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公开(公告)号：US11945924B2
公开(公告)日：2024-04-02
申请号：US17766440
申请日：2020-12-17
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Songgang Chai , Qianfa Liu , Liangpeng Hao , Wei Liang
CPC classification number: C08J5/18 , C08K7/18 , C08K9/06 , C08L27/18 , H05K1/0373 , C08J2327/18 , C08J2427/18 , C08J2471/02 , C08K2201/005 , C08L2201/52 , C08L2203/16 , C08L2203/20 , C08L2205/025 , C08L2205/03 , H05K2201/0209
Abstract: The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.
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Patent Agency Ranking
公开(公告)号：US11261305B2
公开(公告)日：2022-03-01
申请号：US16523753
申请日：2019-07-26
Applicant: Shengyi Technology Co., Ltd.
Inventor： Guangbin Chen , Qianfa Liu , Shanyin Yan , Xianping Zeng , Cuiming Du
Abstract: A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.
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公开(公告)号：US10400058B2
公开(公告)日：2019-09-03
申请号：US15534557
申请日：2015-05-27
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Huayang Deng , Zengbiao Huang , Qianfa Liu , Zhongqiang Yang , Peng Wang
IPC: C08G59/66 , B32B15/092 , C08J5/24 , C08G59/56 , C08L63/00 , C08G59/24 , C08G59/50 , C08J5/04 , C08J11/04 , C08K3/36 , C08J3/24 , C08J11/16 , C08J11/18
Abstract: Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.
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4.发明授权公开(公告)号：US11744013B2
公开(公告)日：2023-08-29
申请号：US15841439
申请日：2017-12-14
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Minshe Su , Duye Li , Shanyin Yan , Qianfa Liu , Zhongqiang Yang
CPC classification number: H05K1/0373 , B32B5/26 , B32B17/02 , B32B25/16 , C08J5/244 , C08J5/249 , H05K1/0237 , H05K1/0366 , B32B2262/101 , B32B2307/204 , C08J2300/24 , C08J2325/10 , C08J2400/26 , C08J2423/16 , H05K2201/0154 , H05K2201/0278 , H05K2201/068
Abstract: The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite includes (1) from 20 to 70 parts by weight of a thermosetting mixture, including (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.
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公开(公告)号：US11053352B2
公开(公告)日：2021-07-06
申请号：US16523735
申请日：2019-07-26
Applicant: Shengyi Technology Co., Ltd.
Inventor： Guangbin Chen , Qianfa Liu , Shanyin Yan , Xianping Zeng , Cuiming Du
IPC: C08K9/04 , C08G65/329 , C08F236/06 , C08J5/24 , C08K3/38 , C08K5/14 , C08K7/26 , C08L53/02 , C08F8/02 , C08F8/46
Abstract: A vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The vinyl thermosetting resin composition has a vinyl thermosetting resin, a curing agent, and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has only small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of a substrate.
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公开(公告)号：US20140377534A1
公开(公告)日：2014-12-25
申请号：US14368437
申请日：2011-12-29
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Minshe Su , Qianfa Liu
CPC classification number: H05K1/0271 , B32B3/20 , B32B15/08 , B32B27/20 , B32B27/281 , B32B27/283 , B32B27/285 , B32B27/302 , B32B27/32 , B32B27/322 , B32B27/36 , B32B27/38 , B32B27/42 , B32B2264/0257 , B32B2264/102 , B32B2264/104 , B32B2264/105 , B32B2264/108 , B32B2307/704 , B32B2307/734 , B32B2457/00 , H05K1/0306 , H05K3/022 , H05K3/386 , H05K3/4611 , H05K2201/0137 , Y10T156/1056 , Y10T428/249982 , Y10T428/249985
Abstract: A circuit substrate, including a porous glass film with the volume percentage ratio of the glass being above 45%, a resin adhesion layer located on either side of the glass film respectively, and a metal foil located in the outside of resin adhesion layer. The glass film, the resin adhesion layer and the metal foil join together through suppressing, and the resin of the resin adhesion layer is filled in the gaps of the glass film. The circuit substrate employs a porous glass film as a carrier material, so that the resin adhesion layer and the surface of the glass film surface have a good binding force, and the CTE of the circuit substrate in the direction of X and Y is reduced compared to instances before, and has good formability, which is simple and convenient in process operation. In addition, also provided is a manufacturing method for a circuit substrate.
Abstract translation: 电路基板包括玻璃的体积比率高于45％的多孔玻璃膜，分别位于玻璃膜两侧的树脂粘合层和位于树脂粘合层外侧的金属箔。 通过抑制将玻璃膜，树脂粘合层和金属箔接合在一起，树脂粘合层的树脂填充在玻璃膜的间隙中。 电路基板采用多孔玻璃膜作为载体材料，使得树脂粘附层和玻璃膜表面的表面具有良好的结合力，并且电路基板在X和Y方向上的CTE减小了比较 以前的实例，具有良好的可加工性，这在过程操作中简单方便。 此外，还提供了一种用于电路基板的制造方法。
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