contacting the exposed buried pattern and the conductive layer.

    Abstract translation: 一种等离子体蚀刻印刷线路板电介质中的盲孔的方法，包括以下步骤：在有机材料中提供具有掩埋导电图案的有机材料的印刷线路板和在该表面上的导电层，去除预定部分 的导电层以暴露其下面的有机材料并且在其上限定至少一个通孔位置，提供具有一对或多对间隔开的平行电极的等离子体蚀刻室，将板定位在所述电极之间，将电路电连接到 所述电极并且表面面向并连接到电极，用氧化气体和碳氟化合物气体的混合物填充室，将有机材料从表面处的暴露的有机材料蚀刻到掩埋图案，以通过 在电极上施加RF信号，并且形成电气 有机材料的暴露表面与暴露的掩埋图案和导电层接触的导电层。

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