公开(公告)号：US11936093B2

公开(公告)日：2024-03-19

申请号：US18363090

申请日：2023-08-01

Applicant: PELTBEAM INC.

Inventor： Mehdi Hatamian ,  Venkat Kalkunte

IPC: H01Q1/02 ,  G01J5/12 ,  H01Q1/22

CPC classification number: H01Q1/02 ,  H01Q1/2283 ,  G01J5/12 ,  G01J2005/123

Abstract: A communication apparatus includes an antenna array having a plurality of antenna elements, a plurality of thermoelectric devices that are arranged on the plurality of antenna elements of the antenna array, and a processor that determines which subset of the antenna elements are in an activated state and which are in a deactivated state, and further executes an activation or a deactivation of each of the plurality of thermoelectric devices in synchronization with the activated state or the deactivated state of different subsets of antenna elements of the plurality of antenna elements. Further, the processor controls each of the first plurality of thermoelectric devices to apply adaptive cooling on a first subset of antenna elements to maintain a corresponding temperature in a first specified range and apply adaptive cooling on a second subset of antenna elements to maintain a corresponding temperature in a second specified range.

公开(公告)号：US20240068875A1

公开(公告)日：2024-02-29

申请号：US18496316

申请日：2023-10-27

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KOUHEI TAKAHASHI ,  MASAKI FUJIKANE ,  HIROYUKI TANAKA

IPC: G01J5/12 ,  H10N10/17

CPC classification number: G01J5/12 ,  H10N10/17 ,  G01J2005/123

Abstract: A thermopile sensor according to the present disclosure includes a p-type portion and an n-type portion. The p-type portion has a first phononic crystal in which first holes are arranged in a plan view. The n-type portion has a second phononic crystal in which second holes are arranged in a plan view. The p-type portion and the n-type portion constitute a thermocouple. The boundary scattering frequency of phonons in the first phononic crystal is different from the boundary scattering frequency of phonons in the second phononic crystal. Alternatively, the ratio of the sum of the areas of the first holes to the area of the first phononic crystal in a plan view is different from the ratio of the sum of the areas of the second holes to the area of the second phononic crystal in a plan view.

公开(公告)号：US11874174B2

公开(公告)日：2024-01-16

申请号：US18090511

申请日：2022-12-29

Applicant: PixArt Imaging Inc.

Inventor： Chih-Ming Sun ,  Sen-Huang Huang

IPC: G01J5/12 ,  G01J1/02 ,  G01J5/04 ,  G01J5/10 ,  G01J1/42 ,  G01J5/08 ,  G01J5/14 ,  G01J5/00

CPC classification number: G01J5/12 ,  G01J1/0271 ,  G01J1/4228 ,  G01J5/045 ,  G01J5/0853 ,  G01J5/10 ,  G01J5/14 ,  G01J2005/0077 ,  G01J2005/123

Abstract: A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.

公开(公告)号：US11742561B2

公开(公告)日：2023-08-29

申请号：US17986043

申请日：2022-11-14

Applicant: PELTBEAM INC.

Inventor： Mehdi Hatamian ,  Venkat Kalkunte

IPC: H01Q1/02 ,  H01Q1/22 ,  G01J5/12

CPC classification number: H01Q1/02 ,  H01Q1/2283 ,  G01J5/12 ,  G01J2005/123

Abstract: A communication apparatus includes an antenna array having a plurality of antenna elements, and a plurality of thermoelectric devices that are arranged on the plurality of antenna elements of the antenna array. The communication apparatus further includes a processor that determines which subset of the antenna elements of the plurality of antenna elements are in an activated state and which are in a deactivated state, and further control each of the plurality of thermoelectric devices to execute an activation or a deactivation of each of the plurality of thermoelectric devices in synchronization with the activated state or the deactivated state of different subsets of antenna elements of the plurality of antenna elements.

