公开(公告)号：US20150113799A1

公开(公告)日：2015-04-30

申请号：US14566314

申请日：2014-12-10

Applicant: FUJITSU LIMITED

Inventor： Katsumi TAKADA ,  Kiyokazu MORIIZUMI ,  Masayuki ITOH

IPC: H05K13/04

CPC classification number: H05K1/0212 ,  H01L23/345 ,  H01L23/3735 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/32238 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/81444 ,  H01L2224/83444 ,  H01L2924/0001 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12041 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K3/22 ,  H05K3/3494 ,  H05K2201/09263 ,  H05K2203/1115 ,  H05K2203/176 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00

Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.

Abstract translation: 电子部件包括具有第一表面和第二表面的布线基板，安装在布线基板的第一表面侧上的电子部件主体，形成在布线基板的与第一表面相对的第二表面侧上的外部电极 表面侧，外部电极电连接到电子部件主体，具有导电性能并且具有比外部电极更高的电阻率的发热部件，以及设置在电子部件主体和发热部件之间的绝热层， 所述绝热层具有绝缘性，并且由与所述布线基板的其它材料不同的材料形成。

公开(公告)号：US08971006B2

公开(公告)日：2015-03-03

申请号：US13362562

申请日：2012-01-31

Applicant: Yuuki Mikami ,  Toru Itabashi ,  Takahiko Furuta ,  Ryoichi Shiraishi ,  Yusuke Takahashi ,  Hiroaki Nakamura ,  Shigeki Nishiyama

Inventor： Yuuki Mikami ,  Toru Itabashi ,  Takahiko Furuta ,  Ryoichi Shiraishi ,  Yusuke Takahashi ,  Hiroaki Nakamura ,  Shigeki Nishiyama

IPC: H01H85/08 ,  H01H85/10 ,  H02H5/04 ,  H05K1/02 ,  H01H85/046

CPC classification number: H02H5/047 ,  H01H85/046 ,  H01H85/08 ,  H01H85/10 ,  H05K1/0265 ,  H05K1/0293 ,  H05K2201/09263 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10181

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.

公开(公告)号：US20150042231A1

公开(公告)日：2015-02-12

申请号：US14484880

申请日：2014-09-12

Applicant: Michael A. Tischler ,  Philippe M. Schick ,  Paul Jungwirth ,  Calvin Wade Sheen

Inventor： Michael A. Tischler ,  Philippe M. Schick ,  Paul Jungwirth ,  Calvin Wade Sheen

IPC: H05B33/08

CPC classification number: H05B33/089 ,  F21K9/20 ,  H05B33/08 ,  H05B33/0821 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10174 ,  Y10T29/49002

Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.

Abstract translation: 根据某些实施例，包括多个功率串的照明系统具有促进对沿着每个功率线连接的一个或多个发光元件的故障进行补偿的元件。

公开(公告)号：US20140306014A1

公开(公告)日：2014-10-16

申请号：US14223242

申请日：2014-03-24

Applicant: Johnson Electric S.A.

Inventor： Vincent Daniel Jean Salle ,  Martin Wallace Edmonds

IPC: G06K19/02

CPC classification number: G06K19/02 ,  G06F21/86 ,  G08B13/2434 ,  H05K1/0275 ,  H05K1/0386 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/09445

Abstract: An electronic device is protected from unauthorized access by use of a security wrap having a security screen connected to an alarm circuit of the electronic device. The security screen has a pair of screen terminals interconnected by a conductor. The conductor is formed on a substrate. The substrate is arranged such that attempts to remove the security wrap will result in the substrate being torn and the conductor being damaged or broken whereby the resistance of the conductive path formed by the conductor changes to indicate an alarm condition.

