公开(公告)号：US20140217455A1

公开(公告)日：2014-08-07

申请号：US14025228

申请日：2013-09-12

Applicant: Toshiba Lighting & Technology Corporation

Inventor： Takuya Honma

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/341 ,  H05K3/3421 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/1031 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: According to one embodiment, a light-emitting device includes a ceramic substrate, a light-emitting element, a metal layer, a metal connector and a joint member. The ceramic substrate includes a main surface. The light-emitting element is provided on the main surface. The metal layer is provided on the main surface and is electrically connected to the light-emitting element. The metal connector includes a connector part and an extension part extending from the connector part. The joint member joins at least a part of the extension part to the metal layer. An angle between a lower portion of a side surface of the joint member on the connector part side and a lower surface of the joint member in contact with the metal layer is 90 degrees or less. A portion of the extension part on an opposite side to the connector part is partly covered with the joint member.

Abstract translation: 根据一个实施例，发光器件包括陶瓷衬底，发光元件，金属层，金属连接器和接头构件。 陶瓷基板包括主表面。 发光元件设置在主表面上。 金属层设置在主表面上并与发光元件电连接。 金属连接器包括连接器部分和从连接器部分延伸的延伸部分。 接合构件将延伸部分的至少一部分连接到金属层。 连接器部分侧的接合部件的侧面的下部与接触部件的与金属层接触的下表面之间的角度为90度以下。 延伸部分与连接器部分相对的一部分部分地被接合部件覆盖。

公开(公告)号：US08692136B2

公开(公告)日：2014-04-08

申请号：US12926802

申请日：2010-12-09

Applicant: Kwang Jae Oh ,  Joo Yong Kim ,  Yoon Hyuck Choi ,  Bong Gyun Kim

Inventor： Kwang Jae Oh ,  Joo Yong Kim ,  Yoon Hyuck Choi ,  Bong Gyun Kim

IPC: H05K1/11

CPC classification number: G01R3/00 ,  G01R1/07378 ,  H05K1/0292 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/107 ,  H05K3/225 ,  H05K3/4629 ,  H05K2201/0979 ,  H05K2201/10378 ,  H05K2203/173

Abstract: There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.

Abstract translation: 提供了一种修复探针卡和修理的探针板的方法。 修补探针卡的方法包括：在由具有设置在彼此相对的位置的第一和第二柱面的烧结陶瓷构成的板主体中，准备板主体，其包括多个主通道，用于电连接形成的第一焊盘 在第一柱面上，形成在第二柱面上的第二焊盘，以及设置成邻近主通道的保留通道，以修复损坏的主通道; 当主渠道受损时; 去除在主通道和预留通道中形成的第一和第二焊盘; 通过在损坏的主通道和与主通道相邻的预留通道之间部分地去除板来形成空腔; 以及在空腔中形成修复连接部分，以便将损坏的主通道电连接到与其相邻的预留通道。

公开(公告)号：US20140002370A1

公开(公告)日：2014-01-02

申请号：US13536201

申请日：2012-06-28

Applicant: Aaron B. Konvisser ,  Mohammad Ali Mockarram-Dorri ,  Pasi Laine

Inventor： Aaron B. Konvisser ,  Mohammad Ali Mockarram-Dorri ,  Pasi Laine

IPC: H05K1/02 ,  G06F3/041 ,  H05K3/30 ,  H05K1/09

CPC classification number: H05K1/09 ,  G06F1/1626 ,  G06F1/1656 ,  G06F3/041 ,  G06F2203/04102 ,  G06F2203/04103 ,  H04M1/0202 ,  H04M2250/22 ,  H05K1/028 ,  H05K2201/0326 ,  H05K2201/0391 ,  H05K2201/0979 ,  Y10T29/4913

Abstract: An apparatus including a substrate; at least one conductive path extending over the substrate and including a first portion of indium tin oxide connected in electrical series to a second portion of a different conductor.

Abstract translation: 一种包括基板的设备; 至少一个导电路径，其延伸在所述衬底上并且包括以电串联连接到不同导体的第二部分的氧化铟锡的第一部分。

公开(公告)号：US08471767B2

公开(公告)日：2013-06-25

申请号：US12507290

申请日：2009-07-22

Applicant: Akihiro Satomi

Inventor： Akihiro Satomi

IPC: H01Q1/38

CPC classification number: H01P1/047 ,  H05K1/0251 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/429 ,  H05K2201/0979 ,  H05K2203/0207 ,  H05K2203/175 ,  Y10T156/1052

Abstract: A radio frequency multilayer substrate which has a connection portion connecting a strip line and a microstrip line, of which connection portion improves VSWR, is provided. The high frequency multilayer substrate has a through-hole which electrically connects a central conductor of the strip line and a central conductor of the microstrip line. The high frequency multilayer substrate also has an insulating hole which does not have a conductor inside. The through-hole is connected with the insulating hole. A length of the conductor layer of the through-hole from the central conductor to an insulating hole is smaller than one half the distance from the central conductor to a 2nd ground conductor. The insulating hole can be formed by cutting the through-hole.