公开(公告)号：US20190019838A1

公开(公告)日：2019-01-17

申请号：US15647284

申请日：2017-07-12

Applicant: Meridian Innovation Pte Ltd

Inventor： Piotr KROPELNICKI ,  Ilker Ender OCAK ,  Paul Simon PONTIN

IPC: H01L27/146 ,  H01L31/09 ,  G01J5/08 ,  G01J5/12 ,  H01L31/0224 ,  G01J5/04 ,  G01J5/16

CPC classification number: H01L27/14669 ,  B81C1/00 ,  G01J5/0225 ,  G01J5/024 ,  G01J5/046 ,  G01J5/048 ,  G01J5/0853 ,  G01J5/12 ,  G01J5/16 ,  G01J2005/123 ,  H01L27/146 ,  H01L27/14612 ,  H01L27/14629 ,  H01L27/14643 ,  H01L27/14649 ,  H01L31/0224 ,  H01L31/09

Abstract: Device and method of forming the devices are disclosed. The method includes providing a substrate prepared with transistor and sensor regions. The substrate is processed by forming a lower sensor cavity in the substrate, filling the lower sensor cavity with a sacrificial material, forming a dielectric membrane in the sensor region, forming a transistor in the transistor region and forming a micro-electrical mechanical system (MEMS) component on the dielectric membrane in the sensor region. The method continues by forming a back-end-of-line (BEOL) dielectric having a plurality of interlayer dielectric (ILD) layers with metal and via levels disposed on the substrate for interconnecting the components of the device. The metal lines in the metal levels are configured to define an upper sensor cavity over the lower sensor cavity, and metal lines of a first metal level of the BEOL dielectric are configured to define a geometry of the MEMS component.

公开(公告)号：US20180231420A1

公开(公告)日：2018-08-16

申请号：US15749794

申请日：2016-07-05

Applicant: DENSO CORPORATION

Inventor： Keita SAITOU ,  Atusi SAKAIDA ,  Toshikazu HARADA ,  Hirohito MATSUI ,  Yukikatsu OZAKI

IPC: G01J5/12 ,  G01J5/08 ,  G01J5/04 ,  H01L35/32

CPC classification number: G01J5/12 ,  G01J1/02 ,  G01J5/02 ,  G01J5/046 ,  G01J5/0809 ,  G01J2005/123 ,  H01L35/32 ,  H01L35/34

Abstract: In a radiant heat sensor, first and second thermoelectric members are alternately arrayed one by one in a direction along a first surface of a plate-shaped member so as to be separated from each other, and each of the first and second thermoelectric members configure a portion of the first surface. First conductor patterns extend the first surface, disposed on the first surface so as to span a single first thermoelectric member and a single second thermoelectric member that are adjacent to each other, and configure hot contact portions between the first and second thermoelectric members. Second conductor patterns extend along the first surface, disposed on the first surface so as to span a single first thermoelectric member and a single second thermoelectric member that are adjacent to each other, and configure cold contact portions between the first and second thermoelectric members.

公开(公告)号：US20180058936A1

公开(公告)日：2018-03-01

申请号：US15394844

申请日：2016-12-30

Applicant: PixArt Imaging Inc.

Inventor： Chih-Ming Sun ,  Sen-Huang Huang

IPC: G01J5/12 ,  G01J5/14 ,  G01J5/08

CPC classification number: G01J5/12 ,  G01J1/0271 ,  G01J1/4228 ,  G01J5/045 ,  G01J5/0853 ,  G01J5/10 ,  G01J5/14 ,  G01J2005/0077 ,  G01J2005/123

Abstract: A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.

