Patent search cpc:"H05K2201/091" Page 5

41.

发明授权
Solderless component packaging and mounting 失效
Title translation: 无焊件组件封装和安装

公开(公告)号：US07061076B2

公开(公告)日：2006-06-13

申请号：US10918679

申请日：2004-08-12

Applicant: Stephen R. Shiffer

Inventor： Stephen R. Shiffer

IPC: H01L23/58

CPC classification number: H05K1/184 , H05K1/182 , H05K1/189 , H05K3/326 , H05K2201/0133 , H05K2201/09081 , H05K2201/091 , H05K2201/09981 , H05K2201/1059 , H05K2201/10636 , Y02P70/611

Abstract: An apparatus and method for providing three-dimensional carrier mounting of one or more electronic components. In accordance with one embodiment, the device mounting apparatus of the present invention includes an elastically resilient plastic substrate having component mounting surfaces in at least two dimensions. At least one press-fit component insertion cavity is disposed within the component mounting surfaces to provide compressive retention of the electronic component when press-fit into the cavity. Preferably, the cavity has a depth such that when the component is press-fit, it does not extend above the surface plane of the cavity. The insertion cavity is further characterized as including at least one conductive trace disposed on an inner surface of said insertion cavity and positioned on the insertion cavity surface such that the conductive trace contacts at least one lead of the electronic device retained within the insertion cavity.

Abstract translation: 一种用于提供一个或多个电子部件的三维载体安装的装置和方法。根据一个实施例，本发明的装置安装装置包括具有至少两个维度的部件安装表面的弹性弹性塑料基板。至少一个按压配合部件插入腔设置在部件安装表面内，以在压配合到腔中时提供电子部件的压缩保持。优选地，空腔具有这样的深度，使得当组件被压配合时，其不延伸到空腔的表面平面之上。插入腔的特征还在于包括设置在所述插入腔的内表面上并定位在插入腔表面上的至少一个导电迹线，使得导电迹线接触保持在插入腔内的电子器件的至少一个引线。

42.

发明授权
Heat selective electrically conductive polymer sheet 有权
Title translation: 热选择性导电聚合物片材

公开(公告)号：US07001658B2

公开(公告)日：2006-02-21

申请号：US10424666

申请日：2003-04-28

Applicant: Robert P. Bourdelais , Cheryl J. Kaminsky , John M. Pochan , James F. Elman

Inventor： Robert P. Bourdelais , Cheryl J. Kaminsky , John M. Pochan , James F. Elman

IPC: B32B3/20 , H01B13/00 , H02G3/04

CPC classification number: H05K3/107 , H05K2201/0129 , H05K2201/0329 , H05K2201/09045 , H05K2201/091 , H05K2203/0108 , H05K2203/0143 , Y10T428/24174 , Y10T428/24744

Abstract: Disclosed is an article comprising first areas of electrically conductive material and second areas of electrically conductive material raised relative to the first areas and substantially electrically isolated from the first areas, said conductive materials exhibiting a resistivity that averages less than 800 ohm/square.

Abstract translation: 公开了一种物品，其包括导电材料的第一区域和相对于第一区域凸起的第二导电材料区域，并且与第一区域基本上电隔离，所述导电材料具有平均小于800欧姆/平方的电阻率。

43.

发明申请
Printed wiring board and electric device using the same 有权
Title translation: 印刷电路板和使用其的电气设备

公开(公告)号：US20050237364A1

公开(公告)日：2005-10-27

申请号：US11113459

申请日：2005-04-25

Applicant: Hirosumi Ito

Inventor： Hirosumi Ito

IPC: B41J2/045 , B41J2/05 , B41J2/055 , B41J2/14 , B41J29/00 , H05K3/00 , H05K3/32 , H05K3/36 , H05K3/40

CPC classification number: H05K3/4007 , B41J2/14209 , B41J2002/14217 , B41J2002/14225 , B41J2002/14306 , B41J2002/14459 , B41J2002/14491 , H05K3/0058 , H05K3/321 , H05K3/361 , H05K3/365 , H05K2201/0133 , H05K2201/0367 , H05K2201/091 , H05K2201/10977 , H05K2203/0195

Abstract: There is disclosed a printed wiring board comprising: an electrically insulating flexible layer which has on one of its opposite sides a protrusion which forms a corresponding recess on the other side of the flexible layer; an electrically conducting layer formed on the protrusion; and a wire formed on the flexible layer, connected to the conducting layer, and extending in a direction. The conducting layer has a shape long in the direction of extension of the wire.

