公开(公告)号：US20120030939A1

公开(公告)日：2012-02-09

申请号：US13317108

申请日：2011-10-11

Applicant: Yasunari Ooyabu ,  Jun Ishii ,  Kensuke Nishi

Inventor： Yasunari Ooyabu ,  Jun Ishii ,  Kensuke Nishi

IPC: H05K3/00

CPC classification number: H05K1/0269 ,  G11B5/486 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/163 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24331

Abstract: A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a terminal portion. An opening is formed in the insulating base layer to expose the metal foil.

公开(公告)号：US08110118B2

公开(公告)日：2012-02-07

申请号：US11874286

申请日：2007-10-18

Applicant: Hiroyuki Fujita ,  Yasutaka Ochiai ,  Minoru Kubota

Inventor： Hiroyuki Fujita ,  Yasutaka Ochiai ,  Minoru Kubota

IPC: H01B13/00

CPC classification number: H05K3/44 ,  H05K1/056 ,  H05K3/386 ,  H05K2201/09127 ,  H05K2201/0919 ,  H05K2203/063

Abstract: An adhesive layer, an insulating layer and a copper foil are laminated together on both surfaces of a metallic base material by way of for example thermal press molding. In this case, openings (window holes) are formed in opposed positions on a portion of the adhesive layer. A circuit pattern is formed by etching on the copper foil in this state, followed by an external shape machining step of executing separation treatment reaching the metallic base material in predetermined positions including the openings. After that, a part of the insulating layer is cut off along the edge of the opening to obtain a circuit board with the end of the metallic base material exposed.

Abstract translation: 粘合剂层，绝缘层和铜箔通过例如热压成型层叠在金属基材的两面上。 在这种情况下，在粘合剂层的一部分的相对位置上形成开口（窗孔）。 在该状态下通过对铜箔进行蚀刻而形成电路图案，接着进行外部形状加工步骤，在包括开口的预定位置执行到达金属基材的分离处理。 之后，绝缘层的一部分沿着开口的边缘被切除，以获得露出金属基材端部的电路板。

公开(公告)号：US20120022625A1

公开(公告)日：2012-01-26

申请号：US12899451

申请日：2010-10-06

Applicant: Robert J. Greenberg ,  Jerry Ok

Inventor： Robert J. Greenberg ,  Jerry Ok

IPC: A61N1/375

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  A61N1/3752 ,  H01L23/057 ,  H01L23/10 ,  H01L23/4985 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01079 ,  H01L2924/1461 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  H01L2924/00

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得的电子封装，其适于植入生物组织，例如用于视网膜或皮层电极阵列，以使视力恢复到 某些非目标人士。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20110297644A1

公开(公告)日：2011-12-08

申请号：US13091152

申请日：2011-04-21

Applicant: XUE-JUN CAI ,  ZHI-YONG LI

Inventor： XUE-JUN CAI ,  ZHI-YONG LI

IPC: H05K3/06

CPC classification number: H05K3/4697 ,  H05K2201/09127 ,  H05K2203/013 ,  H05K2203/308

Abstract: A method for manufacturing printed circuit board includes steps below. An inner substrate including a first electrically conductive layer is provided. A first electrically conductive pattern is formed in the first electrically conductive layer. The first electrically conductive pattern includes an exposed region and an attaching region. A protective layer is formed on the entire exposed region. A first adhesive layer and a second electrically conductive layer are laminated on a surface of the first electrically conductive pattern in the attaching region and a surface of the protective layer. A slit along a boundary of the exposed region passing through the second electrically conductive pattern and the first adhesive layer is defined. The second electrically conductive layer corresponding to the exposed region, the first adhesive layer corresponding to the exposed region and the protective layer is removed.

Abstract translation: 制造印刷电路板的方法包括以下步骤。 提供了包括第一导电层的内基板。 在第一导电层中形成第一导电图案。 第一导电图案包括曝光区域和附着区域。 在整个曝光区域上形成保护层。 第一粘合剂层和第二导电层层叠在附着区域中的第一导电图案的表面和保护层的表面上。 限定通过第二导电图案和第一粘合剂层的暴露区域的边界的狭缝。 对应于暴露区域的第二导电层，对应于暴露区域的第一粘合剂层和保护层被去除。

公开(公告)号：US20110283532A1

公开(公告)日：2011-11-24

申请号：US13195139

申请日：2011-08-01

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K3/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer.

Abstract translation: 柔性布线板包括：形成有导体图案的第一柔性基底材料，邻近第一柔性基底材料设置的第二柔性基底材料和覆盖第一柔性基底材料和第二柔性基底材料的绝缘层。 绝缘层暴露第一柔性基材的至少一部分。 在绝缘层上形成导体图案，并且在绝缘层上连接第一柔性基底材料的导体图形和导体图案的镀层。

公开(公告)号：US08059855B2

公开(公告)日：2011-11-15

申请号：US12356628

申请日：2009-01-21

Applicant: Susumu Yamagami

Inventor： Susumu Yamagami

IPC: H04R1/02

CPC classification number: H05K1/141 ,  H04N5/642 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09954 ,  H05K2201/10083 ,  H05K2201/10287

Abstract: A speaker device includes a speaker and a connecting component. The speaker has a pair of input terminals spaced apart with a first predetermined distance therebetween. The connecting component electrically couples the speaker to a printed circuit board. The connecting component has a relay-use printed circuit board and a pair of lead wires. The relay-use printed circuit includes a pair of sub-board portions and a separation portion. The sub-board portions have a pair of terminal holes. The input terminals of the speaker are disposed through the terminal holes, respectively. The separation portion is disposed between the sub-board portions to couple the sub-board portions with a second predetermined distance between the terminal holes of the sub-board portions, and selectively separate the sub-board portions when the first predetermined distance between the input terminals of the speaker is different from the second predetermined distance between the terminal holes of the sub-board portions.

