公开(公告)号：US20150079343A1

公开(公告)日：2015-03-19

申请号：US14387272

申请日：2013-03-25

Applicant: Sumitomo Electric Fine Polymer, Inc.

Inventor： Makoto Nakabayashi ,  Kazuaki Ikeda

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0306 ,  H05K1/0373 ,  H05K3/381 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0358 ,  H05K2201/09136 ,  H05K2203/092 ,  Y10T428/24355 ,  Y10T428/249974

Abstract: The invention offers a fluororesin substrate that has a dielectric layer being mainly composed of fluororesin and being formed on a metal conductor, that sufficiently suppresses the occurrence of warpage at the time of the reflow, and that enables the exhibiting of sufficiently outstanding high-frequency characteristics, the dielectric layer including hollow glass beads; a fluororesin substrate that has a metal conductor having a surface roughness, Rz, of 2.0 μm or less; a fluororesin substrate that has fluororesin irradiated with an ionizing radiation at an exposure dose of 0.01 to 500 kGy; and a fluororesin substrate that has fluororesin being one or two or more of polytetrafluoroethylene (PTFE), a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), a tetrafluoroethylene-hexafluoropropylene copolymer (FEP), and a tetrafluoroethylene-ethylene copolymer (ETFE).

Abstract translation: 本发明提供一种氟树脂基材，其具有主要由氟树脂组成的介电层，并形成在金属导体上，充分抑制了回流时的翘曲发生，并且能够表现出足够突出的高频特性 介电层包括中空玻璃珠; 具有2.0μm以下的表面粗糙度Rz的金属导体的氟树脂基板; 以0.01〜500kGy的曝光剂量照射电离辐射的氟树脂的氟树脂基材; 以及具有氟树脂为聚四氟乙烯（PTFE），四氟乙烯 - 全氟烷基乙烯基醚共聚物（PFA），四氟乙烯 - 六氟丙烯共聚物（FEP）和四氟乙烯 - 乙烯共聚物（ETFE）中的一种或两种以上的氟树脂基材。

公开(公告)号：US08217270B2

公开(公告)日：2012-07-10

申请号：US11990860

申请日：2006-08-18

Applicant: Tadahiro Ohmi ,  Akinobu Teramoto ,  Akihiro Morimoto

Inventor： Tadahiro Ohmi ,  Akinobu Teramoto ,  Akihiro Morimoto

IPC: H05K1/03

CPC classification number: H05K1/024 ,  H05K3/4602 ,  H05K3/4626 ,  H05K3/4673 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0254

Abstract: A multilayered circuit board which is provided with a low-permittivity interlayer insulating film, and which can significantly improve the performance such as signal transmission characteristics of the multilayered circuit board such as a package and a printed board, because the surface in contact with the interlayer insulating film of the circuit board has no unevenness to eliminate the lowering of production yield and the deterioration of high-frequency signal transmission characteristics; and electronic equipment using the circuit board. The multilayered circuit board comprises, mounted on a substrate, plural wiring layers and plural insulating layers positioned between the plural wiring layers, wherein at least part of the plural insulating layers are composed of a porous insulating layer containing at least any of materials selected from a porous material group consisting of porous material, aerogel, porous silica, porous polymer, hollow silica and hollow polymer, and a non-porous insulating layer formed on at least one surface of the porous insulating layer and not containing the porous material group.

Abstract translation: 具有低介电常数层间绝缘膜的多层电路板，能够显着地提高诸如封装和印刷电路板的多层电路板的信号传输特性等性能，因为与中间层 电路板的绝缘膜没有不均匀性，消除了生产成本的降低和高频信号传输特性的恶化; 和使用电路板的电子设备。 多层电路板包括安装在基板上的多个布线层和位于多个布线层之间的多个绝缘层，其中多个绝缘层的至少一部分由多孔绝缘层组成，多孔绝缘层至少含有选自 由多孔材料，气凝胶，多孔二氧化硅，多孔聚合物，中空二氧化硅和中空聚合物组成的多孔材料组和形成在多孔绝缘层的至少一个表面上并且不包含多孔材料组的无孔绝缘层。

