公开(公告)号：US06755229B2

公开(公告)日：2004-06-29

申请号：US09984282

申请日：2001-10-29

Applicant: Myung-Sam Kang ,  Keon-Yang Park ,  Jang-Kyu Kang

Inventor： Myung-Sam Kang ,  Keon-Yang Park ,  Jang-Kyu Kang

IPC: B32B3500

CPC classification number: H01L21/50 ,  H01L23/36 ,  H01L23/49816 ,  H01L2924/0002 ,  Y10T156/1744 ,  H01L2924/00

Abstract: Disclosed are a method for preparing a high performance BGA board and a jig applicable to the method. The method comprises pre-bonding an adhesive to a BGA board laminated structure or a heatsink by use of a jig; and main-bonding the BGA board laminated structure or the heatsink to which the adhesive is previously stuck in the pre-bonding step to the heatsink or the BGA board laminated structure, respectively, by use of a jig. A high performance BGA board can be prepared by use of an individual heatsink and a strip-type jig without a strip-type heatsink, and in which the Ni-plated side of the heatsink can be prevented from being contaminated.

Abstract translation: 公开了一种制备适用于该方法的高性能BGA板和夹具的方法。 该方法包括使用夹具将粘合剂预粘合到BGA板层叠结构或散热片上; 并且通过使用夹具将BGA板层压结构或粘合剂预先粘附在预粘合步骤中的散热器分别主要粘合到散热器或BGA板层叠结构。 可以通过使用单独的散热器和无带式散热器的带状夹具来制备高性能BGA板，并且可以防止散热器的镀镍侧被污染。

公开(公告)号：US06747450B2

公开(公告)日：2004-06-08

申请号：US10140294

申请日：2002-05-08

Applicant: Myung-Sam Kang ,  Kyoung-Won Na ,  Sang-On Choi ,  Won-Youl Choi ,  Jeong-Hwan Lee ,  Keon-Yang Park

Inventor： Myung-Sam Kang ,  Kyoung-Won Na ,  Sang-On Choi ,  Won-Youl Choi ,  Jeong-Hwan Lee ,  Keon-Yang Park

IPC: G01R3304

CPC classification number: H05K1/165 ,  G01R33/05 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/09536 ,  H05K2201/10416

Abstract: A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects earth magnetism to obtain positional information is disclosed. The sensor comprises a magnetic layer patterned in a certain shape; a first stacked board stacked on a lower surface of the magnetic layer and formed with a first driving pattern; a second stacked board stacked on an upper surface of the magnetic layer and formed with a second driving pattern, the first and second driving patterns being electrically connected to each other; a third lower stacked board stacked on a lower surface of the first stacked board and formed with a first pickup pattern; and a third upper stacked board stacked on an upper surface of the second stacked board and formed with a second pickup pattern, the third lower and upper stacked boards being electrically connected to each other.

Abstract translation: 公开了使用印刷电路板制造技术的弱磁场传感器及其制造方法，其检测地磁以获得位置信息。 传感器包括以特定形状图案化的磁性层; 堆叠在所述磁性层的下表面上并形成有第一驱动图案的第一堆叠板; 堆叠在所述磁性层的上表面上并形成有第二驱动图案的第二堆叠板，所述第一和第二驱动图案彼此电连接; 堆叠在第一堆叠板的下表面上并形成有第一拾取图案的第三下堆叠板; 以及堆叠在所述第二堆叠板的上表面上并形成有第二拾取图案的第三上堆叠板，所述第三下堆叠板和上堆叠板彼此电连接。

公开(公告)号：US08633392B2

公开(公告)日：2014-01-21

申请号：US13354438

申请日：2012-01-20

Applicant: Shuhichi Okabe ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jeong-Woo Park ,  Ji-Eun Kim

Inventor： Shuhichi Okabe ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jeong-Woo Park ,  Ji-Eun Kim

IPC: H05K1/02

CPC classification number: H05K1/0265 ,  H05K1/116 ,  H05K3/107 ,  H05K3/108 ,  H05K3/205 ,  H05K3/421 ,  H05K2201/0379 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09736 ,  H05K2203/0361

Abstract: A circuit board including: an insulator having a trench; a first circuit pattern formed to bury a portion of the trench; and a second circuit pattern formed on a surface of the insulator having the trench formed therein.