Abstract translation: 通过使用具有连接到电子设备的报警电路的安全屏幕的安全保护装置来保护电子设备免受未经授权的访问。 安全屏幕具有通过导体互连的一对屏幕端子。 导体形成在基板上。 基板被布置成使得去除安全包裹的尝试将导致基板被撕裂并且导体被损坏或破坏，由此由导体形成的导电路径的电阻改变以指示报警状态。

公开(公告)号：US08861220B2

公开(公告)日：2014-10-14

申请号：US13381552

申请日：2010-06-29

Applicant: Thomas Löher ,  Andreas Ostmann ,  Manuel Seckel

Inventor： Thomas Löher ,  Andreas Ostmann ,  Manuel Seckel

IPC: H01R9/00 ,  H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H05K3/28 ,  A41D1/00

CPC classification number: H05K1/0283 ,  A41D1/005 ,  H05K1/038 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/09263 ,  Y10T29/49126 ,  Y10T29/49146

Abstract: The invention relates to a method for generating an electronic system for application to freeform surfaces, a method for producing freeform surfaces having an electronic system, and an electronic system and a combination of a freeform surface having at least one such system. According to the invention, an elastic interconnect device having an elastic substrate and an elastic, fanned-out contact structure with contact surfaces comprised of conductor lines is generated first. Then, electronic components are mounted on the interconnect device. Finally, the interconnect device is encapsulated. If a freeform surface with an electronic system is to be generated, the electronic system produced in this way is then mounted on the previously provided freeform surface.

Abstract translation: 本发明涉及一种用于产生用于自由形成表面的电子系统的方法，一种用于生产具有电子系统的自由曲面的方法，以及电子系统以及具有至少一个这样的系统的自由曲面的组合。 根据本发明，首先产生具有弹性基板和具有由导体线构成的接触表面的弹性的扇形接触结构的弹性互连装置。 然后，电子部件安装在互连装置上。 最后，互连器件被封装。 如果要产生具有电子系统的自由曲面，则以这种方式制造的电子系统然后安装在先前提供的自由曲面上。

公开(公告)号：US08860318B2

公开(公告)日：2014-10-14

申请号：US14036368

申请日：2013-09-25

Applicant: Michael A. Tischler ,  Philippe M. Schick ,  Paul Jungwirth ,  Calvin Wade Sheen

Inventor： Michael A. Tischler ,  Philippe M. Schick ,  Paul Jungwirth ,  Calvin Wade Sheen

IPC: H05B37/00 ,  H05B33/08 ,  F21K99/00

CPC classification number: H05B33/089 ,  F21K9/20 ,  H05B33/08 ,  H05B33/0821 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10174 ,  Y10T29/49002

Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.

公开(公告)号：US20140210463A1

公开(公告)日：2014-07-31

申请号：US14343143

申请日：2012-09-06

Applicant: Philippe Klein

Inventor： Philippe Klein

IPC: G01R19/00 ,  G01R33/00

CPC classification number: G01R19/0092 ,  G01R15/185 ,  G01R33/00 ,  G01R33/0052 ,  G01R33/04 ,  G01R33/045 ,  G01R33/05 ,  H01F38/30 ,  H01F2027/2809 ,  H05K1/0239 ,  H05K1/165 ,  H05K3/46 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/10151

Abstract: A printed circuit includes a hole, a stack, one or more first coils, a magnetic core, and a pad. The hole passes through the vertically through the board to receive a conducting wire. The stack comprises metallization layers vertically stacked and separated mechanically from one another by electrically insulating layers. The first coils fulfill functions of a measurement coil and of an excitation coil. Each first coil has turns wound solely around the magnetic core. The magnetic core forms a first magnetic ring surrounding the hole and extending horizontally between metallization layers. Each turn of each first coil is formed by two conducting tracks produced, respectively, in metallization layers situated above and below the first magnetic ring. The pad passes through an insulating layer and passes through an interior of the magnetic ring, electrically linking the two conducting tracks.

Abstract translation: 印刷电路包括孔，堆叠，一个或多个第一线圈，磁芯和衬垫。 孔穿过板垂直穿过，以接收导线。 堆叠包括垂直堆叠并通过电绝缘层彼此机械分离的金属化层。 第一线圈满足测量线圈和励磁线圈的功能。 每个第一线圈都绕着磁芯绕过卷绕。 磁芯形成围绕孔的第一磁环并且在金属化层之间水平延伸。 每个第一线圈的每一圈由分别在位于第一磁环上方和下方的金属化层中产生的两个导电轨道形成。 焊盘穿过绝缘层并穿过磁环的内部，电连接两个导电轨道。

公开(公告)号：US20140209942A1

公开(公告)日：2014-07-31

申请号：US14241187

申请日：2012-08-29

Applicant: Antonius Petrus Marinus Dingemans ,  Johannes Wilhelmus Weekamp ,  Sébastien Paul René Libon ,  Gerard Kums ,  Giovanni Cennini

