公开(公告)号：US20070094874A1

公开(公告)日：2007-05-03

申请号：US11642570

申请日：2006-12-20

Applicant: Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

Inventor： Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

IPC: H05K1/11

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

Abstract translation: 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板和延伸穿过该表面的多个孔。 还包括多个导电柱。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以提供另外的基底，使得每个柱的基部位于其表面上。 可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。 可选地，介电材料可以放置在基板和柱之间。

公开(公告)号：US20070035005A1

公开(公告)日：2007-02-15

申请号：US11200044

申请日：2005-08-10

Applicant: Paul Brown

Inventor： Paul Brown

IPC: H01L23/48

CPC classification number: H05K1/114 ,  H01L21/50 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/429 ,  H05K2201/09227 ,  H05K2201/09509 ,  H05K2201/097 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A printed circuit board (PCB) assembly having a plurality of circuit layers including outer layers and intervening layers with through-vias and micro-vias used to translate a portion of the signal connections of the grid, thereby creating a set of diagonal routing channels between the vias on internal layers of the board and a BGA package mounted on the printed circuit board.

Abstract translation: 一种具有多个电路层的印刷电路板（PCB）组件，其包括外层和具有通孔和微通孔的中间层，其用于平移网格的信号连接的一部分，由此产生一组对角线路由信道， 板上内部的通孔和安装在印刷电路板上的BGA封装。

公开(公告)号：US07145428B2

公开(公告)日：2006-12-05

申请号：US11034031

申请日：2005-01-12

Applicant: Chi-Tsung Chiu

Inventor： Chi-Tsung Chiu

IPC: H01F5/00

CPC classification number: H05K1/165 ,  H01F2017/002 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K2201/09645 ,  H05K2201/097 ,  H01L2924/00

Abstract: A circuit substrate includes an inductor element and a reference plane. The inductor element includes a first conductive column, a second conductive column, a first trace, and a second trace. The first and second conductive columns penetrate the circuit substrate from a first surface to a corresponding second surface. The first conductive includes a left conductive column and a right conductive column. The second conductive column is adjacent to one side of the first conductive column. The first trace electrically connects a first lower portion of the left conductive column and a second lower portion of the second conductive column. The second trace electrically connects a first upper portion of the right conductive column and a second upper portion of the second conductive column. The reference plane is disposed on the second surface. Accordingly, the magnetic line of force produced by the inductor element is parallel to the reference plane.

Abstract translation: 电路基板包括电感器元件和参考平面。 电感器元件包括第一导电柱，第二导电柱，第一轨迹和第二轨迹。 第一和第二导电柱从第一表面渗透到电路基板到相应的第二表面。 第一导电体包括左导电柱和右导电柱。 第二导电柱与第一导电柱的一侧相邻。 第一迹线电连接左导电柱的第一下部和第二导电柱的第二下部。 第二迹线电连接右导电柱的第一上部和第二导电柱的第二上部。 参考平面设置在第二表面上。 因此，由电感器元件产生的磁力线平行于参考平面。

公开(公告)号：US07111271B2

公开(公告)日：2006-09-19

申请号：US10281752

申请日：2002-10-28

Applicant: Yuan-Liang Li ,  David G. Figueroa

Inventor： Yuan-Liang Li ,  David G. Figueroa

IPC: G06F17/50 ,  H03K17/693

CPC classification number: H01F17/0033 ,  H01F41/041 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15312 ,  H05K1/115 ,  H05K1/165 ,  H05K3/06 ,  H05K3/42 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/1006 ,  H05K2203/0723 ,  H01L2224/0401

Abstract: A series of plated through hole (PTH) vias are interconnected by traces that alternate between a top surface and a bottom surface of a dielectric board. The PTH vias in the series can be positioned to create a collinear inductive filter, a coil-type inductive filter, or a transformer. Multiple, electrically isolated series of interconnected PTH vias can be used as a multi-phase inductive filter in one embodiment. In another embodiment, multiple series of interconnected PTH vias are electrically connected by a linking portion of conductive material, resulting in a low-resistance inductive filter. Ferromagnetic material patterns can be embedded in the dielectric board to enhance the inductive characteristics of the interconnected via structures. In one embodiment, a closed-end pattern is provided with two series of interconnected vias coiling around the pattern, resulting in an embedded transformer structure. A method of producing an interconnected series of PTH vias includes providing a dielectric board having a series of holes. In some embodiments, the board includes an embedded ferromagnetic material pattern. The holes and the top and bottom surface of the dielectric board have a conductive material thereupon. Portions of the conductive material are selectively removed, resulting in the embedded inductive filter and/or transformer structure.