公开(公告)号：US20120058917A1

公开(公告)日：2012-03-08

申请号：US12593770

申请日：2008-04-04

Applicant: Johannes Adrianus Gaken ,  Azim Mohamedali

Inventor： Johannes Adrianus Gaken ,  Azim Mohamedali

IPC: C40B30/06 ,  C12N5/10 ,  C40B50/00 ,  C12Q1/68 ,  C12N15/63 ,  C40B40/02

CPC classification number: B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

Abstract: The invention relates to a nucleic acid comprising the following contiguous elements arranged in the 5 prime to 3 prime direction; a promoter; a selectable marker; a cloning site for receipt of a nucleic acid segment, said segment comprising a candidate miRNA target sequence; and a poly adenylation signal, said elements arranged such that a transcript directed by said promoter comprises said selectable marker, said candidate miRNA target sequence, and said poly adenylation signal in that order. Suitably the miRNA test sequence is or is derived from a 3′UTR. The invention also relates to methods for making and screening libraries.

Abstract translation: 本发明涉及一种核酸，其包含排列成5素质素至3个原子方向的以下邻接元件; 启动子 可选标记; 用于接收核酸片段的克隆位点，所述片段包含候选miRNA靶序列; 和聚腺苷酸化信号，所述元件排列成使得由所述启动子引导的转录物依次包含所述选择性标记，所述候选miRNA靶序列和所述多聚腺苷酸化信号。 适当地，miRNA测试序列是或源自3'UTR。 本发明还涉及制备和筛选文库的方法。

公开(公告)号：US20100159231A1

公开(公告)日：2010-06-24

申请号：US12645967

申请日：2009-12-23

Applicant: Chung-Kun CHO ,  Myung-Sup JUNG ,  Kwang-Hee KIM ,  Jae-Jun LEE ,  Kalinina FEDOSYA ,  Mahn Jong KIM ,  Chung Won PARK

Inventor： Chung-Kun CHO ,  Myung-Sup JUNG ,  Kwang-Hee KIM ,  Jae-Jun LEE ,  Kalinina FEDOSYA ,  Mahn Jong KIM ,  Chung Won PARK

IPC: C08K7/26 ,  C08K7/22 ,  C08K7/24 ,  B32B3/26 ,  C08K7/28

CPC classification number: H05K1/0373 ,  C08K5/1515 ,  C08K5/3415 ,  C08K7/28 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/249953 ,  Y10T428/249971 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same. In the above Chemical Formula 1, wherein B, L1, L2, Z1 and Z2 are the same as in defined in the specification.

Abstract translation: 公开了一种热固性树脂组合物，其包含由以下化学式1表示的热固性芳族低聚物，中空颗粒和溶剂，以及包含该热固性树脂组合物的板。 在上述化学式1中，其中B，L1，L2，Z1和Z2与说明书中定义相同。

公开(公告)号：US20100144924A1

公开(公告)日：2010-06-10

申请号：US12521502

申请日：2007-12-27

Applicant: Akihiko Yoshiwara ,  Junji Kodemura

Inventor： Akihiko Yoshiwara ,  Junji Kodemura

IPC: B05D5/12 ,  C08J9/32

CPC classification number: C08L65/00 ,  C08G61/08 ,  C08G2261/418 ,  C08J5/24 ,  C08J2365/00 ,  C08K3/36 ,  C08K7/26 ,  H01B3/448 ,  H05K1/0373 ,  H05K2201/0158 ,  H05K2201/0254

Abstract: A polymerizable composition is obtained by mixing a metathesis polymerization catalyst including benzylidene(1,3-dimethyl-4-imidazolidin-2-ylidene)(tricyclohexylphosphine)ruthenium dichloride, a cycloolefin monomer such as 2-norbornene or tetracyclo[6.2.1.13,6.02,7]dodec-4-ene, a chain transfer agent such as allyl methacrylate, and hollow particles such as Shirasu balloons. A crosslinkable resin composite is obtained by coating or impregnating the polymerizable composition onto or into a support medium, and carrying out bulk polymerization of the polymerizable composition. A crosslinked resin composite is obtained by crosslinking the crosslinkable resin composite.

