Abstract:
Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ≦120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.
Abstract:
Methods of preparing compounds according to Formula (I): and salts thereof as well as their corresponding phosphine intermediates are provided herein, wherein R1 and R2 are different and each of R1 and R2 is independently selected from an organic radical that branches at the alpha carbon and an organic radical that branches at the beta carbon, and each of X and Y is independently O or S, and wherein said compound is a liquid at room temperature.
Abstract:
Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ≦120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.
Abstract:
Embodiments of the invention are directed to resin-soluble thermoplastic veils for use in liquid resin infusion processes, methods of manufacturing resin-soluble thermoplastic veils for use in liquid resin infusion processes, and methods of manufacturing composite articles using resin-soluble thermoplastic veils for use in liquid resin infusion applications. The resin-soluble thermoplastic veils according to embodiments of the invention and of which function as a toughening agent in composites having the veil incorporated therein have improved characteristics including, but not limited to, increased uniformity and decreased thickness relative to prior art veils. These characteristics translate into improvements in the processing of a composite article including, but not limited to, a substantial or complete elimination in premature dissolution of the veil during cure. The resultant composite article also realizes improvements including, but not limited to, distribution evenness of the toughening agent throughout the composite.
Abstract:
Methods for preparing phosphonium salts by reacting a primary phosphine or a secondary phosphine with an ester compound selected from the group consisting of: a phosphate triester; a phosphonate diester; a sulfate diester; and a sulfonate ester; to form a phosphonium salt of formula VII wherein each of RQ, RX, RY, and RZ is independently hydrocarbyl and X− is a phosphate, phosphonate, sulfate, or sulfonate are provided herein. These phosphonium salts may find utility in a wide range of applications, including as surfactants, as polar solvents (ionic liquids), as antimicrobial agents, and as a component of spinning finish in polyamide fiber processing.
Abstract:
Methods of preparing compounds according to Formula (I): and salts thereof as well as their corresponding phosphine intermediates are provided herein, wherein R1 and R2 are different and each of R1 and R2 is independently selected from an organic radical that branches at the alpha carbon and an organic radical that branches at the beta carbon, and each of X and Y is independently O or S, and wherein said compound is a liquid at room temperature.
Abstract:
Metal extractants of 2-hydroxyphenyldiazole compounds according to Formula (2): and tautomers and salts thereof, are disclosed, wherein substituents R5, R7, R9, and R10 are as defined herein.
Abstract:
Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 mΩ/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.
Abstract:
The present invention relates to processes for reducing or eliminating the amount of hydrazine from a hydroxylamine-free base containing hydrazine by treating said hydroxylamine-free base with a scavenger agent, and to the hydroxylamine-free base thereby obtained, as well as to its use for producing microdispersions containing a hydroxamated polymer for use as a flocculant in the Bayer process.
Abstract:
Embodiments of the present disclosure are directed to the targeted deposition of particles below 100 microns onto a substrate such as a film, tape, adhesive, fabric, fibers or a combination thereof. The targeted deposition may be accomplished by a dual-component electro-static deposition process. In one embodiment, the substrate having at least one layer of particles thereon may be combined with a prepreg. Prepregs manufactured according to embodiments of the invention may be used to manufacture composites with more robust mechanical and strength characteristics relative to conventional composites manufactured using conventional prepregs in addition to providing improved processed performance during the manufacture of the particle-coated substrate. In another embodiment, targeted deposition may be applied directly to a composite article to achieve similar benefits.