Abstract translation: 一系列电镀通孔（PTH）通孔在电介质板的顶表面和底表面之间交替的迹线互连。 该系列中的PTH通孔可以定位成产生共线感应滤波器，线圈型感应滤波器或变压器。 在一个实施例中，多个电隔离的互连PTH通孔系列可用作多相感应滤波器。 在另一个实施例中，多个互连的PTH通孔系列通过导电材料的连接部分电连接，导致低电阻感应滤波器。 铁磁材料图案可以嵌入电介质板中以增强互连通孔结构的感应特性。 在一个实施例中，闭合端图案具有围绕图案卷绕的两系列互连的通孔，从而形成嵌入式变压器结构。 制造互连的PTH通孔系列的方法包括提供具有一系列孔的电介质板。 在一些实施例中，板包括嵌入的铁磁材料图案。 电介质板的孔和顶表面和底表面具有导电材料。 选择性地去除导电材料的部分，从而产生嵌入的感应滤波器和/或变压器结构。

公开(公告)号：US20060152662A1

公开(公告)日：2006-07-13

申请号：US11288749

申请日：2005-11-28

Applicant: Bing-Hoang Ko ,  Feng-Yi Chang ,  Chih-Wen Wu

Inventor： Bing-Hoang Ko ,  Feng-Yi Chang ,  Chih-Wen Wu

IPC: G02F1/1345

CPC classification number: H05K3/361 ,  G02F1/13452 ,  H05K1/117 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/09918

Abstract: An exemplary liquid crystal display device (200) includes a liquid crystal display panel (21), and a flexible printed circuit (2) joined to the liquid crystal display panel. The flexible printed circuit includes a substrate (20). The substrate includes a plurality of first conductive lines (210) and second conductive lines (230). The first conductive lines include a plurality of first patches (220). The second conductive lines include a plurality of second patches (240). The first patches are arranged side by side oppositely oriented relative to each other in alternating fashion. The second patches are arranged side by side oppositely oriented relative to each other in alternating fashion.

Abstract translation: 示例性液晶显示装置（200）包括液晶显示面板（21）和与液晶显示面板接合的柔性印刷电路（2）。 柔性印刷电路包括基板（20）。 衬底包括多个第一导线（210）和第二导线（230）。 第一导线包括多个第一贴片（220）。 第二导线包括多个第二贴片（240）。 第一贴片以交替的方式相对于彼此并排布置。 第二贴片以交替的方式相对于彼此相对定向并排布置。

公开(公告)号：US20060145805A1

公开(公告)日：2006-07-06

申请号：US11140680

申请日：2005-05-27

Applicant: Han Kim ,  Byoung Min ,  Young Kim ,  Young Lee ,  Chang Ryu

Inventor： Han Kim ,  Byoung Min ,  Young Kim ,  Young Lee ,  Chang Ryu

IPC: H01F5/00

CPC classification number: H01F5/00 ,  H01F17/0006 ,  H01F17/0033 ,  H01F2017/002 ,  H05K1/165 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/097

Abstract: A printed circuit board (PCB) having a three-dimensional spiral inductor, which includes a plurality of insulating layers and conductor layers. The PCB comprises a plurality of coil conductor patterns made of conductive material and shaped into strips, which is provided on the plurality of conductor layers, respectively, such that the plurality of coil conductor patterns are parallel to each other and positioned on the same plane perpendicular to the conductor layers, and in which each of the plurality of coil conductor patterns is longer than an adjacent inner coil conductor pattern.

Abstract translation: 一种具有三维螺旋电感器的印刷电路板（PCB），其包括多个绝缘层和导体层。 PCB包括由导电材料制成并成形为条的多个线圈导体图案，其分别设置在多个导体层上，使得多个线圈导体图案彼此平行并且位于同一平面上垂直 并且其中多个线圈导体图案中的每一个长于相邻的内部线圈导体图案。

公开(公告)号：US20050227665A1

公开(公告)日：2005-10-13

申请号：US10822377

申请日：2004-04-12

Applicant: Matthew Murray ,  Michael Townsend ,  Christian Lindqvist ,  Michael Wayland

Inventor： Matthew Murray ,  Michael Townsend ,  Christian Lindqvist ,  Michael Wayland

IPC: H04B15/00 ,  H05K1/02 ,  H04B1/00

CPC classification number: H04B15/00 ,  H05K1/0228 ,  H05K1/0245 ,  H05K2201/097

Abstract: A wireless communications device can include a power amplifier that is configured to transmit information to a wireless communications network during a first time interval and configured to avoid transmitting information during a second time interval. A circuit substrate is coupled to the power amplifier and a power source is configured to provide power to the power amplifier. First and second conductor are coupled to the power amplifier and to the power source, and have respective overlapping and non-overlapping portions on the circuit substrate.

