公开(公告)号：US09913375B2

公开(公告)日：2018-03-06

申请号：US15276073

申请日：2016-09-26

Applicant: International Business Machines Corporation

Inventor： Ai Kiar Ang ,  Michael Lauri

IPC: H01L23/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K1/14 ,  H01L23/495 ,  H01L25/10 ,  H01L25/00 ,  H01L21/48 ,  H05K1/03

CPC classification number: H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US09844146B2

公开(公告)日：2017-12-12

申请号：US15152218

申请日：2016-05-11

Applicant: Flextronics Automotive GmbH & Co. KG

Inventor： Peter Lutz ,  Kevin Buermann

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/189 ,  H05K3/288 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/05 ,  H05K2201/0929 ,  H05K2201/10037 ,  H05K2201/10227 ,  H05K2201/1031 ,  H05K2201/10931 ,  H05K2203/0278 ,  H05K2203/04 ,  H05K2203/16

Abstract: The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.

公开(公告)号：US20170207010A1

公开(公告)日：2017-07-20

申请号：US15410409

申请日：2017-01-19

Applicant: Fluke Corporation

Inventor： Mark Steven BUCKNER ,  Steven Wayne HIGGINS ,  Donald A. GESSLING ,  Bryan Charles HOOG ,  Michael A. SCHOCH

IPC: H01C13/02 ,  H05K1/18

CPC classification number: H01C13/02 ,  H01C1/01 ,  H01C1/082 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10022 ,  H05K2201/10227 ,  H05K2201/10409 ,  H05K2201/10583 ,  H05K2201/10606

Abstract: A resistor support assembly includes first, second, third, and fourth support members. Each of the first and second support members includes one or more resistor contact regions and apertures extending therethrough. Each third support member is at least partially disposed within one of the apertures of one of the first support members and one of the apertures of one of the second support members. Recesses may be formed in the resistor contact regions of the first and the second support members, and one or more load resistors may be at least partially disposed within the recesses. The resistor support assembly may be used to mount one or more load resistors to a printed circuit board, without obstructing airflow through hollow portions of the load resistors. To reduce parasitic capacitance and inductance, the first support members and the second support members are formed from non-conductive materials.

公开(公告)号：US20170171969A1

公开(公告)日：2017-06-15

申请号：US15373573

申请日：2016-12-09

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki TANABE ,  Naohiro TERADA ,  Yuu SUGIMOTO ,  Daisuke YAMAUCHI

IPC: H05K1/05 ,  G11B5/48 ,  H05K1/11 ,  H05K3/40 ,  H05K3/44

CPC classification number: H05K1/05 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/0278 ,  H05K1/0393 ,  H05K1/11 ,  H05K1/18 ,  H05K3/4007 ,  H05K3/44 ,  H05K2201/10227

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

公开(公告)号：US20160284633A1

公开(公告)日：2016-09-29

申请号：US15174208

申请日：2016-06-06

Applicant: International Business Machines Corporation

Inventor： Ai Kiar Ang ,  Michael Lauri

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.