Abstract translation: 通过将包含亚苄基（1,3-二甲基-4-咪唑烷-2-亚基）（三环己基膦）二氯化钌，易环烯烃单体如2-降冰片烯或四环[6.2.1.13,6.02 ，7]十二碳-4-烯，链转移剂如甲基丙烯酸烯丙酯和中空颗粒如白砂糖气球。 通过将可聚合组合物涂布或浸渍到载体介质上或浸渍到载体介质中并进行可聚合组合物的本体聚合来获得可交联树脂复合材料。 通过使交联性树脂复合体交联而得到交联树脂复合体。

公开(公告)号：US20090314419A1

公开(公告)日：2009-12-24

申请号：US12550178

申请日：2009-08-28

Applicant: Seung Hyun SOHN ,  Hyo-Soon Shin

Inventor： Seung Hyun SOHN ,  Hyo-Soon Shin

IPC: B32B37/00 ,  B05D5/12

CPC classification number: B32B7/04 ,  H05K1/0233 ,  H05K1/024 ,  H05K1/162 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0355 ,  H05K2201/086 ,  H05K2201/09309 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/256

Abstract: A printed circuit board material for embedded passive devices, which has excellent electromagnetic properties and reliability is provided. The invention provides a printed circuit board material comprises: a conductive copper foil layer; a resin bonding layer formed on the conductive layer and including above 70-100 vol % of resin and 0-30 vol % of filler; and a functional layer formed on the resin bonding layer and including resin and filler. The printed circuit board material has the resin bonding layer interposed between the copper foil layer and the functional layer. Thus, even when the content of fillers in the functional layer is increased, the adhesion strength between the conductive layer and the functional layer is ensured without deteriorating the properties of the functional layer, such as dielectric and magnetic properties.

Abstract translation: 提供了一种具有优异的电磁特性和可靠性的嵌入式无源器件印刷电路板材料。 本发明提供一种印刷电路板材料，包括：导电铜箔层; 形成在导电层上的树脂粘结层，包括70-100体积％的树脂和0-30体积％的填料; 以及形成在树脂粘合层上并包括树脂和填料的功能层。 印刷电路板材料具有插入在铜箔层和功能层之间的树脂粘合层。 因此，即使功能层中的填料的含量增加，也可以确保导电层与功能层之间的粘合强度，而不会劣化功能层的性质，例如电介质和磁性。

公开(公告)号：US20090120673A1

公开(公告)日：2009-05-14

申请号：US11990860

申请日：2006-08-18

Applicant: Tadahiro Ohmi ,  Akinobu Teramoto ,  Akihiro Morimoto

Inventor： Tadahiro Ohmi ,  Akinobu Teramoto ,  Akihiro Morimoto

IPC: H05K1/00

CPC classification number: H05K1/024 ,  H05K3/4602 ,  H05K3/4626 ,  H05K3/4673 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0254

Abstract: A multilayered circuit board which is provided with a low-permittivity interlayer insulating film, and which can significantly improve the performance such as signal transmission characteristics of the multilayered circuit board such as a package and a printed board, because the surface in contact with the interlayer insulating film of the circuit board has no unevenness to eliminate the lowering of production yield and the deterioration of high-frequency signal transmission characteristics; and electronic equipment using the circuit board. The multilayered circuit board comprises, mounted on a substrate, plural wiring layers and plural insulating layers positioned between the plural wiring layers, wherein at least part of the plural insulating layers are composed of a porous insulating layer containing at least any of materials selected from a porous material group consisting of porous material, aerogel, porous silica, porous polymer, hollow silica and hollow polymer, and a non-porous insulating layer formed on at least one surface of the porous insulating layer and not containing the porous material group.

