Abstract:
The invention relates to a modulatable infrared emitter comprising a MEMS heating element and an actuator, wherein the actuator triggers shape and/or structure changes of the MEMS heating element. Said change in shape and/or structure of the MEMS heating element may vary the ratio of the emitting area to the total area, thereby producing a change in intensity of the emitted infrared beam. The invention further relates to a manufacturing method for the infrared emitter, a method for modulated emission of infrared radiation using the infrared emitter, and preferred uses of the infrared emitter. In further preferred aspects the invention relates to a system comprising the infrared emitter and a control device for regulating the actuator.
Abstract:
A capacitive accelerometer includes a proof mass, first and second fixed capacitive electrodes, and a DC biasing element arranged to apply a DC voltage (VB) to the proof mass based on a threshold acceleration value. A first closed loop circuit is arranged to detect a signal resulting from displacement of the proof mass and control the pulse width modulation signal generator to apply the first and second drive signals V1, V2 with a variable mark:space ratio. A second closed loop circuit keeps the mark:space ratio constant and to change the magnitude, VB, of the DC voltage applied to the proof mass by the DC biasing element so as to provide a net electrostatic restoring force on the proof mass for balancing the inertial force of the applied acceleration and maintaining the proof mass at a null position, when the applied acceleration is greater than a threshold acceleration value.
Abstract:
[Object] To be capable of promptly performing a switching operation of a switch.[Solving Means] In a switching apparatus according to an embodiment of the present technology, a movable electrode includes a first movable electrode piece, a second movable electrode piece, and a movable contact point. A first fixed electrode includes first and second fixed electrode pieces, the first and second fixed electrode pieces facing each other with the first movable electrode piece disposed between the first and second fixed electrode pieces, the first fixed electrode piece facing the first movable electrode piece with a gap narrower than a gap between the second fixed electrode piece and the first movable electrode piece. A second fixed electrode includes third and fourth fixed electrode pieces, the third and fourth fixed electrode pieces facing each other with the second movable electrode piece disposed between the third and fourth fixed electrode pieces, the third fixed electrode piece facing the second movable electrode piece with a gap narrower than a gap between the fourth fixed electrode piece and the second movable electrode piece. A first fixed contact point is in contact with the movable contact point, the movable contact point moving in a first direction by an electrostatic attractive force between the movable electrode and the first fixed electrode. A second fixed contact point is in contact with the movable contact point, the movable contact point moving in a second direction opposite to the first direction by an electrostatic attractive force between the movable electrode and the second fixed electrode.
Abstract:
A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.
Abstract:
Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.
Abstract:
The invention relates to a capacitive micromechanical sensor structure comprising a stator structure rigidly anchored to a substrate and a rotor structure movably anchored by means of spring structures to the substrate. The stator structure has a plurality of stator finger support beams and the rotor structure has a plurality of rotor finger support beams. Stator fingers along the stator finger support beam of the stator structure extend into rotor gaps along the rotor finger support beam of the rotor structure, and rotor fingers along the rotor finger support beam of the rotor structure extend into stator gaps along the stator finger support beam of the stator structure.
Abstract:
An actuator for moving a platform having electrical connections is provided. The actuator includes an outer frame connected to an inner frame by one or more spring elements that are electrically conductive. The actuator further includes one or more comb drive actuators that apply a controlled force between the outer frame and the inner frame. Each of the comb drive actuators includes one or more comb drives. Moreover, a method for moving a platform having electrical connections is also provided. The method includes connecting an outer frame to an inner frame using one or more spring elements that are electrically conductive. The method further includes generating a controlled force using one or more comb drive actuators. Each of the comb drive actuators includes one or more comb drives. In addition, the method includes applying the controlled force between the outer frame and the inner frame.
Abstract:
An actuator includes: an electrostatic actuation mechanism including a stationary electrode and a movable electrode; a first movable part driven by the electrostatic actuation mechanism; a first elastic support part that elastically supports the first movable part; an electret formed in at least one of the stationary electrode and the movable electrode; and a drive control unit that controls application of voltage to the electrostatic actuation mechanism. In the actuator a plurality of stable states are set in which the first movable part is positioned at a stable position at which an electrostatic force generated by the electret matches with an elastic force exerted by the first elastic support part or at a stable position near such stable position. By applying a voltage to the electrostatic actuation mechanism, the first movable part may be displaced from any stable position to another stable position.
Abstract:
Methods of measuring displacement of a movable mass in a microelectromechanical system (MEMS) include driving the mass against two displacement-stopping surfaces and measuring corresponding differential capacitances of sensing capacitors such as combs. A MEMS device having displacement-stopping surfaces is described. Such a MEMS device can be used in a method of measuring properties of an atomic force microscope (AFM) having a cantilever and a deflection sensor, or in a temperature sensor having a displacement-sensing unit for sensing a movable mass permitted to vibrate along a displacement axis. A motion-measuring device can include pairs of accelerometers and gyroscopes driven 90° out of phase.
Abstract:
A method of reactive ion etching a substrate 46 to form at least a first and a second etched feature (42, 44) is disclosed. The first etched feature (42) has a greater aspect ratio (depth:width) than the second etched feature (44). In a first etching stage the substrate (46) is etched so as to etch only said first feature (42) to a predetermined depth. Thereafter in a second etching stage, the substrate (46) is etched so as to etch both said first and said second features (42, 44) to a respective depth. A mask (40) may be applied to define apertures corresponding in shape to the features (42, 44). The region of the substrate (46) in which the second etched feature (44) is to be produced is selectively masked with a second maskant (50) during the first etching stage, The second maskant (50) is then removed prior to the second etching stage.