公开(公告)号：US09650241B2

公开(公告)日：2017-05-16

申请号：US14857687

申请日：2015-09-17

Applicant: InvenSense, Inc.

Inventor： Cerina Zhang ,  Martin Lim

IPC: H01L25/16 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00333 ,  B81B3/0051 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/035 ,  B81C2203/038

Abstract: A method for forming a MEMS device includes coupling a MEMS substrate and a base substrate. The MEMS substrate and the base substrate contain at least two enclosures. One enclosures has a first vertical gap between the bonding surface of the MEMS substrate and the bonding surface of the base substrate that is less than a second vertical gap between the bonding surface of the MEMS substrate and the bonding surface of the base substrate than another of the enclosures to provide a height difference between the first vertical gap and the second vertical gap. The method includes bonding the bonding surfaces of the one of the two enclosures at a first pressure to provide a first sealed enclosure. The method includes bonding the bonding surfaces of other of the two enclosures at a second pressure to provide a second sealed enclosure.

公开(公告)号：US20170129769A1

公开(公告)日：2017-05-11

申请号：US14935863

申请日：2015-11-09

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： AARON A. GEISBERGER

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81C1/00626 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0307

Abstract: An embodiment of a microelectromechanical systems (MEMS) device is provided, which includes a substrate; a proof mass positioned in space above a surface of the substrate, wherein the proof mass is configured to pivot on a rotational axis parallel to the substrate; an anchor structure that includes two or more separated anchors mounted to the surface of the substrate, wherein the anchor structure is aligned with the rotational axis; and an isolation sub-frame structure that surrounds the anchor structure and is flexibly connected to each of the two or more separated anchors of the anchor structure, where the proof mass is flexibly connected to the isolation sub-frame structure.

公开(公告)号：US09644971B2

公开(公告)日：2017-05-09

申请号：US14532582

申请日：2014-11-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daniel Babitch ,  Nicolas Vantalon

IPC: G01C21/16 ,  G06F13/40 ,  G06F13/42 ,  G06F1/32 ,  G01S19/26 ,  G01S19/47

CPC classification number: G01C21/165 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01S19/26 ,  G01S19/47 ,  G06F1/3243 ,  G06F13/4022 ,  G06F13/4282 ,  Y02D10/152 ,  Y02D50/20

Abstract: A Micro-Electromechanical System (MEMS) recorder is provided. The MEMS recorder includes a scheduler, a serializer, a multiplexer, a transmit/receive switch, a master clock generator, a deserializer, a comparator array to determine whether to generate a signal to wake up a controller and/or a location module from a sleep mode, and a First-In-First-Out (FIFO) memory to output data to be stored and wake up the controller and/or the location module from the sleep mode if a signal to wake up the controller and/or the location module is received or if the FIFO memory is full, wherein the controller and/or the location module is awakened directly by the MEMS recorder or via the controller.

公开(公告)号：US20170102239A1

公开(公告)日：2017-04-13

申请号：US15388001

申请日：2016-12-22

Applicant: Seiko Epson Corporation

Inventor： Ryuta Nishizawa ,  Takashi Nomiya ,  Keiichi Yamaguchi

IPC: G01C19/5628 ,  B81B3/00

CPC classification number: G01C19/5628 ,  B81B3/0086 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/07 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: An electronic device includes a vibration element having a detection signal electrode and a drive signal electrode, an IC disposed so as to be opposed to the vibration element, a first wiring pattern located between the IC and the vibration element, and electrically connected to the drive signal electrode, and a shield wiring pattern located on the vibration element side of the first wiring pattern, and electrically connected to a constant potential (ground).

公开(公告)号：US09568313B2

公开(公告)日：2017-02-14

申请号：US14886591

申请日：2015-10-19

Applicant: Seiko Epson Corporation

Inventor： Ryuta Nishizawa ,  Takashi Nomiya ,  Keiichi Yamaguchi

IPC: H01L29/84 ,  H01L31/0203 ,  H01L23/20 ,  H01L21/00 ,  G01C19/5628

CPC classification number: G01C19/5628 ,  B81B3/0086 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/07 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: An electronic device includes a vibration element having a detection signal electrode and a drive signal electrode, an IC disposed so as to be opposed to the vibration element, a first wiring pattern located between the IC and the vibration element, and electrically connected to the drive signal electrode, and a shield wiring pattern located on the vibration element side of the first wiring pattern, and electrically connected to a constant potential (ground).

