公开(公告)号：US20080105558A1

公开(公告)日：2008-05-08

申请号：US11927680

申请日：2007-10-30

Applicant: Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

Inventor： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

IPC: C25D5/10

CPC classification number: B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

Abstract translation: 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

公开(公告)号：US20070045121A1

公开(公告)日：2007-03-01

申请号：US11435809

申请日：2006-05-16

Applicant: Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

Inventor： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

IPC: C25D5/02

CPC classification number: B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

Abstract translation: 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

公开(公告)号：US20060283710A1

公开(公告)日：2006-12-21

申请号：US10272254

申请日：2002-10-15

Applicant: Adam Cohen ,  Gang Zhang ,  Qui Le

Inventor： Adam Cohen ,  Gang Zhang ,  Qui Le

IPC: C25D5/02

CPC classification number: B81C1/0038 ,  B33Y10/00 ,  B81C1/00619 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D7/12 ,  C25D17/02 ,  C25D21/14 ,  H01L21/2885 ,  H01L21/76885 ,  H05K3/241

Abstract: Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the electrochemical extrusion process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of a multi-layer electrochemical fabrication process.

Abstract translation: 本发明的各种实施例提供了通过电化学挤出方法形成结构（例如HARMS型结构）的技术。 优选的实施方案通过沉积通过无阳极适应的接触掩模进行挤出过程，其最初被压在基底上，然后随着沉积增厚逐渐拉开或分离。 沉积图案可以通过在掩模和衬底元件之间包括更复杂的相对运动而在沉积过程中变化。 这种复杂运动可以包括旋转分量或具有不与分离轴平行的分量的平移运动。 可以通过将电化学挤出工艺与多层电化学制造工艺的选择性沉积，覆盖沉积，平坦化，蚀刻和多层操作组合来形成更复杂的结构。

公开(公告)号：US20060201812A1

公开(公告)日：2006-09-14

申请号：US11328697

申请日：2006-01-10

Applicant: William Grande ,  Gary Fino

Inventor： William Grande ,  Gary Fino

IPC: G01N27/447

CPC classification number: B29C66/1122 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B29C33/3878 ,  B29C33/428 ,  B29C65/48 ,  B29C65/52 ,  B29C66/232 ,  B29C66/5326 ,  B29C66/5346 ,  B29L2031/756 ,  B33Y10/00 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/0197

Abstract: The present invention relates to a process for producing a microfluidic device which involves providing a substrate with a surface and writing a first flowable material on the surface of the substrate. The first flowable material is then solidified to form spacer elements, each with a top surface distal from the surface of the substrate, and a second flowable material is written on the surface of the substrate. A cover having a surface is provided and applied to the substrate, with the surface of the cover contacting the top surfaces of the spacer elements. The second flowable material is solidified to form walls, where the walls, the surface of the substrate, and the surface of the cover form flow channels of a microfluidic device. The resulting microfluidic device is also disclosed.

Abstract translation: 本发明涉及一种用于生产微流体装置的方法，其涉及提供具有表面的基底并将第一可流动材料写在基底的表面上。 然后将第一可流动材料固化以形成间隔元件，每个间隔元件具有远离衬底表面的顶表面，并且第二可流动材料被写在衬底的表面上。 提供具有表面的盖并将其施加到基板，其中盖的表面接触间隔元件的顶表面。 第二可流动材料被固化以形成壁，其中壁，基底的表面和盖的表面形成微流体装置的流动通道。 还公开了所得的微流体装置。

公开(公告)号：US06790377B1

公开(公告)日：2004-09-14

申请号：US09493496

申请日：2000-01-28

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C03C1500

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法包括形成层，所述层的形成包括：a）使基底与第一制品接触，所述第一制品包括以支持物的形式设置的支撑体和适形掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述衬底上，所述第一图案对应于所述适形掩模图案的所述补体; 以及c）从所述基底中去除所述第一制品。 该方法还可以包括以下一个或多个：（1）选择性地沉积或非选择性地沉积一种或多种附加材料以完成层的形成，（2）在每次沉积之后或在所有沉积之后平坦化沉积的材料，以及/ 或（3）形成与先前形成的层相邻的层，以从多个附着层建立结构。 还公开了电镀制品和电镀装置。

公开(公告)号：US20030127336A1

公开(公告)日：2003-07-10

申请号：US10271574

申请日：2002-10-15

Applicant: MEMGen Corporation

Inventor： Adam L. Cohen ,  Gang Zhang ,  Qui T. Le ,  Michael S. Lockard ,  Dennis R. Smalley

IPC: C25D005/02

CPC classification number: B81C1/0038 ,  B33Y10/00 ,  B81C1/00619 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D7/12 ,  C25D17/02 ,  C25D21/14 ,  H01L21/2885 ,  H01L21/76885 ,  H05K3/241

Abstract: Various embodiments of the invention present techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion (ELEXnull) process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the ELEXnull process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of EFABnull.