Abstract translation: 扬声器装置包括扬声器和连接部件。 扬声器具有一对输入端子，其间隔开第一预定距离。 连接部件将扬声器电耦合到印刷电路板。 连接部件具有继电器用印刷电路板和一对引线。 继电器用印刷电路包括一对子板部分和分离部分。 子板部分具有一对端子孔。 扬声器的输入端分别设置在端子孔中。 分离部分设置在子板部分之间，以在子板部分的端子孔之间以第二预定距离耦合子板部分，并且当输入之间的第一预定距离时，选择性地分离子板部分 扬声器的端子与子板部分的端子孔之间的第二预定距离不同。

公开(公告)号：US20110272177A1

公开(公告)日：2011-11-10

申请号：US13145651

申请日：2010-01-22

Applicant: Günther Weichslberger ,  Johannes Stahr ,  Markus Leitgeb ,  Andreas Zluc ,  Gerald Weidinger

Inventor： Günther Weichslberger ,  Johannes Stahr ,  Markus Leitgeb ,  Andreas Zluc ,  Gerald Weidinger

IPC: H05K1/02 ,  C08L91/00 ,  H05K3/00

CPC classification number: H05K3/4688 ,  H05K1/0298 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4691 ,  H05K3/4697 ,  H05K2201/09127 ,  Y10T29/49124 ,  Y10T156/1066 ,  Y10T156/1195

Abstract: In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board (1) are provided.

Abstract translation: 在多层印刷电路板的制造方法中，多层印刷电路板由多个导电或不导电或不导电或绝缘层或层组成，以彼此连接，特别是被压在一起，其中至少部分平面的层至少连接 去除其部分区域（11），并且其中为了防止待除去的部分区域（11）的粘附，根据待除去的部分区域（9）施加防止粘附的材料（8）（9） ），其邻接待移除的部分区域，条件是防止粘附的材料（8）由包含基于至少一种金属皂的脱模剂的混合物形成，优选由Al，Mg的脂肪酸盐， Ca，Na和Zn，粘合剂和溶剂，由此在多层印刷电路板的适当处理和/或加工步骤之后，可以容易且可靠地除去待除去的部分区域。 另外，提供了一种防粘连材料和与制造多层印刷电路板（1）相关的方法的使用。

公开(公告)号：US07985618B2

公开(公告)日：2011-07-26

申请号：US13023185

申请日：2011-02-08

Applicant: Yun-Lung Tsai ,  Yu-Chieh Tsai ,  Chien-Chih Chen ,  Chien-Ping Huang

Inventor： Yun-Lung Tsai ,  Yu-Chieh Tsai ,  Chien-Chih Chen ,  Chien-Ping Huang

IPC: H01L21/00

CPC classification number: H01L25/18 ,  H01L21/565 ,  H01L23/04 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/15162 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K3/284 ,  H05K2201/09127 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.

公开(公告)号：US20110155421A1

公开(公告)日：2011-06-30

申请号：US12929902

申请日：2011-02-23

Applicant: Toshiki Naito ,  Tetsuya Ohsawa ,  Kouji Kataoka

Inventor： Toshiki Naito ,  Tetsuya Ohsawa ,  Kouji Kataoka

IPC: H05K1/00

CPC classification number: H05K1/0269 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/0969 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53022 ,  Y10T29/53026 ,  Y10T29/5303 ,  Y10T29/53035 ,  Y10T29/53039 ,  Y10T29/53043

Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.

公开(公告)号：US07942999B2

公开(公告)日：2011-05-17

申请号：US12196868

申请日：2008-08-22

Applicant: Chih-Ming Chang ,  Hsin-En Chung ,  Yu-Feng Tseng

Inventor： Chih-Ming Chang ,  Hsin-En Chung ,  Yu-Feng Tseng

IPC: B32B37/00 ,  B32B37/06

CPC classification number: B32B37/26 ,  B32B38/0004 ,  B32B2305/076 ,  B32B2310/0843 ,  B32B2457/08 ,  H05K3/28 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T29/49117

Abstract: A fabrication method of a rigid-flex circuit board is described as follows. Firstly, a flexible circuit board and at least a cover layer are provided. The cover layer covers a surface of the flexible circuit board. A protection layer is then formed on the cover layer. Next, a substrate is laminated to the surface of the flexible circuit board. The substrate has a conductive layer and a prepreg disposed between the conductive layer and the cover layer. The prepreg has an opening for accommodating the protection layer. Thereafter, the conductive layer is patterned for forming a patterned conductive layer. Afterwards, the protection layer is removed.

Abstract translation: 刚挠电路板的制造方法如下所述。 首先，提供柔性电路板和至少覆盖层。 覆盖层覆盖柔性电路板的表面。 然后在覆盖层上形成保护层。 接下来，将基板层压到柔性电路板的表面。 衬底具有导电层和设置在导电层和覆盖层之间的预浸料。 预浸料坯具有用于容纳保护层的开口。 此后，对导电层进行图案化以形成图案化的导电层。 之后，保护层被去除。