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公开(公告)号：US20240110038A1
公开(公告)日：2024-04-04
申请号：US18243372
申请日：2023-09-07
Applicant: PROMERUS, LLC
Inventor： PRAMOD KANDANARACHCHI , DOUG SKILSKYJ
IPC: C08K3/38 , C08F232/08 , C08J5/18 , C08J5/24 , C08K7/00
CPC classification number: C08K3/38 , C08F232/08 , C08J5/18 , C08J5/244 , C08J5/249 , C08K7/00 , C08J2345/00 , C08K2003/385 , C08K2201/005
Abstract: Embodiments in accordance with the present invention encompass compositions containing the polymer formed from a variety of polycycloolefinic monomers at least one of which monomer contains an additional unpolymerized ethylenic bond, hexagonal boron nitride, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, and very high thermal properties. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to very low dielectric properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others.
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公开(公告)号：US20240110003A1
公开(公告)日：2024-04-04
申请号：US18243390
申请日：2023-09-07
Applicant: PROMERUS, LLC
Inventor： RUSLAN BURTOVYY , PRAMOD KANDANARACHCHI , CHERYL BURNS , CAROLYN SCHERGER
IPC: C08G61/08 , C08F236/20 , C08K3/38 , C08K5/3492 , C08K5/5313 , C08L65/00 , H01Q1/38
CPC classification number: C08G61/08 , C08F236/20 , C08K3/38 , C08K5/3492 , C08K5/5313 , C08L65/00 , H01Q1/38 , C08G2261/3324 , C08K2003/385 , C08K2201/005 , C08L2201/02 , C08L2201/08 , C08L2203/16 , C08L2203/206
Abstract: Embodiments in accordance with the present invention encompass compositions containing the polymer formed from a variety of polycycloolefinic monomers optionally at least one of which monomer contains an additional unpolymerized ethylenic bond, organophosphorus compound, optionally hexagonal boron nitride, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, fire retardancy and very high thermal properties. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to excellent thermal and dielectric properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others. The films formed from the compositions of this invention has a UL-94 rating of V-0, dielectric constant (Dk) less than 2.7 and dielectric dissipation factor (Df) of less than 0.0009.
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公开(公告)号：US11945924B2
公开(公告)日：2024-04-02
申请号：US17766440
申请日：2020-12-17
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Songgang Chai , Qianfa Liu , Liangpeng Hao , Wei Liang
CPC classification number: C08J5/18 , C08K7/18 , C08K9/06 , C08L27/18 , H05K1/0373 , C08J2327/18 , C08J2427/18 , C08J2471/02 , C08K2201/005 , C08L2201/52 , C08L2203/16 , C08L2203/20 , C08L2205/025 , C08L2205/03 , H05K2201/0209
Abstract: The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.
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公开(公告)号：US20240101833A1
公开(公告)日：2024-03-28
申请号：US18314575
申请日：2023-05-09
Applicant: Palo Alto Research Center Incorporated
Inventor： Sepehr TEHRANI , Quentin VAN OVERMEERE , Scott Alan ELROD , Scott E. SOLBERG , Gabriel IFTIME , Ravi NEELAKANTAN , Bernard D. CASSE
IPC: C09D5/33 , C09D5/02 , C09D7/40 , C09D129/14 , C09D133/10
CPC classification number: C09D5/004 , C09D5/024 , C09D7/69 , C09D129/14 , C09D133/10 , C08K2003/3045 , C08K2201/005
Abstract: Disclosed herein in is a radiative cooling formulation including a solvent for providing a viscosity of a radiative cooling material for application onto a surface to be passively cooled. The radiative cooling formulation includes a binder for the radiative cooling material's integrity and bonding to the surface to be passively cooled. The radiative cooling formulation includes a polymer, which, in combination with the binder, provides one or more properties in the radiative cooling material, including a reflectance of or greater than 55% in a wavelengths range of 0.3 to 2.5 microns and a first thermal emissivity peak value greater than 0.85 at a first wavelength in a range of 8 to 13 microns (μm). For example, the polymer is a latex material including a styrene based copolymer.
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公开(公告)号：US11939450B2
公开(公告)日：2024-03-26
申请号：US17575695
申请日：2022-01-14
Applicant: DAIKIN INDUSTRIES, LTD.
Inventor： Hirofumi Mukae , Hirokazu Komori , Masaji Komori , Hideki Kono , Ayane Nakaue
IPC: C08K3/38 , B32B15/082 , B32B27/20 , B32B27/30 , C08F214/26 , H05K1/03 , H05K1/02
CPC classification number: C08K3/38 , B32B15/082 , B32B27/20 , B32B27/304 , C08F214/262 , C08F214/265 , H05K1/0373 , B32B2250/02 , B32B2264/10 , B32B2307/302 , B32B2457/08 , C08K2003/385 , C08K2201/005 , H05K1/0237
Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 μm and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 μm. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.