公开(公告)号：US20030121791A1

公开(公告)日：2003-07-03

申请号：US10272255

申请日：2002-10-15

Applicant: University of Southern California

Inventor： Adam L. Cohen

IPC: C25D005/02

CPC classification number: B81C1/0038 ,  B33Y10/00 ,  B81C1/00619 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D7/12 ,  C25D17/02 ,  C25D21/14 ,  H01L21/2885 ,  H01L21/76885 ,  H05K3/241

Abstract: Various embodiments of the invention present techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion (ELEXnull) process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the ELEXnull process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of EFABnull.

Abstract translation: 本发明的各种实施方案提供了用于通过电化学挤出（ELEX TM）方法形成结构（例如HARMS型结构）的技术。 优选的实施方案通过沉积通过无阳极适应的接触掩模进行挤出过程，其最初被压在基底上，然后随着沉积增厚逐渐拉开或分离。 沉积图案可以通过在掩模和衬底元件之间包括更复杂的相对运动而在沉积过程中变化。 这种复杂运动可以包括旋转分量或具有不与分离轴平行的分量的平移运动。 可以通过将ELEX TM工艺与EFAB TM的选择性沉积，覆盖沉积，平坦化，蚀刻和多层操作组合来形成更复杂的结构。

公开(公告)号：US06557607B2

公开(公告)日：2003-05-06

申请号：US09791571

申请日：2001-02-26

Applicant: Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

Inventor： Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

IPC: B32B3100

CPC classification number: B81C99/008 ,  B29C64/00 ,  B33Y10/00 ,  B33Y30/00 ,  B81B2201/035 ,  B81C2201/0197 ,  Y10T156/12 ,  Y10T156/13 ,  Y10T156/14 ,  Y10T428/24355

Abstract: A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.

Abstract translation: 其上形成有多个与微结构的横截面相对应的多个横截面的薄膜的基板被放置在基板支架上。 衬底保持器被升高以将形成在衬底上的薄膜粘合到台的表面上，并且通过降低衬底保持器，将薄膜与衬底分离并转移到平台侧。 重复转印过程以在台上层压多个薄膜并形成微结构。 因此，提供了可以由诸如陶瓷的金属或绝缘体制造的具有高尺寸精度，特别是层压方向上的高分辨率的微结构，并且可以以结构元件的组合形式一起制造，并且 制造方法及其装置。

公开(公告)号：US20010040250A1

公开(公告)日：2001-11-15

申请号：US09858092

申请日：2001-05-15

Applicant: Memscap

Inventor： Catherine Charrier ,  Eric Bouchon ,  Alain Campo ,  Guy Imbert ,  Francois Valentin ,  Laurent Basteres

IPC: H01L021/8234

CPC classification number: B81C1/00158 ,  B81B3/007 ,  B81B2201/018 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2203/033 ,  B81C2201/0109 ,  B81C2201/0197 ,  H01G5/16 ,  H01H1/0036

Abstract: Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in: depositing a first metal layer on an oxide layer (2), said first metal layer being intended to form the fixed plate; depositing a metal ribbon (10, 11) on at least part of the periphery and on each side of the fixed plate (1), said ribbon being intended to serve as a spacer between the fixed plate (1) and the deformable membrane (20); depositing a sacrificial resin layer (15) over at least the area of said fixed plate (1); generating, by lithography, a plurality of wells in the surface of said sacrificial resin layer; depositing, by electrolysis, inside the wells formed in the sacrificial resin (15), at least one metal region intended to form the deformable membrane (20), this metal region extending between sections of the metal ribbon (10, 11) which are located on each side of said fixed plate (1); removing the sacrificial resin layer (15).

Abstract translation: 用于制造可变电容器或微型开关类型的电子部件的方法包括彼此相对定位的固定板（1）和可变形膜（20），其包括以下步骤：将第一金属层沉积在 氧化物层（2），所述第一金属层旨在形成所述固定板; 在固定板（1）的周边的至少一部分和每一侧上沉积金属带（10,11），所述带旨在用作固定板（1）和可变形膜（20）之间的间隔件 ）; 在所述固定板（1）的至少所述区域上沉积牺牲树脂层（15）; 通过光刻产生在所述牺牲树脂层的表面中的多个孔; 通过电解在形成在牺牲树脂（15）中的阱内沉积旨在形成可变形膜（20）的至少一个金属区域，该金属区域在位于金属带（10,11）的部分之间延伸 在所述固定板（1）的每一侧上; 去除牺牲树脂层（15）。

公开(公告)号：US20010014409A1

公开(公告)日：2001-08-16

申请号：US09823034

申请日：2001-03-29

Inventor： Adam L. Cohen

IPC: B21C037/00 ,  C25D001/00 ,  C25D001/10

CPC classification number: C25D1/003 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12431

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ion onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。