Abstract translation: 提供一种具有连接带状线和连接部分提高VSWR的微带线的连接部的射频多层基板。 高频多层基板具有将带状线的中心导体与微带线的中心导体电连接的通孔。 高频多层基板也具有内部没有导体的绝缘孔。 通孔与绝缘孔连接。 从中心导体到绝缘孔的通孔的导体层的长度小于从中心导体到第二接地导体的距离的一半。 绝缘孔可以通过切割通孔形成。

公开(公告)号：US08451615B2

公开(公告)日：2013-05-28

申请号：US13087488

申请日：2011-04-15

Applicant: Tsung-Sheng Huang ,  Chun-Jen Chen ,  Duen-Yi Ho ,  Wei-Chieh Chou

Inventor： Tsung-Sheng Huang ,  Chun-Jen Chen ,  Duen-Yi Ho ,  Wei-Chieh Chou

IPC: H05K7/00

CPC classification number: H05K7/00 ,  H05K1/0201 ,  H05K1/0265 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/0979

Abstract: A printed circuit board includes a top layer and a bottom layer. A power supply and an electronic component are located on the top layer. The power supply is connected to the top layer and the bottom layer through a first via. A number of second vias extends through the top layer and the bottom layer, and is electrically connected to the top layer and the bottom layer. A right-angled triangular void area without vias defined therein is formed on the printed circuit board, between the second vias and the electronic component. The second vias are arranged on a hypotenuse of the void area.

Abstract translation: 印刷电路板包括顶层和底层。 电源和电子元件位于顶层。 电源通过第一通孔连接到顶层和底层。 多个第二通孔延伸穿过顶层和底层，并且电连接到顶层和底层。 在印刷电路板上，在第二通孔和电子部件之间形成没有限定在其中的通孔的直角三角形空隙区域。 第二个通孔布置在空隙区域的斜边上。

公开(公告)号：US20130043061A1

公开(公告)日：2013-02-21

申请号：US13411650

申请日：2012-03-05

Applicant: Wen-Fu Huang ,  Shih-Ching Chen ,  Chen-Hui Cheng ,  Meng-Hsueh Wu

Inventor： Wen-Fu Huang ,  Shih-Ching Chen ,  Chen-Hui Cheng ,  Meng-Hsueh Wu

IPC: H05K1/00 ,  H05K3/12

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K2201/0979 ,  Y10T29/49155

Abstract: The present disclosure related to circuit structure of an electronic device, wherein the circuit structure comprises of a main line formed on a substrate; and at least an auxiliary line electrically connected to the main line to form a conductive return circuit used for a signal to pass through the auxiliary line when the main line is disconnected. Addition of the auxiliary line avoids any breaking of signal transmission due to partial disconnection of the main line. The present disclosure also relates to a method for manufacturing the circuit structure, wherein the method simplifies the manufacturing process and also reduces the rate of deformation or disconnection of lines.

Abstract translation: 本公开涉及电子设备的电路结构，其中电路结构包括形成在基板上的主线; 以及至少一个辅助线路，其电连接到所述主线路，以形成当所述主线路断开时用于信号通过所述辅助线路的导电返回电路。 辅助线路的添加可避免由于主线部分断开导致信号传输的任何破坏。 本公开还涉及一种用于制造电路结构的方法，其中该方法简化了制造过程并且还降低了线的变形或断开的速率。

公开(公告)号：US20120241207A1

公开(公告)日：2012-09-27

申请号：US13097104

申请日：2011-04-29

Applicant: TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

Inventor： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

IPC: H05K1/11

CPC classification number: H05K1/025 ,  H05K1/0265 ,  H05K3/429 ,  H05K2201/0979

Abstract: A printed circuit board (PCB) includes first to fourth layers. A power supply is arranged on the first layer. An electronic component is arranged on the fourth layer. A first via and a second via extend through the PCB and are electrically connected to the electronic component. The PCB further includes third to seventh vias. A length of a transmission path of the current flows from the power supply to electronic component through the third via and the seventh via is almost the same as a length of a transmission path of the current flows from the power supply to the electronic component through the fourth to sixth vias.

