Abstract:
An ion source for ionizing reactant gases in an ion implantation process for manufacturing semiconductor devices includes an arc chamber into which gas is supplied through a gas line, and a spray nozzle that is connected with the gas line. The spray nozzle has a plurality f minute spray openings that spray the gas flowing through the gas line uniformly into the arc chamber at a high velocity.
Abstract:
A method (and structure) for controlling a beam used to generate a pattern on a target surface includes generating a beam of charged particles and directing the beam to a mask surface and causing the beam to be either absorbed by or reflected from the mask surface, thereby either precluding or allowing the beam to strike the target surface, based on a reflection characteristic of the mask surface.
Abstract:
The invention provides a wafer pad assembly and actuation system for use in an ion implanter, preferably a batch-type ion implanter. The wafer pad assembly includes a rotatable wafer support pad having an upper surface for mounting the wafer, and a lower surface rotationally mounted to a housing of the wafer pad assembly. The lower surface of the wafer support pad further comprises a flange connected to a rotatable shaft. The shaft is connected to an actuator for selectively indexing the shaft so that the wafer support pad is rotationally indexed about its geometric center. The lower surface of the wafer support pad is also connected to a frame having an outer curved surface rotatably mounted within a mating bearing surface of a housing. The curved frame is connected to a plurality of linkages for moving the wafer support pad within the curved frame so that the wafer is pivotable or tiltable about its geometric center.
Abstract:
A field ionizing element formed of a membrane that houses electrodes therein that are located closer to one another than the mean free path of the gas being ionized. The membrane includes a supporting portion, and a non supporting portion where the ions are formed. The membrane may be used as the front end for a number of different applications including a mass spectrometer, a rotating field mass spectrometer, a thruster, an ion mobility element, or an electrochemical device such as a fuel cell.
Abstract:
An input parameter monitoring apparatus is disclosed wherein input parameters for ion implantation can be stored in a database during an ion implantation process, thereby allowing a user to monitor the operational history from a remote location. A method of monitoring input parameters created during an ion implantation process in a semiconductor fabricating device includes collecting log data generated by a plurality of ion implantation devices, listing the collected log data in a database in chronological order and updating the database substantially contemporaneously during said process. The log data can be processed to enable textual or graphical display. A LAN connects a local computer connected via input ports to plural ion-imp devices and a remote computer, thereby enabling remote computer monitoring of the operational process and possibly interaction.
Abstract:
An impurity introducing apparatus of the present invention includes: a system for introducing an impurity having charges into a target to be processed, the target being a semiconductor substrate or a film formed on the substrate; a system for supplying electrons into the target, the electrons canceling the charges of the impurity; and a system for controlling the maximum energy of the electrons supplied by the electron supply system at a predetermined value or less.
Abstract:
The invention provides a method and system for determining a pressure compensation factor for use in an ion implanter, which uses one or a small number of test workpieces. The method includes providing a test workpiece in the ion implantation system, wherein the test workpiece has at least one band region, assuming a predicted pressure compensation factor, implanting the at least one band region of the test workpiece with an ion beam using the ion implantation system and the predicted pressure compensation factor while measuring ion beam current and a pressure in the ion implantation system, measuring a sheet resistance associated with the implanted test workpiece, and determining a pressure compensation factor according to the predicted pressure compensation factor, the measured sheet resistance, the measured ion beam current, and the measured pressure.
Abstract:
A stencil-scattering mask for e-beam lithography includes four complementary sub-field reticles, each of which is exposed with one fourth of the total dose. nullDoughnutnull stencil shapes have four different patterns of struts, so that an area that is blocked by a strut in one shape is exposed in three other shapes.
Abstract:
An ion generator chamber, for an implantation apparatus, having its interior walls surfaces knurled or roughened so that any of the materials used in the chamber cannot deposit onto the interior wall surfaces in a size sufficiently large enough to adversely affect the operation of the chamber, if the deposits peel off the interior walls of the chamber. By limiting the size of any deposits on interior chamber walls, the invention extends the average life of the filaments used in the chamber as well as extending the average time between any necessary cleaning of the inner chamber walls thereby extending the operating life of the chamber.
Abstract:
A deep-ultraviolet violet laser beam which is a harmonic and is generated inside a nonlinear optical element (101) is emitted outside the nonlinear optical element (101), being spaced from a green laser beam, which is a fundamental wave. The green laser beam emitted outside the nonlinear optical element (101) is reflected by an input-coupling mirror (102) and applied again into the nonlinear optical element (101) in order to form a closed optical path for the fundamental wave. Also, the deep-ultraviolet laser beam emitted outside the nonlinear optical element (101) is reflected by a reflecting mirror (28) other than the input-coupling mirror (102) in order to emit the deep-ultraviolet laser beam from a deep-ultraviolet laser beam-generating section (20).