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Patent Agency Ranking
公开(公告)号：US11939449B2
公开(公告)日：2024-03-26
申请号：US17638056
申请日：2020-08-31
Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
Inventor： Atsushi Hirakawa
CPC classification number: C08K3/346 , C08G63/60 , C08K2201/003 , C08K2201/005
Abstract: A liquid crystal polyester composition is provided, containing a liquid crystal polyester and a plate-like inorganic filler, in which a ratio (D50/D50*) of median diameters of the plate-like inorganic filler is 3.0 to 6.0. The D50 is a median diameter of the plate-like inorganic filler measured by a laser diffraction method. The D50* is a median diameter of the plate-like inorganic filler measured by a centrifugal sedimentation method.
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公开(公告)号：US20240076493A1
公开(公告)日：2024-03-07
申请号：US18038828
申请日：2021-11-23
Applicant: SHPP GLOBAL TECHNOLOGIES B.V.
Inventor： Weiyun JI , Zheng WANG , Liang SHEN , Siguang JIANG , Gabrie HOOGLAND , Hariharan RAMALINGAM
CPC classification number: C08L79/08 , C08K3/013 , C08K3/22 , C08L81/06 , C08K2003/2227 , C08K2201/005
Abstract: A composition including particular amounts of a polyetherimide or a poly(arylene ether sulfone) and an inorganic filler is described herein. Molded samples of the composition can exhibit an advantageous combination of properties, and the composition can be used in various articles. Methods of making the composition are also described.
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58.发明授权公开(公告)号：US11920029B2
公开(公告)日：2024-03-05
申请号：US17164150
申请日：2021-02-01
Applicant: MOLDED FIBER GLASS COMPANIES
Inventor： Routian Gao , Christine Ann Ericksen , Dailene Marie Osborn , John Robert Thompson
CPC classification number: C08L67/02 , B32B15/08 , C08K3/08 , C08K3/30 , C08L35/02 , C08L63/10 , G01N23/04 , C08K2003/0856 , C08K2003/0887 , C08K2003/3045 , C08K2201/004 , C08K2201/005 , C08K2201/014 , G01N2223/618 , G01N2223/643 , G01N2223/645 , G01V15/00 , C08K3/30 , C08L67/06 , C08K3/08 , C08L67/06 , C08K3/08 , C08L63/10 , C08K3/30 , C08L63/10
Abstract: Provided are X-ray and metal detectable thermoset composites and methods of detecting the same. The present X-ray and metal detectable thermoset composites may be formed into trays, sheets, or other substrates suitable for use in food or pharmaceutical processing or manufacturing.
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公开(公告)号：US11912869B2
公开(公告)日：2024-02-27
申请号：US17431363
申请日：2020-02-04
Applicant: SHIN-ETSU CHEMICAL CO., LTD.
Inventor： Keita Kitazawa , Wataru Toya
CPC classification number: C08L83/04 , C08K3/28 , C08K2003/282 , C08K2201/001 , C08K2201/005 , C08L2205/025 , C08L83/04 , C08K3/22 , C08L83/00 , C08L83/04 , C08K3/28 , C08L83/00 , C08L83/04 , C08K2003/2227 , C08L83/00 , C08L83/04 , C08K2003/2296 , C08L83/00
Abstract: A non-curable thermal-conductive silicone composition contains essential components of: (A) an organopolysiloxane having a kinematic viscosity at 25° C. of 1,000,000 mm2/s or more in an amount of 5 to 20 mass % relative to a sum of the component (A) and a component (B); (B) a hydrolysable organopolysiloxane compound shown by the following general formula (1) in an amount of 80 to 95 mass % relative to the sum of the components (A) and (B); and (C) a heat conductive filler in an amount of 10 to 95 mass % relative to a total amount of the composition. A mixture of the components (A) and (B) has a molecular weight distribution Mw/Mn of 10 or more. R1 represents a monovalent hydrocarbon group having 1 to 10 carbon atoms optionally having a substituent. “m” represents an integer of 5 to 100.
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公开(公告)号：US11912863B2
公开(公告)日：2024-02-27
申请号：US17414646
申请日：2019-11-06
Applicant: MEP EUROPE B.V.
Inventor： Bernardus Antonius Gerardus Schrauwen
CPC classification number: C08L69/00 , C08K3/2279 , H05K1/0373 , H05K3/105 , C08K2003/2231 , C08K2003/2241 , C08K2201/005 , H05K2201/0129 , H05K2201/10098
Abstract: A thermoplastic composition including a) 20 to 90 wt. % of a thermoplastic resin, b) 0.1 to 80 wt. % of a laser direct structuring additive and c) 10 to 80 wt. % of ceramic filler particles which do not have a laser direct structuring additive function, wherein at least 80 wt. % of c) is TiO2, wherein the composition has a loss tangent measured at 40 GHz of at most 0.014, wherein the total amount of a), b) and c) is 95 to 100 wt. % with respect to the total composition, wherein the composition further includes f) one or more additives, wherein the total amount of the additives is 0.1 to 5 wt. %, 0.3 to 5 wt. % or 0.3 to 3 wt. % relative to the total weight of the composition.
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