公开(公告)号：US20160157352A1

公开(公告)日：2016-06-02

申请号：US15013128

申请日：2016-02-02

Applicant: SunASIC Technologies, Inc.

Inventor： Chi-Chou LIN

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/182 ,  B42D25/313 ,  G06K9/0002 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05K1/115 ,  H05K1/183 ,  H05K3/0044 ,  H05K3/4046 ,  H05K3/421 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10287 ,  H05K2203/0228 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913

Abstract: A printed circuit board having an electronic component embedded is disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.

Abstract translation: 公开了一种嵌有电子部件的印刷电路板。 印刷电路板具有交错形成的四个导电层和三个核心层。 通过适当地去除印刷电路板的一部分，可以暴露电子部件。 它具有暴露的电子部件可以是CCD，CMOS或模块的优点。 当所提到的装置嵌入印刷电路板时，其一部分可以从印刷电路板露出以用于正常功能。 可以将印刷电路板组件的总体厚度最小化以满足电子产品的紧凑设计的趋势。

公开(公告)号：US09295158B2

公开(公告)日：2016-03-22

申请号：US14071724

申请日：2013-11-05

Applicant: SunASIC Technologies, Inc.

Inventor： Chi-Chou Lin

IPC: H01K3/10 ,  H05K1/18 ,  B42D25/313 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K1/182 ,  B42D25/313 ,  G06K9/0002 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05K1/115 ,  H05K1/183 ,  H05K3/0044 ,  H05K3/4046 ,  H05K3/421 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10287 ,  H05K2203/0228 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913

Abstract: A printed circuit board having an electronic component embedded and a method making the same are disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.

Abstract translation: 公开了一种具有嵌入式电子元件的印刷电路板及其制造方法。 印刷电路板具有交错形成的四个导电层和三个核心层。 通过适当地去除印刷电路板的一部分，可以暴露电子部件。 它具有暴露的电子部件可以是CCD，CMOS或模块的优点。 当所提到的装置嵌入印刷电路板时，其一部分可以从印刷电路板露出以用于正常功能。 可以将印刷电路板组件的总体厚度最小化以满足电子产品的紧凑设计的趋势。

公开(公告)号：US20150185378A1

公开(公告)日：2015-07-02

申请号：US14141717

申请日：2013-12-27

Applicant: SunASIC Technologies, Inc.

Inventor： Chi-Chou LIN ,  Zheng-Ping HE

IPC: G02B5/18 ,  G02B1/02

CPC classification number: G02B1/005 ,  G02B5/1842 ,  G02B5/203 ,  H01L2933/0083

Abstract: A silicon wafer having colored top side is disclosed in the present invention. The silicon wafer includes: a wafer; a first semi-conductor layer, formed on at least a portion of a top side of the wafer, having periodical structures to form a grating pattern, and a second semi-conductor layer, formed on the first semi-conductor layer with a bottom side substantially fully contacted with the periodical structures. The first semi-conductor layer and the second semi-conductor layer form a photonic crystal layer and work to reflect a predetermined wavelength range of incident visible light beams. The present invention provides a silicon wafer which can reflect specified color(s) from the surface facing external light beams. Therefore, dies from cutting the silicon wafer with functions to interact with external environment rather than packaged can have advantages to show some specified logo or trademark.

Abstract translation: 在本发明中公开了具有彩色顶侧的硅晶片。 硅晶片包括：晶片; 第一半导体层，形成在晶片的顶侧的至少一部分上，具有周期结构以形成光栅图案;以及第二半导体层，形成在第一半导体层上，底部侧 与周期性结构基本完全接触。 第一半导体层和第二半导体层形成光子晶体层并且用于反射入射的可见光束的预定波长范围。 本发明提供一种可以从面向外部光束的表面反射特定颜色的硅晶片。 因此，切割硅晶片具有与外部环境相互作用而不是封装的功能，具有显示某些特定标志或商标的优点。

公开(公告)号：US20150124416A1

公开(公告)日：2015-05-07

申请号：US14071724

申请日：2013-11-05

Applicant: SunASIC Technologies, Inc.

Inventor： Chi-Chou LIN

IPC: H05K3/32 ,  H05K3/10 ,  H05K1/18 ,  H05K1/09 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/182 ,  B42D25/313 ,  G06K9/0002 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05K1/115 ,  H05K1/183 ,  H05K3/0044 ,  H05K3/4046 ,  H05K3/421 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10287 ,  H05K2203/0228 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913

Abstract: A printed circuit board having an electronic component embedded and a method making the same are disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.

Abstract translation: 公开了一种具有嵌入式电子元件的印刷电路板及其制造方法。 印刷电路板具有交错形成的四个导电层和三个核心层。 通过适当地去除印刷电路板的一部分，可以暴露电子部件。 它具有暴露的电子部件可以是CCD，CMOS或模块的优点。 当所提到的装置嵌入印刷电路板时，其一部分可以从印刷电路板露出以用于正常功能。 可以将印刷电路板组件的总体厚度最小化以满足电子产品的紧凑设计的趋势。

公开(公告)号：US20140270417A1

公开(公告)日：2014-09-18

申请号：US13845223

申请日：2013-03-18

Applicant: SUNASIC TECHNOLOGIES, INC.

Inventor： Chi-Chou LIN

IPC: G06K9/00

CPC classification number: G06K9/00154

Abstract: A portable fingerprint device is disclosed. The device includes an image sensing unit for capturing fingerprint images of a finger; a microprocessor, linked to the image sensing unit, for recording the fingerprint images of the finger, identifying the fingerprint images of the finger from a fingerprint database, receiving a command signal and transmitting a response signal; and a communication unit, connected to the microprocessor, for exchanging the command signal and the response signal between the microprocessor and a command device separated from the portable fingerprint device. The portable fingerprint device not only can identify fingerprints, but also can detect a sequence of finger motion, or “signature”, and use such information as part of the identification/authentication process.

Abstract translation: 公开了一种便携式指纹装置。 该装置包括用于捕获手指的指纹图像的图像感测单元; 连接到图像感测单元的微处理器，用于记录手指的指纹图像，从指纹数据库识别手指的指纹图像，接收命令信号并发送响应信号; 以及连接到微处理器的通信单元，用于交换命令信号和微处理器与从便携式指纹设备分离的命令装置之间的响应信号。 便携式指纹设备不仅可以识别指纹，还可以检测手指运动或“签名”序列，并将这些信息用作识别/认证过程的一部分。