Abstract translation: 公开了一种印刷电路板，包括：电绝缘柔性层，其在其相对侧的一侧上具有在柔性层的另一侧上形成相应凹部的突起; 形成在所述突起上的导电层; 以及形成在柔性层上的导线，连接到导电层并沿一个方向延伸。导电层具有沿导线延伸方向长的形状。

44.

发明授权
Embedded electrical traces 失效
Title translation: 嵌入式电气痕迹

公开(公告)号：US06929849B2

公开(公告)日：2005-08-16

申请号：US10442396

申请日：2003-05-21

Applicant: David C. Koskenmaki , Michael N. Miller , Naiyong Jing

Inventor： David C. Koskenmaki , Michael N. Miller , Naiyong Jing

IPC: B32B7/02 , G02F1/1343 , G02F1/155 , H05B3/28 , H05B3/86 , H05K3/10 , H05K3/12 , H05K9/00 , B32B3/00 , H05K1/00

CPC classification number: H05B3/86 , G02F1/13439 , G02F1/155 , H05B3/286 , H05B2203/017 , H05K3/102 , H05K3/107 , H05K3/1258 , H05K2201/0133 , H05K2201/09036 , H05K2201/091 , H05K2201/09827 , H05K2203/0278 , H05K2203/1105 , Y10S428/901 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917

Abstract: A method for making a fine electrically conductive grid embedded in a polymer substrate. The method includes the steps of providing a polymer substrate, forming a pattern of grooves in the substrate, filling the grooves with electrically conductive powder, and then applying heat and/or pressure to the substrate. The application of heat and/or pressure to the substrate causes the grooves to collapse inward against the conductive powder. Collapsing the grooves compacts the conductive powder within the groove, thereby establishing a continuously conductive grid line or circuit. The narrow grid lines that result allow more light to transmit through the substrate. The method allows grid lines to be made with higher aspect ratios (ratio of line depth to line width) than is possible by previous methods.

Abstract translation: 一种制造嵌入聚合物基板中的精细导电栅格的方法。该方法包括以下步骤：提供聚合物基材，在基材中形成凹槽图案，用导电粉末填充凹槽，然后向基材施加热和/或压力。向衬底施加热和/或压力导致沟槽相对于导电粉末向内折叠。折叠凹槽压缩凹槽内的导电粉末，从而建立连续导电的栅格线或电路。导致的窄栅格线允许更多的光透过基板。该方法允许以比以前的方法可能的更高的纵横比（线深度与线宽的比率）制成网格线。

45.

发明授权
Device and method using a flexible circuit secured for reliably inter-connecting components therein in the presence of vibration events 失效

公开(公告)号：US06821130B2

公开(公告)日：2004-11-23

申请号：US10222160

申请日：2002-08-16

Applicant: Brooks H Danley

Inventor： Brooks H Danley

IPC: H01R1200

CPC classification number: H01F5/04 , H01R12/59 , H05K1/189 , H05K3/306 , H05K2201/091 , H05K2201/10568 , H05K2201/1059 , H05K2201/10598 , H05K2203/167

Abstract: Device and method including a generally flat and flexible circuit for electrically inter-connecting components therein are provided. The device includes a post including a recessed section configured to receive the flexible circuit through an opening in said circuit. The structures defining the opening in the flexible circuit may be configured to provide a snap-fit between the circuit and the recessed section of the post, and thus avoid undesirable movement of the flex circuit in the presence of vibration.

46.

