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    MEASURING INSTRUMENT USING LIGHT BEAM
    52.
    发明申请
    MEASURING INSTRUMENT USING LIGHT BEAM 有权
    使用光束测量仪器

    公开(公告)号：US20150355016A1

    公开(公告)日：2015-12-10

    申请号：US14730762

    申请日：2015-06-04

    Applicant: SAMCO INC.

    Inventor： Kiyoshi HASEGAWA ,  Hiroshi KAWAMURA ,  Peter WOOD

    IPC: G01J1/02 ,  G01J1/42 ,  G01N21/55

    CPC classification number: G01J1/0238 ,  G01J1/4257 ,  G01N21/55 ,  G01N2021/8427 ,  G01N2201/025 ,  G01N2201/1087

    Abstract: The present invention provides a light beam measuring instrument that can securely receive light reflected by a sample. The light beam measuring instrument 1 includes an optical axis tilting mechanism 13 that includes a first tilting mechanism 131 and a second tilting mechanism 132. From the optical axis A1 of irradiation light beam emitted from a light beam source 112, the first tilting mechanism 131 tilts the optical axis A1 about the first tilting axis T1. The second tilting mechanism 132 tilts the optical axis A1 about the second tilting axis T2. The light beam measuring instrument 1 can receive the light reflected by the semiconductor chip C by means of operation of the optical axis tilting mechanism 13 even if the light reflected by the semiconductor chip C is tilted. Accordingly, this apparatus can securely perform measurement or inspection using the light beam.

    Abstract translation: 本发明提供了一种可以安全地接收由样品反射的光的光束测量仪器。 光束测量仪1包括光轴倾斜机构13，其包括第一倾斜机构131和第二倾斜机构132.从光束源112发射的照射光束的光轴A1，第一倾斜机构131倾斜 围绕第一倾斜轴线T1的光轴A1。 第二倾斜机构132围绕第二倾斜轴T2倾斜光轴A1。 即使由半导体芯片C反射的光倾斜，光束测量仪器1也可以通过光轴倾斜机构13的操作来接收由半导体芯片C反射的光。 因此，该装置可以可靠地执行使用光束的测量或检查。

    SINGLE ULTRA-PLANAR WAFER TABLE STRUCTURE FOR BOTH WAFERS AND FILM FRAMES
    54.
    发明申请
    SINGLE ULTRA-PLANAR WAFER TABLE STRUCTURE FOR BOTH WAFERS AND FILM FRAMES 审中-公开
    单个超平面波形表结构，用于两个波形和薄膜框架

    公开(公告)号：US20150214090A1

    公开(公告)日：2015-07-30

    申请号：US14424275

    申请日：2013-09-02

    Applicant: SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS PTE LTD

    Inventor： Jian Ping Jin ,  Leng Kheam Lee

    IPC: H01L21/683

    CPC classification number: H01L21/681 ,  B25J11/0095 ,  B25J15/0616 ,  B25J15/0658 ,  B25J15/0666 ,  G01B11/27 ,  G01N21/9501 ,  G01N2201/025 ,  H01L21/67144 ,  H01L21/67706 ,  H01L21/6838 ,  H01L21/68757 ,  Y10T29/49826

    Abstract: A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.

    Abstract translation: 提供适于处理晶片和薄膜框架的单个晶片台表面的晶片台结构包括：底盘，其具有通过形成在内部基板表面中或之上的一组脊形成在其中的一组隔室; 设置在所述一组基座托盘隔室内的可硬化流体可渗透隔室材料; 以及一组开口，形成在基托盘内表面中，通过该组开口，硬化的隔室材料可暴露于负压或正压。 基托盘包括第一陶瓷材料（例如瓷器），并且可硬化隔室材料包括第二陶瓷材料。 底盘和隔间材料可以通过标准加工工艺同时加工，从而以基本上相同的速率平坦化基托和硬化隔间材料的暴露的外表面，以形成高度或超平面的晶片台面。

    INSPECTION AND REPAIR MODULE
    55.
    发明申请
    INSPECTION AND REPAIR MODULE 有权
    检查和维修模块

    公开(公告)号：US20150124237A1

    公开(公告)日：2015-05-07

    申请号：US14377110

    申请日：2013-02-28

    Applicant: SMART APPLICATIONS LIMITED

    Inventor： Michael Trevor Zinn ,  Quinton Encombe Woods ,  Petrus Hendrik Buys

    IPC: G01N21/954 ,  E04G23/00 ,  G01C19/00

    CPC classification number: G01N21/954 ,  E04G23/008 ,  F23J13/00 ,  F23J99/00 ,  F23J2213/60 ,  G01C19/00 ,  G01N2201/023 ,  G01N2201/025 ,  G01N2201/062 ,  G03B37/005

    Abstract: The invention relates to an inspection and repair module for an internal side wall of a vertically erected structure, with the module including a carrier for supporting at least one data recording mechanism and being securable to a hoist, and for an inspection and repair module for an internal wall of a conduit with the module including propulsion means comprising a set of driven tracked wheels controllable by a controller carried by the carrier and configured to provide, within a conduit, longitudinal forward and reverse motion.