Abstract translation: 一种电路板，包括：具有沟槽的绝缘体; 形成为埋入沟槽的一部分的第一电路图案; 以及形成在其中形成有沟槽的绝缘体的表面上的第二电路图案。

公开(公告)号：US20110259627A1

公开(公告)日：2011-10-27

申请号：US13067883

申请日：2011-07-01

Applicant: Hoe-Ku Jung ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jeong-Woo Park ,  Jung-Hyun Park

Inventor： Hoe-Ku Jung ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jeong-Woo Park ,  Jung-Hyun Park

IPC: H05K1/09 ,  H05K1/11

CPC classification number: H05K3/205 ,  H01L21/4846 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K3/4007 ,  H05K2201/09745 ,  H05K2201/10674 ,  H05K2203/0338 ,  H05K2203/0435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes: an insulator having a groove; a circuit layer filling a portion of the groove; a solder pad on the circuit layer filling the remainder of the groove; and a circuit pattern electrically connected with the circuit layer, the circuit pattern buried in the insulator such that a portion of the circuit pattern is exposed at a surface of the insulator.

Abstract translation: 电路板包括：具有凹槽的绝缘体; 填充所述凹槽的一部分的电路层; 电路层上的填充凹槽其余部分的焊盘; 以及与电路层电连接的电路图案，电路图案埋在绝缘体中，使得电路图案的一部分在绝缘体的表面露出。

公开(公告)号：US08022553B2

公开(公告)日：2011-09-20

申请号：US12155555

申请日：2008-06-05

Applicant: Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

Inventor： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

IPC: H01L23/48

CPC classification number: H05K1/113 ,  H01L23/13 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/20 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09472 ,  H01L2224/0401

Abstract: A mounting substrate and a method of manufacturing the mounting substrate. The mounting substrate can include an insulation layer, a bonding pad buried in one side of the insulation layer in correspondence with a mounting position of a chip, and a circuit pattern electrically connected to the bonding pad. By utilizing certain embodiments of the invention, the process for stacking a solder resist layer can be omitted, as the bonding pads can be implemented in a form recessed from the surface of the insulation layer. In this way, the manufacturing process can be simplified and manufacturing costs can be reduced. Since the surface of the mounting-substrate on which to mount a chip can be kept flat without any protuberances, the occurrence of voids in the underfill can be minimized. This is correlated to obtaining a high degree of reliability, and leads to a greater likelihood of successful mounting.

Abstract translation: 一种安装基板及其制造方法。 安装基板可以包括绝缘层，与绝缘层的一侧相对应于芯片的安装位置的接合焊盘以及电连接到焊盘的电路图案。 通过利用本发明的某些实施例，可以省略堆叠阻焊层的工艺，因为焊盘可以以从绝缘层的表面凹陷的形式来实施。 以这种方式，可以简化制造过程，并且可以降低制造成本。 由于安装芯片的安装基板的表面可以保持平坦而没有任何突起，所以可以使底部填充物中的空隙的发生最小化。 这与获得高可靠性相关，并且导致成功安装的可能性更大。

公开(公告)号：US20110186997A1

公开(公告)日：2011-08-04

申请号：US12821621

申请日：2010-06-23

Applicant: Mi-Sun HWANG ,  Myung-Sam Kang

Inventor： Mi-Sun HWANG ,  Myung-Sam Kang

IPC: H01L23/498 ,  H01L21/60

CPC classification number: H01L23/498 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00

Abstract: A single-layer board on chip package substrate and a method of manufacturing the same are disclosed. The single-layer board on chip package substrate in accordance with an embodiment of the present invention includes an insulator, which has a window perforated therethrough, a wiring pattern, a wire bonding pad and a solder ball pad, which are embedded in one surface of the insulator, and a solder resist layer, which is formed on the one surface of the insulator such that the solder resist layer covers the wiring pattern but at least portions of the wire bonding pad and the solder ball pad are exposed.