发明授权
Process for mounting electronic device and semiconductor device 失效
Title translation: 电子器件和半导体器件的安装工艺

公开(公告)号：US06737741B2

公开(公告)日：2004-05-18

申请号：US10224504

申请日：2002-08-21

Applicant: Satoshi Imasu , Ikuo Yoshida , Tetsuya Hayashida , Akira Yamagiwa , Shinobu Takeura

Inventor： Satoshi Imasu , Ikuo Yoshida , Tetsuya Hayashida , Akira Yamagiwa , Shinobu Takeura

IPC: H01L2314

CPC classification number: H01L23/13 , H01L21/563 , H01L23/24 , H01L23/49811 , H01L23/5383 , H01L24/29 , H01L24/32 , H01L25/105 , H01L2224/0401 , H01L2224/05567 , H01L2224/05571 , H01L2224/05572 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/16237 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48599 , H01L2224/49 , H01L2224/49109 , H01L2224/73103 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/351 , H05K1/0271 , H05K1/111 , H05K1/112 , H05K3/4602 , H05K2201/0133 , H05K2201/091 , H05K2201/09472 , H05K2201/0949 , H05K2201/09536 , H05K2201/0959 , H05K2201/10674 , H05K2203/1581 , Y02P70/611 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2224/13111 , H01L2224/05552

Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.

Abstract translation: 一种电子设备，包括通过粘合剂固定到布线板的安装面的半导体芯片，其中外部端子通过凸块电极与布线板的电极焊盘电连接。在电极焊盘上形成凹部，在凹部中连接有电极焊盘和凸块电极。电极焊盘形成在软层的表面上，并且通过电极焊盘和软层的弹性变形形成凹部。

47.

发明授权
Methods of making microelectronic assemblies including compliant interfaces 失效
Title translation: 制造微电子组件的方法包括兼容接口

公开(公告)号：US06723584B2

公开(公告)日：2004-04-20

申请号：US10255297

申请日：2002-09-26

Applicant: Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith

Inventor： Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith

IPC: H01L2148

CPC classification number: H01L24/81 , H01L21/56 , H01L21/563 , H01L23/49811 , H01L23/49827 , H01L23/4985 , H01L24/72 , H01L24/75 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75301 , H01L2224/81801 , H01L2224/83136 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , Y10T29/4913 , Y10T29/49144 , Y10T29/49174 , H01L2924/00014

Abstract: A method of making a microelectronic assembly including a compliant interface includes providing a first support structure such as a flexible dielectric sheet having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. A platen is provided in engagement with a second surface of the first support structure. The first surface of a second support structure, such as a semiconductor wafer, is abutted against the porous layer and, after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may be at least partially cured.

Abstract translation: 制造包括柔性界面的微电子组件的方法包括提供第一支撑结构，例如在第一支撑结构的第一表面上具有第一表面和多孔弹性层的柔性电介质片，拉伸第一支撑结构并将将第一支撑结构拉伸成环结构。提供与第一支撑结构的第二表面接合的压板。第二支撑结构（例如半导体晶片）的第一表面抵靠多孔层，并且在邻接步骤之后，第一可固化液体设置在第一和第二支撑结构之间以及多孔层内。第一可固化液体可以至少部分固化。

48.

发明授权
Microelectronic assemblies with multiple leads 失效
Title translation: 具有多个引线的微电子组件

公开(公告)号：US06635553B1

公开(公告)日：2003-10-21

申请号：US09721048

申请日：2000-11-22

Applicant: Thomas H. DiStefano , John W. Smith

Inventor： Thomas H. DiStefano , John W. Smith

IPC: H01L2130

CPC classification number: H01L23/4985 , H01L21/4839 , H01L23/22 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/642 , H01L24/72 , H01L2224/16 , H01L2224/45124 , H01L2224/73253 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01066 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/351 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , Y10T29/49126 , Y10T29/49144 , Y10T29/49158 , H01L2924/00 , H01L2224/48

Abstract: A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.

Abstract translation: 微电子连接部件包括诸如具有沿着表面延伸的细长引线的电介质片的支撑件。引线具有永久地连接到支撑件的端部端部和可释放地连接到支撑件的尖端端部。支撑件与诸如半导体芯片或晶片的另外的元件并置，并且引线的尖端使用通过支撑件中的孔前进的焊接工具结合到晶片上的触点。在粘合之后，支撑件和另外的元件彼此远离，以使引线变形。