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    SYSTEM PROVIDED WITH A SOLDER JOINT
    41.
    发明申请
    SYSTEM PROVIDED WITH A SOLDER JOINT 审中-公开
    系统提供一个焊接点

    公开(公告)号：US20130264102A1

    公开(公告)日：2013-10-10

    申请号：US13851544

    申请日：2013-03-27

    Applicant: TELLABS OY

    Inventor： Antti HOLMA ,  Jari-Pekka LAIHONEN

    IPC: H05K1/11 ,  H05K13/04 ,  H05K1/02

    CPC classification number: H05K1/11 ,  H05K1/0201 ,  H05K3/3447 ,  H05K13/04 ,  H05K2201/09781 ,  H05K2201/10303 ,  H05K2201/10765 ,  H05K2201/10856 ,  H05K2203/044

    Abstract: A system provided with a solder joint includes: a circuit board (101) provided with an aperture (102), an electrical component (103) including a conductor foot (104) protruding through the aperture, and soldering metal (105) inside the aperture and in contact with the conductor foot. The system further includes a thermal conductor element (106) including a first portion outside the aperture and a second portion inside the aperture and in contact with the soldering metal. The thermal conductor element is capable of conducting heat and thereby it intensifies the heat transfer into the aperture during pre-heating which precedes the process phase when the molten soldering metal is enabled to be absorbed into the aperture. Thus the reliability of the solder joint is improved, i.e. a risk of a faulty “cold” solder is decreased.

    Abstract translation: 设置有焊接接头的系统包括：设置有孔（102）的电路板（101），包括突出穿过孔的导体脚（104）的电气部件（103）和孔内的焊接金属（105） 并与导体脚接触。 该系统还包括热导体元件（106），其包括孔外部的第一部分和孔内的第二部分并与焊接金属接触。 热导体元件能够传导热量，从而当熔融焊接金属能够被吸收到孔中时，其在预加热之前加热到加工阶段之前的热传递。 因此，提高了焊点的可靠性，即，存在故障“冷”焊料的风险降低。

    Compression Connector
    42.
    发明申请
    Compression Connector 审中-公开
    压缩连接器

    公开(公告)号：US20090239396A1

    公开(公告)日：2009-09-24

    申请号：US12224974

    申请日：2007-01-29

    Applicant: Koon Poh Tay ,  Kiat Hup Joey Ng ,  Yoke Pheng Louis Ng

    Inventor： Koon Poh Tay ,  Kiat Hup Joey Ng ,  Yoke Pheng Louis Ng

    IPC: H01R12/00

    CPC classification number: H01R12/585 ,  H01R4/28 ,  H01R12/57 ,  H05K3/308 ,  H05K2201/10765

    Abstract: A compression connector, a terminal for a compression connector and an assembly including a compression connector and a PCB. The compression connector including a housing; one or more terminals disposed in the housing; each terminal including a substantially U-shaped contact portion protruding above a surface level of the housing with a close end of the substantially U-shaped contact portion facing away from the housing, the substantially U shaped contact portion including a first leg connected to a main body of said each terminal and a second leg having a free end, the free end being disposed substantially at or below the surface level of the housing; wherein the first and second legs are angled with respect to each other in a quiescent state and such that the first and second legs are substantially parallel to each other in a contact state where the substantially U-shaped contact portion resiliently engages a contact through-hole of a PCB.

