Printed circuit, backlight unit and display device

    公开(公告)号:US11762238B2

    公开(公告)日:2023-09-19

    申请号:US17497463

    申请日:2021-10-08

    Abstract: Embodiments of the present disclosure relate to a printed circuit, a backlight unit, and a display device. The printed circuit on which a light source is mounted can be easily manufactured in a single form, by depositing and arranging a wiring layer on a substrate and mounting the light source on the wiring layer. Further, the printed circuit is arranged so that the wiring layer includes a plurality of bonding metal layers and a plurality of wiring metal layers, and a part of the bonding metal layer positioned between the plurality of wiring metal layers and disposed in an area overlapping a pad portion of the light source is removed. Therefore, even though the main metal layer of the wiring layer is removed during reworking, it is possible to provide the printed circuit capable of electrically connecting to the light source by the sub-metal layer of the wiring layer.

    Cable assembly providing extended LED interface

    公开(公告)号:US11758680B2

    公开(公告)日:2023-09-12

    申请号:US17457729

    申请日:2021-12-06

    Abstract: An electronic cable system operates as an extension cable to facilitate external viewing of internal infrastructure LED status. A wired cable is provided having a first end and a second end, the first end including a first I/O coupler, LED detectors and a power jack; and the second end including a second I/O coupler and a plurality of LEDs. The plurality of LEDs of the second end illuminate in response to activation of the LED detector of the first end. The first I/O coupler may plug into an internal module of electronic infrastructure, such as a server, to detect operational status of the internal module via the LED detectors. The second I/O coupler may couple to infrastructure housing, permitting the plurality of LEDs to be viewed externally of the housing. The plurality of external LEDs on the infrastructure housing mimic internal (non-viewable) status indicator LEDs of the internal module.

    LED chip insert, lighting device, lighting module, and method of manufacturing the lighting device

    公开(公告)号:US11716815B2

    公开(公告)日:2023-08-01

    申请号:US17759348

    申请日:2021-01-20

    Applicant: OSRAM GmbH

    CPC classification number: H05K1/184 H05K2201/10106

    Abstract: In an embodiment a LED chip insert for a printed circuit board includes a lead frame in which a number of electrically conductive strings with respective ends are formed by punching, the strings having support surfaces which are configured for mounting on the printed circuit board and which form a common plane, wherein the lead frame has a region formed as a recess with respect to the ends, an injection molded frame including an electrically insulating material and annularly surrounding a surface of the lead frame exposed within the region formed as the recess facing the ends of the strings, and thereby effecting an overall trough-like structure; and at least one LED chip which is placed in the region formed as the recess and has a first electrical contact terminal and a second electrical contact terminal, the first electrical contact terminal being electrically conductively connected to a first one of the strings and the second electrical contact terminal being electrically conductively connected to a second one of the strings.

    PLUG-IN MODULES AND PLUG-IN MODULE SYSTEMS (As Amended)

    公开(公告)号:US20190252819A1

    公开(公告)日:2019-08-15

    申请号:US16317882

    申请日:2017-08-01

    Abstract: The object of the invention is to provide a plug-in module System for constructing different plug-in module circuit boards from couplable plug-in modules for light-emitting diodes which are to be plugged onto the circuit board top side for example. The plug-in modules can be connected to the housing outer sides for forming the circuit boards from longitudinal circuit board rows by means of lateral longitudinal recesses and grid ribs, wherein, in each case one upper guide bore with an electrical voltage contact-making means, for example for a common plug-in diode bridge, is applied to the top sides of two adjacent plug-in modules in a laterally adjacent manner, and for forming additional perpendicular circuit board rows in each case contact-making means and plug-in connections of the contacts of the circuit board longitudinal rows on the front side with a projecting end section of a contact spring strip with corresponding contact-making means of the plug-in modules of the perpendicular circuit board rows, further on their housing rear sides an opening housing outlet with openings of the guide bores for mating the contact spring strips with the contact spring end section of the rear plug-in module. The plug modules therefore have two guide bores with a contact spring strip which widens from the top side to the front side over two contacts, a common wide front opening of the guide bores and a latching structure on the outer sides. Furthermore, latching and plug-in sections for contact spring strips which are situated one behind the other on the housing rear sides when mating in perpendicular longitudinal circuit board rows as conductor strips for voltage connection.

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