Abstract translation: 一种电子设备包括具有检测信号电极和驱动信号电极的振动元件，与振动元件相对设置的IC，位于IC和振动元件之间的电连接到驱动器 信号电极和位于第一布线图案的振动元件侧的屏蔽布线图案，并且电连接到恒定电位（接地）。

公开(公告)号：US09533875B2

公开(公告)日：2017-01-03

申请号：US14357046

申请日：2012-11-09

Applicant: U Electronics Co., Ltd.

Inventor： Yong Hee Han ,  Hyung Won Kim ,  Mi Sook Ahn

IPC: B81B7/00 ,  G01P15/08 ,  B81C1/00 ,  H01L31/02

CPC classification number: B81B7/0038 ,  B81B7/007 ,  B81B2201/0207 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/096 ,  B81C1/00269 ,  B81C1/00285 ,  B81C2203/0118 ,  G01P15/0802 ,  H01L31/02016 ,  H01L2224/291 ,  H01L2924/014

Abstract: A micro electro mechanical systems (MEMS) sensor packaging includes a first wafer having a readout integrated circuit (ROIC) formed thereon, a second wafer disposed corresponding to the first wafer and having a concave portion on one side thereof and a MEMS sensor prepared on the concave portion, joint solders formed along a surrounding of the MEMS sensor and sealing the MEMS sensor jointing the first and second wafers, and pad solders formed to electrically connect the ROIC circuit of the first wafer and the MEMS sensor of the second wafer. According to the present disclosure, in joining and packaging a wafer having the ROIC formed thereon and a wafer having the MEMS sensor formed thereon, the size of a package can be reduced and an electric signal can be stably provided by forming internally pad solders for electrically connecting the ROIC and the MEMS sensor.

Abstract translation: 微机电系统（MEMS）传感器封装包括具有形成在其上的读出集成电路（ROIC）的第一晶片，对应于第一晶片设置的第二晶片，并且在其一侧上具有凹部，并且在 凹部，沿着MEMS传感器的周围形成的接合焊料，并密封连接第一和第二晶片的MEMS传感器，以及形成为将第一晶片的ROIC电路电连接到第二晶片的MEMS传感器的焊盘焊接。 根据本公开内容，在其上形成有ROIC的晶片和其上形成有MEMS传感器的晶片的接合和封装中，可以减小封装的尺寸，并且可以通过形成用于电气的内部焊接焊料来稳定地提供电信号 连接ROIC和MEMS传感器。

公开(公告)号：US20160376145A1

公开(公告)日：2016-12-29

申请号：US15192185

申请日：2016-06-24

Applicant: Robert Bosch GmbH

Inventor： Uwe Hansen ,  Sebastian Schuler-Watkins

IPC: B81B7/00 ,  G01D11/00 ,  B81C1/00

CPC classification number: G01D11/00 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81C1/00309 ,  B81C2201/0123

Abstract: A method for manufacturing a micromechanical component and a micromechanical component. The micromechanical component includes a sensor substrate and a cap situated thereon. For creating the cap, a plurality of openings is introduced into a cap substrate in a delimited area on the surface of the front side in the form of microperforations. The openings end in the cap substrate, i.e. they do not go all the way through the cap substrate and are therefore shallow. The cap substrate is then placed on the sensor substrate, whereby the front side of the cap substrate including the plurality of openings is directed toward the sensor substrate. A portion of the cap substrate is removed from its back side by back-thinning using a grinding process or another semiconductor process. The removal of the cap substrate material from the back side creates access to the openings.