    Abstract translation: 压缩连接器，用于压缩连接器的端子和包括压缩连接器和PCB的组件。 压缩连接器包括壳体; 设置在壳体中的一个或多个端子; 每个端子包括基本上U形的接触部分，突出在壳体的表面水平面上方，大致U形接触部分的远离壳体的近端，大致U形的接触部分包括连接到主体的第一腿部 所述每个端子的本体和具有自由端的第二腿部，所述自由端基本上设置在所述壳体的表面水平面以下; 其中所述第一和第二腿在静止状态下相对于彼此成角度，并且使得所述第一和第二腿在接触状态下基本上彼此平行，其中所述大致U形的接触部分弹性地接合接触通孔 的PCB。

    Surface mount package for long lead devices
    44.
    发明授权
    Surface mount package for long lead devices 有权
    用于长引线器件的表面贴装封装

    公开(公告)号：US06423906B2

    公开(公告)日：2002-07-23

    申请号：US09949558

    申请日：2001-09-10

    Applicant: Bily Wang

    Inventor： Bily Wang

    IPC: H01R1204

    CPC classification number: H05K1/141 ,  H05K3/301 ,  H05K3/3442 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10651 ,  H05K2201/10666 ,  H05K2201/10765

    Abstract: Via holes are plated through the substrate of a surface mount package. The leads of an electronic device is inserted in the plated-through via holes. The bottom of the plated through metal is enlarged as pads to provide reliable soldering surfaces to a motherboard. Upon heating the leads are soldered to the walls of the plated through via holes. Alternatively, the leads can be folded before inserting into the plated-through via holes.

    Abstract translation: 通孔穿过表面安装封装的基板。 电子装置的引线插入到电镀通孔中。 电镀金属的底部被扩大为焊盘，以向主板提供可靠的焊接表面。 在加热时，引线被焊接到镀通孔的壁上。 或者，引线可以在插入电镀通孔之前折叠。

    Electrical capacitor with non-inductive leads
    47.
    发明授权
    Electrical capacitor with non-inductive leads 失效
    具有非电导率的电容器

    公开(公告)号：US3806770A

    公开(公告)日：1974-04-23

    申请号：US33441873

    申请日：1973-02-21

    Applicant: MALLORY & CO INC P R

    Inventor： VOYLES G ,  DEAK P

    IPC: H01C1/14 ,  H01G4/228 ,  H01G4/236 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H01G9/00 ,  H01G1/14

    CPC classification number: H01G4/228 ,  H01G4/224 ,  H05K1/0231 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/0792 ,  H05K2201/0979 ,  H05K2201/10454 ,  H05K2201/10765 ,  Y10T29/42

    Abstract: An electrical component means and method of making same. The component means includes an electrical component body such as a capacitor body and continuous terminal means, preferably Ushaped, with portions immediately adjacent one side of the component body joined to that side of the component body. Lead means of the continuous terminal means, preferably a pair of spaced and parallel elongated wires of the U-shaped terminal means, project from the component body in the same direction. Each of the lead means is adapted to project through and is adapted to be secured against movement relative to apertures of an electrically insulating base means. The configuration of the terminal means and intimate engagement thereof along the entire length of each immediately adjacent side of the component body cooperate to help reduce the impedance of the electrical component means at elevated frequencies. If high frequency operation is not a consideration, the lead wires of the terminal means may be inserted through apertures of a support means and twisted together on a side of the support means opposite the side of the support means adjacent the base means of the component body to help cooperatively associate the component body with the support means.

    Abstract translation: 电气部件的制造方法及其制造方法。 部件装置包括诸如电容器主体的电气部件主体和优选为U形的连续端子装置，其中紧邻部件主体的一侧的部分与部件主体的该侧连接。 连续端子装置的引线装置，优选地，一对间隔开并平行的U形端子装置的细长导线沿着相同的方向从部件主体突出。 引导装置中的每一个适于突出并且适于被固定以抵抗相对于电绝缘基部装置的孔的运动。 终端装置的构造以及沿着组件体的每个紧邻侧的整个长度的紧密接合协作以帮助降低电气部件装置在升高的频率下的阻抗。 如果不考虑高频操作，则终端装置的引线可以通过支撑装置的孔插入，并且在与支撑装置的与组件主体的基部装置相邻的一侧的支撑装置的一侧上被扭绞在一起 以帮助组合体与支撑装置的合作关联。

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