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    Micro Sensor Package
    51.
    发明申请
    Micro Sensor Package 审中-公开

    公开(公告)号：US20180100842A1

    公开(公告)日：2018-04-12

    申请号：US15718570

    申请日：2017-09-28

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01N33/00 ,  G01N27/14

    CPC classification number: G01N33/0027 ,  G01N27/128 ,  G01N27/14 ,  G01N33/0014

    Abstract: A micro sensor package having a low thermal conductivity includes: a substrate on which a metal pattern is formed; a sensing chip disposed on the substrate; a cover covering the sensing chip and formed with a hole for supplying gas to the sensing chip; and a filter covering the hole, wherein the sensing chip comprises a sensor platform having a plurality of first pores formed along the up-down direction, and a sensor electrode formed on an upper portion or a lower portion of the sensor platform and electrically connected to the metal pattern.

    Folding type capacitor comprising through hole
    54.
    发明授权
    Folding type capacitor comprising through hole 有权

    公开(公告)号：US09773617B2

    公开(公告)日：2017-09-26

    申请号：US14825538

    申请日：2015-08-13

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park

    IPC: H01G4/26 ,  H01G4/005 ,  H01G4/30 ,  H01G4/38 ,  H01G4/10

    CPC classification number: H01G4/26 ,  H01G4/005 ,  H01G4/10 ,  H01G4/30 ,  H01G4/38

    Abstract: A folding type capacitor includes a metal substrate wherein a through hole penetrates an inside thereof; at least one dielectric layer formed on a surface of the metal substrate and an inner peripheral surface of the through hole; and an electrode layer formed on the at least one dielectric layer, wherein the metal substrate has bending portions whose surfaces are facing each other. Thus, manufacturing process is more simplified since Al2O3 insulation layers are formed by anodizing the aluminum layer without forming the extra dielectric layers after forming the aluminum layer, so that the manufacturing cost can be reduced, and also a multi-stacked capacitor having a high capacitance and a high reliability can be provided by stacking capacitors including a plurality of aluminum oxide layers using a more simplified process.

    Substrate for Can Package-Type Optical Device and Optical Device using Same
    56.
    发明申请
    Substrate for Can Package-Type Optical Device and Optical Device using Same 审中-公开
    可用于封装型光学器件的基板和使用相同的光学器件

    公开(公告)号：US20160190398A1

    公开(公告)日：2016-06-30

    申请号：US14986092

    申请日：2015-12-31

    Applicant: Point Engineering Co., Ltd.

    Inventor： Ki Myung Nam ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01L33/48 ,  H01L33/62

    CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified.According to the present invention, a method for manufacturing a can package-type optical device comprises the steps of: (a) preparing a metal plate and a metal substrate with vertical insulation layers, wherein more than one vertical insulation layer crossing the substrate from the top surface to the bottom surface thereof are formed; (b) bonding the metal plate on the top surface of the metal substrate with vertical insulation layers; (c) forming a cavity on an intermediate product that has undergone step (b) in a form of a cylindrical pit having a predetermined depth reaching the surface of said metal substrate with vertical insulation layers by passing through said metal plate and the adhesive layers formed by said bonding, wherein said cavity contains said vertical insulation layer in the bottom wall thereof; (e) connecting a wire, which electrically connects an optical device and an electrode of the optical device together, to either side of the surface of the bottom wall of the vertical insulation layers of the cavity, respectively; and (g) sealing the cavity by means of a protective plate made from a light-transmitting material; and a can cap, formed as a picture frame whose top central portion and the bottom are open and encompassing the perimeter of the protective plate.

    Abstract translation: 本发明涉及一种光学器件的制造方法及其制造的光学器件，其涉及使用基板本身作为散热板，并且采用其上形成有垂直绝缘层的基板，使得电极端子 不必从密封空间挤出，从而能够简化光学装置的整体结构和制造过程。 根据本发明，一种罐封装型光学器件的制造方法包括以下步骤：（a）制备具有垂直绝缘层的金属板和金属基板，其中多于一个垂直绝缘层与 形成其底面的顶面; （b）用垂直绝缘层将金属板与金属基板的顶面接合; （c）在具有预定深度的圆柱形凹坑形式的步骤（b）中形成空腔，该预定深度通过穿过所述金属板并形成的粘合剂层到达所述金属基板的具有垂直绝缘层的表面 通过所述接合，其中所述空腔在其底壁中包含所述垂直绝缘层; （e）将将光学装置和光学装置的电极电连接在一起的导线分别连接到腔的垂直绝缘层的底壁的表面的任一侧; 和（g）通过由透光材料制成的保护板密封空腔; 以及罐盖，其形成为其顶部中心部分和底部打开并且包围保护板的周边的相框。

    Optical Device Integrated with Driving Circuit and Power Supply Circuit, Method for Manufacturing Optical Device Substrate Used Therein, and Substrate Thereof
    58.
    发明申请
    Optical Device Integrated with Driving Circuit and Power Supply Circuit, Method for Manufacturing Optical Device Substrate Used Therein, and Substrate Thereof 有权
    与驱动电路和电源电路集成的光学器件，其中使用的光学器件基板及其基板的制造方法

    公开(公告)号：US20140374783A1

    公开(公告)日：2014-12-25

    申请号：US14365408

    申请日：2012-10-04

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Ki Myung Nam ,  Seung Ho Park

    IPC: H01L27/15 ,  H01L33/64 ,  H01L33/62 ,  H01L33/00

    CPC classification number: H01L27/15 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/005 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48465 ,  H05B33/0803 ,  H05B33/0806 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The present invention relates to an optical device integrated with a driving circuit and a power supply circuit, a method for manufacturing an optical device substrate used therein, and a substrate thereof, which are capable of reducing the overall size and facilitating the handling and management thereof by mounting a plurality of optical elements, driving circuits thereof, and power supply circuits thereof on a single substrate for an optical device having a vertical insulating layer. The objective of the present invention is to provide the optical device integrated with the driving circuit and the power supply circuit, the method for manufacturing the optical device substrate used therein, and the substrate thereof which are capable of reducing the overall size and facilitating the handling and the management thereof by mounting the plurality of optical elements, the driving circuits thereof, and the power supply circuits thereof on the single substrate for the optical device having the vertical insulating layer.

    Abstract translation: 本发明涉及与驱动电路和电源电路集成的光学器件，其中使用的光学器件衬底的制造方法及其基板，其能够减小总体尺寸并且便于其处理和管理 通过将多个光学元件，其驱动电路及其电源电路安装在具有垂直绝缘层的光学器件的单个基板上。 本发明的目的是提供与驱动电路和电源电路集成的光学装置，其中使用的光学器件基板的制造方法及其基板，其能够减小总体尺寸并便于处理 并且通过将多个光学元件及其驱动电路及其电源电路安装在具有垂直绝缘层的光学器件的单个基板上来进行管理。

    Optical component package and device using same
    60.
    发明授权
    Optical component package and device using same 有权

    公开(公告)号：US11545596B2

    公开(公告)日：2023-01-03

    申请号：US17351019

    申请日：2021-06-17

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Moon Hyun Kim

    IPC: H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64

    Abstract: An optical component package includes a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a cavity provided in an upper surface of the main substrate; a sub-substrate provided in the cavity of the main substrate, the sub-substrate including an insulating body, a plurality of via holes vertically passing through the insulating body and filled with a metal material being electrically connected to each of the metal bodies, and a plurality of metal pads mounted on the insulating body and electrically connected to the plurality of via holes; a plurality of optical components mounted on the plurality of metal pads and electrically connected to the plurality of metal pads; and a light transmitting member provided above the main substrate.

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