Abstract translation: 一种用于制造微机械部件和微机械部件的方法。 微机械部件包括位于其上的传感器基板和盖。 为了形成盖，在微孔形式的前侧表面上的限定区域中将多个开口引入盖基板。 开口终止在盖基板中，即它们不会一直穿过盖基板，因此是浅的。 然后将盖基板放置在传感器基板上，由此包括多个开口的盖基板的前侧指向传感器基板。 通过使用研磨工艺或另一种半导体工艺通过背部薄化将帽基材的一部分从其背面去除。 盖背衬材料从背面去除导致开口的进入。

公开(公告)号：US09499397B2

公开(公告)日：2016-11-22

申请号：US14230273

申请日：2014-03-31

Applicant: Philip H. Bowles ,  Stephen R. Hooper

Inventor： Philip H. Bowles ,  Stephen R. Hooper

IPC: B81B7/02

CPC classification number: B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/07 ,  B81B2207/09

Abstract: Microelectronic packages and methods for producing microelectronic packages are provided. In one embodiment, the method includes bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece. The first MEMS die and cap piece are bonded such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer. A second MEMS die having a second MEMS transducer structure thereon is further bonded to one of the cap piece and the second MEMS die. The second MEMS die and the cap piece are bonded such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer. The second hermetically-sealed cavity contains a different internal pressure than does the first hermetically-sealed cavity.

Abstract translation: 提供微电子封装和用于制造微电子封装的方法。 在一个实施例中，该方法包括将其上具有第一MEMS换能器结构的第一微机电系统（MEMS）管芯结合到盖件上。 第一MEMS管芯和盖件被接合，使得形成封闭第一MEMS换能器的第一密封腔。 其上具有第二MEMS换能器结构的第二MEMS管芯进一步结合到盖件和第二MEMS管芯之一。 第二MEMS管芯和盖件被接合，使得形成封闭第二MEMS换能器的第二密封空腔。 第二个密封腔与第一个密封腔相比具有不同的内部压力。

公开(公告)号：US20160332872A1

公开(公告)日：2016-11-17

申请号：US15147233

申请日：2016-05-05

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Antti IIHOLA ,  Altti TORKKELI

IPC: B81C1/00

CPC classification number: B81C1/00595 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/033 ,  B81B2203/0136 ,  B81C1/00603 ,  G01C19/56 ,  G01C19/5733 ,  G01C19/5769

Abstract: A method for manufacturing a micromechanical device layer is performed on a device wafer comprising a single layer of homogenous material. The method comprises patterning a first mask on a first face of the device wafer, the first mask patterning at least lateral dimensions of comb structures and outlines of large device structures. First trenches are etched, the first trenches defining the lateral dimensions of the at least comb structures and outlines of large device structures in a single deep etching process. Recession etching may be used on one or two faces of the device wafer for creating structures at least partially recessed below the respective surfaces of the device wafer. A double mask etching process may be used on one or two faces of the device wafer for creating structures at least partially recessed to mutually varying depths from the respective face of the device wafer.

Abstract translation: 在包括单层均质材料的器件晶片上进行微机械器件层的制造方法。 该方法包括在器件晶片的第一面上构图第一掩模，第一掩模至少构图梳状结构的横向尺寸和大型器件结构的轮廓。 蚀刻第一沟槽，第一沟槽在单个深刻蚀工艺中限定至少梳状结构的横向尺寸和大型器件结构的轮廓。 衰减蚀刻可以用在器件晶片的一个或两个面上，用于产生至少部分地凹入器件晶片的相应表面下方的结构。 可以在器件晶片的一个或两个面上使用双掩模蚀刻工艺，用于产生至少部分地凹陷到从器件晶片的相应面相互变化的深度的结构。

公开(公告)号：US09493339B2

公开(公告)日：2016-11-15

申请号：US14644184

申请日：2015-03-10

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Tamio Ikehashi

IPC: H01L29/84 ,  B81B3/00

CPC classification number: B81B3/0021 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0127 ,  G01L9/0073

Abstract: According to an embodiment, a MEMS includes a substrate; a substrate; a membrane arranged above the substrate; a first conductor with a first plane, the first conductor being connected to the membrane; and a second conductor with a second plane facing the first plane, the second conductor being arranged with a gap between the first conductor and the second conductor, wherein relative positions of the first conductor and the second conductor change in a direction in which an area of the first plane facing the second plane changes.

Abstract translation: 根据实施例，MEMS包括基板; 底物; 布置在所述基板上方的膜; 具有第一平面的第一导体，所述第一导体连接到所述膜; 以及具有面向所述第一平面的第二平面的第二导体，所述第二导体在所述第一导体和所述第二导体之间布置有间隙，其中所述第一导体和所述第二导体的相对位置沿着 面对第二架飞机的第一架飞机改变了。