Abstract translation: 具有低介电常数层间绝缘膜的多层电路板，能够显着地提高诸如封装和印刷电路板的多层电路板的信号传输特性等性能，因为与中间层 电路板的绝缘膜没有不均匀性，消除了生产成本的降低和高频信号传输特性的恶化; 和使用电路板的电子设备。 多层电路板包括安装在基板上的多个布线层和位于多个布线层之间的多个绝缘层，其中多个绝缘层的至少一部分由多孔绝缘层组成，多孔绝缘层至少含有选自 由多孔材料，气凝胶，多孔二氧化硅，多孔聚合物，中空二氧化硅和中空聚合物组成的多孔材料组和形成在多孔绝缘层的至少一个表面上并且不包含多孔材料组的无孔绝缘层。

公开(公告)号：US20080221261A1

公开(公告)日：2008-09-11

申请号：US12118528

申请日：2008-05-09

Applicant: Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

Inventor： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

IPC: C08F12/08 ,  C08L25/04

CPC classification number: C08K5/01 ,  C08F212/14 ,  C08F212/32 ,  C08F257/02 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0254 ,  C08L65/00 ,  C08F236/02

Abstract: According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, R1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

Abstract translation: 根据本发明，提供一种低介电损耗角正切树脂组合物，其含有重均分子量不大于1000的交联组分和多个苯乙烯基团并由式[1]表示，其中R为 可以具有取代基的烃骨架，R 1是氢，甲基或乙基，m是1-4的整数，n是2或更大的整数，并且还包含至少一个选自 从重均分子量不小于5,000的高分子量和填料，该树脂组合物可以得到具有良好柔软性，高拉伸强度和低介电常数和介电损耗角正切的固化产物。

公开(公告)号：US07375155B2

公开(公告)日：2008-05-20

申请号：US11177362

申请日：2005-07-11

Applicant: Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

Inventor： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

IPC: C08L9/00

CPC classification number: C08K5/01 ,  C08F212/14 ,  C08F212/32 ,  C08F257/02 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0254 ,  C08L65/00 ,  C08F236/02

Abstract: According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, R1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

Abstract translation: 根据本发明，提供一种低介电损耗角正切树脂组合物，其含有重均分子量不大于1000的交联组分和多个苯乙烯基团并由式[1]表示，其中R为 可以具有取代基的烃骨架，R 1是氢，甲基或乙基，m是1-4的整数，n是2或更大的整数，并且还包含至少一个选自 从重均分子量不小于5,000的高分子量和填料，该树脂组合物可以得到具有良好柔软性，高拉伸强度和低介电常数和介电损耗角正切的固化产物。

公开(公告)号：US20070148421A1

公开(公告)日：2007-06-28

申请号：US11539532

申请日：2006-10-06

Applicant: Seung Hyun SOHN ,  Hyo SHIN

Inventor： Seung Hyun SOHN ,  Hyo SHIN

IPC: B05D5/12

CPC classification number: B32B7/04 ,  H05K1/0233 ,  H05K1/024 ,  H05K1/162 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0355 ,  H05K2201/086 ,  H05K2201/09309 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/256

Abstract: A printed circuit board material for embedded passive devices, which has excellent electromagnetic properties and reliability is provided. The invention provides a printed circuit board material comprises: a conductive copper foil layer; a resin bonding layer formed on the conductive layer and including above 70-100 vol % of resin and 0-30 vol % of filler; and a functional layer formed on the resin bonding layer and including resin and filler. The printed circuit board material has the resin bonding layer interposed between the copper foil layer and the functional layer. Thus, even when the content of fillers in the functional layer is increased, the adhesion strength between the conductive layer and the functional layer is ensured without deteriorating the properties of the functional layer, such as dielectric and magnetic properties.

Abstract translation: 提供了一种具有优异的电磁特性和可靠性的嵌入式无源器件印刷电路板材料。 本发明提供一种印刷电路板材料，包括：导电铜箔层; 形成在导电层上的树脂粘结层，包括70-100体积％的树脂和0-30体积％的填料; 以及形成在树脂粘合层上并包括树脂和填料的功能层。 印刷电路板材料具有插入在铜箔层和功能层之间的树脂粘合层。 因此，即使功能层中的填料的含量增加，也可以确保导电层与功能层之间的粘合强度，而不会劣化功能层的性质，例如电介质和磁性。