公开(公告)号：US09887339B2

公开(公告)日：2018-02-06

申请号：US14384993

申请日：2013-02-11

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Harry Hedler ,  Ingo Kuehne ,  Markus Schieber ,  Joerg Zapf

IPC: H01B12/00 ,  G01J5/02 ,  G01J5/12 ,  H01L35/32 ,  H01L35/34 ,  H01L35/00

CPC classification number: H01L35/00 ,  G01J5/02 ,  G01J5/023 ,  G01J5/12 ,  G01J2005/123 ,  H01L35/32 ,  H01L35/34 ,  Y10T29/49201

Abstract: An infrared sensor with a microstructure has a multiplicity of sensor rods protruding from a sensor base and arranged axially parallel to one another. Each of the sensor rods is designed as a thermocouple, in that a first rod end, arranged on the sensor base, is electrically connected to an opposite free second rod end by both a first and a second electrically conductive rod element. The two rod elements have a different Seebeck coefficient, and the first rod element is formed as a hollow profile and the second rod element is arranged in the first rod element such that each thermocouple is formed as a single rod with a small standing area on the sensor base.

公开(公告)号：US09814410B2

公开(公告)日：2017-11-14

申请号：US14692871

申请日：2015-04-22

Applicant: Stryker Corporation

Inventor： Marko N. Kostic ,  Jonathan Mark Greenbank ,  Christopher J. Cummings

IPC: A61B5/11 ,  G01J5/00 ,  A61G7/05 ,  A61G13/10 ,  G01D5/40 ,  G01G19/44 ,  G01J5/14 ,  A61G5/10

CPC classification number: A61B5/11 ,  A61B5/1115 ,  A61G5/101 ,  A61G7/05 ,  A61G7/0527 ,  A61G7/0528 ,  A61G13/10 ,  G01D5/40 ,  G01G19/44 ,  G01G19/445 ,  G01J5/00 ,  G01J5/0025 ,  G01J5/12 ,  G01J5/14 ,  G01J2005/0077 ,  G01J2005/123

Abstract: A person support apparatus includes one or more thermal image sensors whose outputs are analyzed to perform one or more functions. Such functions include automatically turning on a brake, automatically turning on one or more lights, detecting when a patient associated with the person support apparatus has fallen, enabling a propulsion system of the patient support apparatus to be used, automatically controlling one or more environmental controls, and/or automatically arming an exit detection system after entry of a patient onto the person support apparatus. Multiple thermal images may be generated from multiple sensors to generate stereoscopic thermal images of portions of the person support apparatus and its surroundings.

公开(公告)号：US09635284B2

公开(公告)日：2017-04-25

申请号：US15056960

申请日：2016-02-29

Applicant: FLIR Systems, Inc.

Inventor： Robert G. Benson ,  Thomas J. Scanlon ,  Paul A. Czerepuszko

IPC: H01L27/14 ,  H04N5/33 ,  G01N21/3518 ,  H04N5/225 ,  H01L31/18 ,  G01J3/28 ,  G01J3/02 ,  G01J5/12 ,  H01L31/0304 ,  H01L31/0352 ,  G01J5/08 ,  G01J5/06 ,  G01N21/17 ,  G01N21/3504 ,  G01J5/00

CPC classification number: H04N5/33 ,  G01J3/0286 ,  G01J3/2803 ,  G01J5/06 ,  G01J5/061 ,  G01J5/0806 ,  G01J5/0862 ,  G01J5/12 ,  G01J2005/0077 ,  G01J2005/0081 ,  G01J2005/123 ,  G01N21/3504 ,  G01N21/3518 ,  G01N2021/1793 ,  G01N2021/3531 ,  H01L31/03042 ,  H01L31/03046 ,  H01L31/035236 ,  H01L31/18 ,  H04N5/2253

Abstract: An infrared camera system is provided to detect absorption of infrared radiation in a selected spectral bandwidth. In one example, an infrared camera system includes a lens adapted to receive infrared radiation from a survey scene comprising one or more gasses. The infrared camera system also includes a focal plane array comprising a plurality of quantum well infrared photo detectors (QWIPs). The QWIPs are tuned to detect a limited spectral bandwidth of the infrared radiation corresponding to at least a portion of an infrared absorption band of the one or more gasses. The infrared camera system also includes an optical band pass filter positioned substantially between the lens and the focal plane array. The optical band pass filter is adapted to filter the infrared radiation to a wavelength range substantially corresponding to the limited spectral bandwidth of the QWIPs before the infrared radiation is received by the focal plane array.