    Abstract translation: 本发明涉及一种用于垂直竖立结构的内侧壁的检查和修理模块，其中该模块包括用于支撑至少一个数据记录机构并可安装在起重机上的托架，以及用于检查和修理模块 具有模块的管道的内壁包括推进装置，该推进装置包括一组驱动的履带轮，该组驱动的履带轮可由载体承载的控制器控制，并配置成在管道内提供纵向前进和后退运动。

    LASER SCANNING MICROSCOPE SYSTEM AND METHOD OF SETTING LASER-LIGHT INTENSITY VALUE
    56.
    发明申请
    LASER SCANNING MICROSCOPE SYSTEM AND METHOD OF SETTING LASER-LIGHT INTENSITY VALUE 有权
    激光扫描显微镜系统和设置激光强度值的方法

    公开(公告)号：US20150115176A1

    公开(公告)日：2015-04-30

    申请号：US14516798

    申请日：2014-10-17

    Applicant: Sony Corporation

    Inventor： Shinji Watanabe ,  Kazuki Aisaka

    IPC: G01N21/64

    CPC classification number: G01N21/6458 ,  G01N21/6428 ,  G01N2021/6439 ,  G01N2201/025 ,  G01N2201/12

    Abstract: A method of setting a laser-light intensity value includes: emitting laser light, the laser light being excitation light, a fluorescent-dyed biological sample being irradiated with the excitation light and emitting light; detecting fluorescence emitted by the biological sample, and outputting a signal corresponding to a brightness value; prestoring relation information, the relation information including the plurality of laser-light intensity values, and information on at least one possible correlation between a phototoxicity degree and the brightness value in relation to each of the laser-light intensity values, the phototoxicity to the biological sample resulting from the laser light; generating a fluorescence image having the brightness value based on the output signal; calculating a brightness value representative of a ROI area based on the generated fluorescence image; and referring to the relation information, and determining a laser-light intensity value satisfying tolerance of the phototoxicity based on the calculated representative brightness value.

    Abstract translation: 设置激光强度值的方法包括：发射激光，激光作为激发光，荧光染色的生物样品被激发光照射并发射光; 检测由生物样品发出的荧光，并输出与亮度值对应的信号; 预定关系信息，包括多个激光光强度值的关系信息，以及关于每个激光强度值的光毒性度和亮度值之间的至少一个可能的相关性的信息，对生物学的光毒性 由激光产生的样品; 产生具有基于输出信号的亮度值的荧光图像; 基于所生成的荧光图像计算代表ROI区域的亮度值; 并且参考关系信息，并且基于计算的代表亮度值来确定满足光毒性的容许度的激光光强度值。

    Methods for gas leak detection and localization in populated areas using isotope ratio measurements
    57.
    发明申请
    Methods for gas leak detection and localization in populated areas using isotope ratio measurements 有权
    使用同位素比率测量在人口稠密地区进行气体泄漏检测和定位的方法

    公开(公告)号：US20150007638A1

    公开(公告)日：2015-01-08

    申请号：US14493853

    申请日：2014-09-23

    Applicant: Picarro, Inc.

    Inventor： Chris W. Rella ,  Eric R. Crosson ,  Michael R. Woelk ,  Sze Meng Tan ,  Yonggang He ,  David Steele

    IPC: G01M3/04 ,  G01N33/00

    CPC classification number: G01N33/0009 ,  G01M3/20 ,  G01M3/38 ,  G01N21/01 ,  G01N21/3504 ,  G01N21/39 ,  G01N2021/0314 ,  G01N2201/025

    Abstract: Improved gas leak detection from moving platforms is provided. Automatic horizontal spatial scale analysis can be performed in order to distinguish a leak from background levels of the measured gas. Source identification can be provided by using isotopic ratios and/or chemical tracers to distinguish gas leaks from other sources of the measured gas. Multi-point measurements combined with spatial analysis of the multi-point measurement results can provide leak source distance estimates. Qualitative source identification is provided. These methods can be practiced individually or in any combination.

    Abstract translation: 提供了从移动平台改进的气体泄漏检测。 可以进行自动水平空间尺度分析，以区分泄漏与被测气体的背景水平。 可以通过使用同位素比率和/或化学示踪剂来提供源识别，以区分气体泄漏与测量气体的其他来源。 多点测量结合多点测量结果的空间分析可以提供泄漏源距离估计。 提供定性来源识别。 这些方法可以单独或以任何组合实施。

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