Abstract translation: 印刷电路板（PCB）包括第一至第四层。 电源设置在第一层上。 电子部件布置在第四层上。 第一通孔和第二通孔延伸穿过PCB并且电连接到电子部件。 PCB还包括第三至第七个通孔。 通过第三通孔和第七通孔从电源流向电子部件的电流的传输路径的长度与电流从电源流向电子部件的传输路径的长度几乎相同 第四至第六个通道。

公开(公告)号：US08274634B2

公开(公告)日：2012-09-25

申请号：US12485624

申请日：2009-06-16

Applicant: Harutoshi Oikawa ,  Kiyohiro Kimura

Inventor： Harutoshi Oikawa ,  Kiyohiro Kimura

IPC: G02F1/1345

CPC classification number: H05K3/361 ,  G06F3/045 ,  H05K3/281 ,  H05K3/323 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/097 ,  H05K2201/0979 ,  H05K2203/1572

Abstract: A flexible printed circuit includes: a first wiring layer and a second wiring layer being in contact with one surface of a flexible substrate, a third wiring layer and a fourth wiring layer on the other surface of the flexible substrate, a first conductive member being formed on surfaces in proximity to a through hole of the second wiring layer and the fourth wiring layer; a second conductive member being formed on surfaces in proximity to the first end section of the first wiring layer and the third wiring layer; and an insulating layer being formed in a space between the first wiring layer and the second conductive member, and the second wiring layer and the first conductive member and a space between the third wiring layer and the second conductive member, and the fourth wiring layer and the first conductive member.

Abstract translation: 柔性印刷电路包括：第一布线层和与柔性基板的一个表面接触的第二布线层，在柔性基板的另一个表面上的第三布线层和第四布线层，形成第一导电部件 在第二布线层和第四布线层的通孔附近的表面上; 第二导电构件形成在靠近第一布线层和第三布线层的第一端部的表面上; 以及在所述第一布线层和所述第二导电构件之间的空间中形成绝缘层，以及所述第二布线层和所述第一导电构件以及所述第三布线层和所述第二导电构件之间的空间，以及所述第四布线层和 第一导电构件。

公开(公告)号：US08158890B1

公开(公告)日：2012-04-17

申请号：US12034353

申请日：2008-02-20

Applicant: Li-Tien Chang

Inventor： Li-Tien Chang

IPC: H05K1/11

CPC classification number: H05K1/0231 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0224 ,  H05K1/162 ,  H05K2201/093 ,  H05K2201/097 ,  H05K2201/0979 ,  H01L2924/00

Abstract: Provided is an interleaved or wavy spatial arrangement of the micro-vias providing the electrical pathways for the power and ground leads are described. The spatial arrangement increases the coupling pairs between power and ground vias or leads. This spatial arrangement is maintained even as the micro-vias transition across a plane from a direction of travel. Thus, the charge from the decoupling capacitor is able to more efficiently be delivered as the inductances are minimized through this design.

Abstract translation: 提供了提供用于电源和接地引线的电路径的微通孔的交错或波浪空间布置。 空间布置增加了电源和接地通孔或引线之间的耦合对。 即使微通孔从行进方向跨过平面过渡，也保持这种空间布置。 因此，通过该设计，通过使电感最小化，来自去耦电容器的电荷能够更有效地传递。

公开(公告)号：US20120080713A1

公开(公告)日：2012-04-05

申请号：US13242329

申请日：2011-09-23

Applicant: Makoto AGATANI ,  Toshio HATA ,  Tomokazu NADA ,  Shinya ISHIZAKI

Inventor： Makoto AGATANI ,  Toshio HATA ,  Tomokazu NADA ,  Shinya ISHIZAKI

IPC: H01L33/62

CPC classification number: H01L25/0753 ,  F21K9/00 ,  F21K9/232 ,  F21V23/06 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/01327 ,  H01L2933/0066 ,  H05K1/11 ,  H05K2201/0391 ,  H05K2201/094 ,  H05K2201/0979 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.

Abstract translation: 一种能够确保发光元件和电极之间的电连接而不会在实际使用中产生任何问题的发光装置，通过两种连接方法与焊料和连接器，以及设置有发光装置的照明装置 被提供。 根据本发明的发光装置在陶瓷基板上具有多个LED芯片，以及焊接电极焊盘和与芯片电连接的连接器连接电极焊盘。 焊接电极焊盘由具有防止向焊料扩散的功能的第一导电材料形成，并且连接器连接电极焊盘由具有防止氧化功能的第二导电材料形成。