Abstract translation: 无线通信设备可以包括功率放大器，其被配置为在第一时间间隔期间向无线通信网络发送信息，并且被配置为避免在第二时间间隔期间发送信息。 电路衬底耦合到功率放大器，并且电源被配置为向功率放大器提供电力。 第一和第二导体耦合到功率放大器和电源，并且在电路基板上具有相应的重叠和非重叠部分。

公开(公告)号：US06864776B2

公开(公告)日：2005-03-08

申请号：US10670687

申请日：2003-09-25

Applicant: Shigeru Osada

Inventor： Shigeru Osada

IPC: H04N5/50 ,  H01F5/00 ,  H01F17/00 ,  H05K1/16 ,  H05K3/22

CPC classification number: H05K1/165 ,  H01F5/003 ,  H01F17/0033 ,  H05K3/222 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/097 ,  H05K2201/10636 ,  H05K2203/171 ,  Y02P70/611

Abstract: In a coupling adjusting structure for a double-tuned circuit according to the present invention, first and second coils are configured such that a pair of first conductive patterns formed on a first surface of a printed circuit and a corresponding pair of second conductive patterns formed on a second surface of the printed circuit board are connected via corresponding connecting conductors, thereby making the first and second coils low and thin. Also, one end of the first coil and the corresponding end of the second coil are disposed close to each other, a first ground conductive pattern is disposed at least on the first surface of the printed circuit, and a first jumper connected to the first ground conductive pattern is disposed between the first and second coils so as to adjust an inductive coupling of the double-tuned circuit, thereby achieving a coupling adjusting structure for a double-tuned circuit whose inductive coupling is adjustable.

Abstract translation: 在根据本发明的用于双调谐电路的耦合调整结构中，第一和第二线圈被配置为使得形成在印刷电路的第一表面上的一对第一导电图案和形成在 印刷电路板的第二表面通过相应的连接导体连接，从而使第一和第二线圈变薄和薄。 此外，第一线圈的一端和第二线圈的对应端部彼此靠近设置，第一接地导体图案至少设置在印刷电路的第一表面上，并且第一跳线连接到第一接地 导电图案设置在第一和第二线圈之间，以便调整双调谐电路的电感耦合，从而实现用于电感耦合可调节的双调谐电路的耦合调节结构。

公开(公告)号：US06817002B2

公开(公告)日：2004-11-09

申请号：US10224102

申请日：2002-08-20

Applicant: Corey L. Larsen

Inventor： Corey L. Larsen

IPC: G06F1750

CPC classification number: H05K3/0097 ,  G11C5/04 ,  G11C5/063 ,  H05K1/0237 ,  H05K1/024 ,  H05K3/0052 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/097

Abstract: A method and apparatus are provided for compensating propagation delay in an electronic system relating to corresponding signals becoming skewed by variations in the dielectric materials over which the respective, corresponding signals travel. Compensation for the propagation delay is done by selecting printed circuit boards which each have one side comprised of a dielectric substrate material exhibiting a first dielectric constant and another side comprised of a dielectric substrate material exhibiting a second dielectric constant. By transmitting each of the corresponding signals across a side of a printed circuit board with a first dielectric constant and a side with a second dielectric constant, the signals are each delayed substantially the same by the effects of the dielectric constant, reducing the skew to zero. In specific application, the printed circuit boards are most easily matched by selecting printed circuit boards from a common printed circuit board panel or array.

Abstract translation: 提供了一种用于补偿电子系统中的传播延迟的方法和装置，其涉及由相应的相应信号传播的电介质材料的变化而变得倾斜的相应信号。 传播延迟的补偿通过选择印刷电路板进行，每个印刷电路板的一侧由表现出第一介电常数的电介质基片材料构成，另一面由表现出第二介电常数的电介质基片材料组成。 通过将印刷电路板的每个相对应的信号跨过印刷电路板的第一介电常数和具有第二介电常数的一侧，每个信号通过介电常数的影响而基本相同，从而将偏斜减小到零 。 在具体应用中，通过从通用印刷电路板面板或阵列中选择印刷电路板，印刷电路板最容易匹配。

公开(公告)号：US06784780B2

公开(公告)日：2004-08-31

申请号：US10217557

申请日：2002-08-13

Applicant: Shigeru Osada

Inventor： Shigeru Osada

IPC: H01F500

CPC classification number: H05K1/165 ,  H01F5/003 ,  H01F17/0033 ,  H05K3/222 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/097 ,  H05K2201/10636 ,  H05K2203/171 ,  Y02P70/611

Abstract: A coupling adjusting structure for a double-tuned circuit contains first and second coils that are configured such that a pair of first conductive patterns formed on a first surface of a printed circuit and a corresponding pair of second conductive patterns formed on a second surface of the printed circuit board are connected via corresponding connecting conductors. One end of the first coil and the corresponding end of the second coil are disposed close to each other. A first ground conductive pattern is disposed at least on the first surface of the printed circuit. A first jumper connected to the first ground conductive pattern is disposed between the first and second coils to adjust an inductive coupling of the double-tuned circuit.

Abstract translation: 用于双调谐电路的耦合调节结构包括第一和第二线圈，其被配置为使得形成在印刷电路的第一表面上的一对第一导电图案和形成在第二表面的相应的一对第二导电图案 印刷电路板通过相应的连接导体连接。 第一线圈的一端和第二线圈的对应端部彼此靠近地设置。 第一接地导电图案至少设置在印刷电路的第一表面上。 连接到第一接地导电图案的第一跨接件设置在第一和第二线圈之间，以调整双调谐电路的电感耦合。