CURABLE RESIN COMPOSITION AND SHORT-CURE METHOD
    53.
    发明申请
    CURABLE RESIN COMPOSITION AND SHORT-CURE METHOD 审中-公开
    可固化树脂组合物和短效方法

    公开(公告)号:US20150218345A1

    公开(公告)日:2015-08-06

    申请号:US14686847

    申请日:2015-04-15

    Abstract: Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ≦120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.

    Abstract translation: 本文公开了一种利用由低温固化反应产生的放热能进行高温固化反应的方法,否则在所选择的工具温度下能够达到高能量固化反应,从而产生固化的树脂基质,其特性与所生产的 通过高温固化反应,但通过短的固化时间和低固化温度实现。 还公开了一种短固化树脂组合物,其包含:(a)至少一种环氧官能度大于1的多官能环氧树脂; (b)一种硬化剂组合物,其包含(i)至少一种每分子具有一个或多个氨基的脂族或脂环族胺固化剂; (ii)每分子具有一个或多个氨基的至少一种芳族胺固化剂; 和(iii)咪唑作为固化促进剂。 该树脂组合物的改进的性质包括在<120℃的温度下可固化的时间小于10分钟,以达到比由相同组成衍生的固化程度更高的刚性(i)脂族/ 脂环族胺或(ii)芳族胺。

    Co-curable, conductive surfacing films for lightning strike and electromagnetic interference shielding of thermoset composite materials
    58.
    发明授权
    Co-curable, conductive surfacing films for lightning strike and electromagnetic interference shielding of thermoset composite materials 有权
    用于雷击的可共同固化的导电表面膜和热固性复合材料的电磁干扰屏蔽

    公开(公告)号:US08772391B2

    公开(公告)日:2014-07-08

    申请号:US13714506

    申请日:2012-12-14

    Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 mΩ/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.

    Abstract translation: 本公开的实施方案提供用于表面化膜和粘合剂的导电性,热固性组合物。 表面膜具有与金属相当的增强的电导率,而不使用嵌入的金属屏幕或箔。 作为最外表面层,这样的表面化膜可以并入到复合结构(例如,预浸料,胶带和织物)中,例如通过共固化。 特别地,发现使用银薄片作为导电填料形成的组合物表现出非常高的导电性。 例如,包含大于45wt。 %银薄片表现出小于约55m&OHgr / sq的电阻率。 以这种方式,当用作诸如飞行器部件的应用中时,作为最外面导电层的表面膜可以提供照明保护(LSP)和电磁干扰(EMI)屏蔽。

    TARGETED DEPOSITION OF PARTICLES USED IN THE MANUFACTURE OF COMPOSITE ARTICLES
    60.
    发明申请
    TARGETED DEPOSITION OF PARTICLES USED IN THE MANUFACTURE OF COMPOSITE ARTICLES 审中-公开
    在复合材料制造中使用的颗粒的目标沉积

    公开(公告)号:US20140034223A1

    公开(公告)日:2014-02-06

    申请号:US14053756

    申请日:2013-10-15

    Abstract: Embodiments of the present disclosure are directed to the targeted deposition of particles below 100 microns onto a substrate such as a film, tape, adhesive, fabric, fibers or a combination thereof. The targeted deposition may be accomplished by a dual-component electro-static deposition process. In one embodiment, the substrate having at least one layer of particles thereon may be combined with a prepreg. Prepregs manufactured according to embodiments of the invention may be used to manufacture composites with more robust mechanical and strength characteristics relative to conventional composites manufactured using conventional prepregs in addition to providing improved processed performance during the manufacture of the particle-coated substrate. In another embodiment, targeted deposition may be applied directly to a composite article to achieve similar benefits.

    Abstract translation: 本公开的实施例涉及将低于100微米的颗粒靶向沉积到诸如膜,带,粘合剂,织物,纤维或其组合的基底上。 目标沉积可以通过双组分静电沉积工艺完成。 在一个实施方案中,其上具有至少一层颗粒的基材可以与预浸料组合。 除了在制造颗粒涂覆的基材之前提供改进的加工性能,根据本发明的实施方案制备的预浸料可用于制造具有比使用常规预浸料制备的常规复合材料更坚固的机械和强度特性的复合材料。 在另一个实施方案中,目标沉积可以直接应用于复合制品以获得类似的益处。

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