Inventor： Antonius Petrus Marinus Dingemans ,  Johannes Wilhelmus Weekamp ,  Sébastien Paul René Libon ,  Gerard Kums ,  Giovanni Cennini

IPC: H01L27/15 ,  H01L33/62

CPC classification number: H05K3/303 ,  F21K9/90 ,  F21V21/002 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0283 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0058 ,  H05K3/0097 ,  H05K3/202 ,  H05K13/046 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2203/04 ,  H05K2203/1545 ,  H05K2203/175 ,  Y10T29/49144 ,  H01L2924/00

Abstract: There is provided a method for manufacturing a light emitting diode, LED, matrix (100) comprising the steps of providing with a maintained integrity a conductor sheet (150) with a plurality of component areas (111) interconnected with meandering connection tracks (116), mounting a plurality of LEDs (120) to a respective component area thereby forming a subassembly (100″), trimming and stretching the subassembly thereby straightening the connection tracks such that an m×n LED conductor matrix is formed during the step of stretching.

Abstract translation: 提供一种用于制造发光二极管，LED，矩阵（100）的方法，包括以下步骤：提供具有与曲折连接轨道（116）互连的多个部件区域（111）的导体片（150）的完整性， ，将多个LED（120）安装到相应的部件区域，从而形成子组件（100“），修整和拉伸子组件，从而校正连接轨道，使得在拉伸步骤期间形成m×n个LED导体矩阵。

公开(公告)号：US08779874B2

公开(公告)日：2014-07-15

申请号：US12457801

申请日：2009-06-22

Applicant: Hiroshi Toyao

Inventor： Hiroshi Toyao

IPC: H01P1/20

CPC classification number: H01P3/026 ,  H01P1/2005 ,  H01P1/2013 ,  H01P3/006 ,  H01P3/081 ,  H01P5/028 ,  H01P7/082 ,  H01Q9/04 ,  H05K1/0236 ,  H05K1/165 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/09309

Abstract: A waveguide structure or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes first and second conductive planes which are disposed in parallel with each other, a transmission line having an open end which is formed in a layer different from the first and second conductive planes and positioned to face the second conductive plane, and a conductive via electrically connecting the transmission line to the first conductive plane.

Abstract translation: 使用以一维方式或二维方式重复对准的多个单位结构形成波导结构或印刷电路板。 单元结构包括彼此平行设置的第一和第二导电平面，具有开口端的传输线，该开口端形成在与第一和第二导电平面不同的位置并且定位成面对第二导电平面，并且 通过将传输线电连接到第一导电平面而导电。

公开(公告)号：US20140184361A1

公开(公告)日：2014-07-03

申请号：US14196329

申请日：2014-03-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru KATO ,  Masahiro OZAWA

IPC: H01P3/08

CPC classification number: H01P3/082 ,  H01P3/08 ,  H05K1/0227 ,  H05K1/0253 ,  H05K2201/09263 ,  H05K2201/09618 ,  H05K2201/09727

Abstract: A dielectric element assembly includes a plurality of stacked dielectric sheets. A signal line is provided in or on the dielectric element assembly. A ground conductor is provided in or on the dielectric element assembly on the negative direction side of a z-axis direction relative to the signal line and is arranged so as to oppose the signal line via the dielectric sheets. The ground conductor includes a main body portion and protruding portions. The main body portion extends along the signal line on one side of a direction perpendicular or substantially perpendicular to the signal line relative to the signal line when viewed in plan from the z-axis direction. The protruding portions protrude from the main body portion toward the signal line and overlap the signal line when viewed in plan from the z-axis direction.

Abstract translation: 电介质元件组件包括多个堆叠的电介质片。 信号线设置在电介质元件组件中或其上。 接地导体设置在相对于信号线的z轴方向的负方向侧上的介质元件组件中或其上，并且布置成经由电介质片与信号线相对。 接地导体包括主体部分和突出部分。 当从z轴方向俯视时，主体部分沿着与信号线相垂直或基本垂直的方向的一侧沿信号线延伸。 突出部从主体部朝向信号线突出，并且在从z轴方向俯视时观察时与信号线重叠。