Abstract translation: 公开了一种单层片上封装衬底及其制造方法。 根据本发明的实施例的单层片上封装基板包括：具有穿孔的窗口的绝缘体，布线图案，引线接合焊盘和焊球垫，其嵌入在 绝缘体和阻焊层，其形成在绝缘体的一个表面上，使得阻焊层覆盖布线图案，但是引线接合焊盘和焊球垫的至少一部分被暴露。

公开(公告)号：US20100132876A1

公开(公告)日：2010-06-03

申请号：US12508224

申请日：2009-07-23

Applicant: Myung-Sam Kang ,  Jung-Hyun Park ,  Ji-Eun Kim

Inventor： Myung-Sam Kang ,  Jung-Hyun Park ,  Ji-Eun Kim

IPC: C25D5/02 ,  B32B37/00 ,  B32B38/00

CPC classification number: B32B37/02 ,  B32B2457/08 ,  C25D5/022 ,  H05K3/205 ,  H05K3/428 ,  H05K3/4658 ,  H05K2201/0376 ,  H05K2203/0384

Abstract: Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for interlayer connection can include forming a circuit pattern on one side of a carrier, pressing one side of the carrier into one side of the insulator, removing the carrier, forming a hole penetrating through the insulator by processing one end of the circuit pattern, and forming a conductive material inside the hole to have the conductive material correspond to the via.

Abstract translation: 公开了印刷电路板的制造方法。 制造具有用于层间连接的通孔的印刷电路板的方法可以包括在载体的一侧上形成电路图案，将载体的一侧压在绝缘体的一侧，去除载体，形成贯穿该载体的孔 通过处理电路图案的一端，并且在孔内形成导电材料以使导电材料对应于通孔。

公开(公告)号：US20100108372A1

公开(公告)日：2010-05-06

申请号：US12585509

申请日：2009-09-16

Applicant: Myung-Sam Kang

Inventor： Myung-Sam Kang

IPC: H05K1/18

CPC classification number: H01L23/3114 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/007 ,  H05K3/20 ,  H05K3/284 ,  H05K3/4007 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/0361 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic component package and a manufacturing method thereof. The electronic component package includes: an insulation layer; a single layer of circuit pattern buried in the insulation layer and having a surface exposed at one side of the insulation layer, the circuit pattern comprising a bonding pad and a solder ball pad; and an electronic component mounted on one side of the insulation layer and electrically connected with the bonding pad. In addition, the electronic component package includes a portion of the insulation layer being removed in correspondence with the position of the solder ball pad such that the solder ball pad is exposed at the other side of the insulation layer.

Abstract translation: 一种电子元件封装及其制造方法。 电子部件封装包括：绝缘层; 埋在绝缘层中并具有在绝缘层的一侧露出的表面的单层电路图案，电路图案包括接合焊盘和焊球垫; 以及安装在所述绝缘层的一侧上并与所述接合焊盘电连接的电子部件。 此外，电子部件封装包括与焊球垫的位置对应地去除绝缘层的一部分，使得焊球垫在绝缘层的另一侧露出。

公开(公告)号：US07697301B2

公开(公告)日：2010-04-13

申请号：US11637664

申请日：2006-12-13

Applicant: Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

Inventor： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

Abstract translation: 公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US07550316B2

公开(公告)日：2009-06-23

申请号：US11715906

申请日：2007-03-09

Applicant: Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

Inventor： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An aspect of the present invention features a manufacturing method of a board on chip package. The method can comprise: (a) laminating a dry film on a carrier film, one side of which is laminated by a thin metal film; (b) patterning the dry film in accordance with a circuit wire through light exposure and developing process, and forming a solder ball pad and a circuit wire; (c) removing the dry film; (d) laminating an upper photo solder resist excluding a portion where the solder ball pad is formed; (e) etching the thin metal film formed on a portion where the upper photo solder resist is not laminated; (f) mounting a semiconductor chip on the solder ball pad by a flip chip bonding; (g) molding the semiconductor chip with a passivation material; (h) removing the carrier film and the thin metal film; and (i) laminating a lower photo solder resist under the solder ball pad. The board on chip package and the manufacturing method thereof according to the present invention can design a high density circuit since a circuit pattern is formed using a seed layer.

Abstract translation: 本发明的一个方面的特征在于片上封装的制造方法。 该方法可以包括：（a）在载体膜上层压干膜，其一面由薄金属膜层压; （b）通过曝光和显影工艺根据电路线图案化干膜，并形成焊球焊盘和电路线; （c）去除干膜; （d）层压除了形成焊锡球焊盘的部分之外的上光阻焊剂; （e）蚀刻形成在上层光阻抗层未层叠的部分上的金属薄膜; （f）通过倒装芯片接合将半导体芯片安装在焊球垫上; （g）用钝化材料模制半导体芯片; （h）去除载体膜和金属薄膜; 和（i）在焊球垫下方层叠下光阻焊剂。 根据本发明的片上封装及其制造方法可以设计高密度电路，因为使用种子层形成电路图案。