公开(公告)号：US20090108445A1

公开(公告)日：2009-04-30

申请号：US12193422

申请日：2008-08-18

Applicant: Jung Hua LIANG

Inventor： Jung Hua LIANG

IPC: H01L23/488 ,  B05D5/12

CPC classification number: H01L23/49811 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K3/3452 ,  H05K2201/0326 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y10T428/24851

Abstract: A substrate structure is provided. The substrate structure includes a substrate and a patterned wiring layer formed on the substrate. The patterned wiring layer includes a plurality of conductive traces. An isolation layer covers the patterned wiring layer and has an opening to expose a portion of at least one of the conductive traces therefrom. A plurality of conductive coatings covers the exposed portions of the conductive traces. The present invention further provides a semiconductor package with the above substrate structure.

Abstract translation: 提供了基板结构。 基板结构包括基板和形成在基板上的图案化布线层。 图案化的布线层包括多个导电迹线。 隔离层覆盖图案化的布线层，并且具有用于暴露至少一个导电迹线的一部分的开口。 多个导电涂层覆盖导电迹线的暴露部分。 本发明还提供具有上述基板结构的半导体封装。

公开(公告)号：US20090096973A1

公开(公告)日：2009-04-16

申请号：US12250725

申请日：2008-10-14

Applicant: Hiroshi UEDA ,  Shigeaki NOUMI

Inventor： Hiroshi UEDA ,  Shigeaki NOUMI

IPC: G02F1/1333

CPC classification number: H05K3/323 ,  G02F1/13452 ,  H05K3/244 ,  H05K3/28 ,  H05K2201/0175 ,  H05K2201/0326 ,  H05K2201/10674

Abstract: A display device comprises a metallic wiring formed on an insulating substrate, an inorganic insulating film formed on the metallic wiring, an organic resin film formed on the inorganic insulating film, a transparent conductive film formed in a portion on the metallic wiring where the inorganic insulating film and the organic resin film are removed, a connection terminal formed in a region for mounting a driving IC external to the display region on the insulating substrate, and a bump of the driving IC connected to the connection terminal by an anisotropic conductive film in order to supply a signal to the display region. The region for mounting a driving IC includes a region where the inorganic insulating film and the organic resin film are formed on the metallic wiring and a region where the inorganic insulating film and the organic resin film are removed from the metallic wiring.

Abstract translation: 显示装置包括形成在绝缘基板上的金属布线，形成在金属布线上的无机绝缘膜，形成在无机绝缘膜上的有机树脂膜，形成在金属布线上的部分上的无机绝缘层的透明导电膜 膜和有机树脂膜被除去，形成在用于将绝缘基板上的显示区域外部的驱动IC安装的区域中的连接端子和通过各向异性导电膜连接到连接端子的驱动IC的凸起顺序 以向显示区域提供信号。 用于安装驱动IC的区域包括在金属布线上形成无机绝缘膜和有机树脂膜的区域以及从金属布线去除无机绝缘膜和有机树脂膜的区域。

公开(公告)号：US20090056981A1

公开(公告)日：2009-03-05

申请号：US11911947

申请日：2005-07-01

Applicant: Satoshi Maeda ,  Keizo Kawahara ,  Masayuki Tsutsumi ,  Takefumi Yoshida

Inventor： Satoshi Maeda ,  Keizo Kawahara ,  Masayuki Tsutsumi ,  Takefumi Yoshida

IPC: H05K1/18 ,  B32B27/06 ,  B32B15/08

CPC classification number: H05K1/0346 ,  H05K3/181 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2203/065 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The thin film-laminated polyimide film contains a substrate film and a thin film layer formed at least on one surface of the substrate film. The substrate film is made of a polyimide film showing a degree of curl after a heat treatment at 300° C. of not more than 10%. Use of this thin film-laminated polyimide film as a substrate of electronic parts such as solar battery, capacitor and the like exposed to high temperatures prevents easy development of warpage and distortion during production, and can improve quality and yield of electronic parts.

Abstract translation: 薄膜层叠聚酰亚胺膜含有基材膜和在基材膜的至少一个表面上形成的薄膜层。 基材膜由聚酰亚胺膜制成，其在300℃下热处理后的卷曲度不大于10％。 使用这种薄膜叠层聚酰亚胺薄膜作为暴露于高温的太阳能电池，电容器等电子部件的基板，防止了生产过程中的翘曲和变形的容易发展，并且可以提高电子部件的质量和产量。

公开(公告)号：US20090026678A1

公开(公告)日：2009-01-29

申请号：US12241591

申请日：2008-09-30

Applicant: Jia-Chong Ho ,  Tarng-Shiang Hu ,  Hsiang-Yuan Cheng

Inventor： Jia-Chong Ho ,  Tarng-Shiang Hu ,  Hsiang-Yuan Cheng

IPC: B23Q3/02

CPC classification number: H05K3/303 ,  H01L23/544 ,  H01L51/0097 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/007 ,  H05K3/048 ,  H05K2201/0326 ,  H05K2201/09918 ,  H05K2203/016 ,  H05K2203/0191 ,  H05K2203/0228 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49135 ,  H01L2924/00

Abstract: Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same is proposed. The process step of a flexible substrate is put on a substrate holder, wherein the flexible substrate is fixed by a polymer tape. A plural of alignment marks is making for lithography process. An unstressed cut is separated the flexible substrate and substrate holder when the electronic component is made.

Abstract translation: 提出了柔性基板装置上的电子元件工艺的对准精度提高及其方法。 将柔性基板的工艺步骤放在衬底保持器上，其中柔性衬底通过聚合物带固定。 多个对准标记正在进行光刻处理。 当制造电子部件时，将不受应力的切口分离柔性基板和基板支架。

公开(公告)号：US20080173390A1

公开(公告)日：2008-07-24

申请号：US12018114

申请日：2008-01-22

Applicant: Mukundan Narasimhan ,  Todd Johnson ,  Bulent M. Basol

Inventor： Mukundan Narasimhan ,  Todd Johnson ,  Bulent M. Basol

IPC: B32B38/06

CPC classification number: B32B38/10 ,  B32B38/06 ,  B32B2457/12 ,  H01L31/18 ,  H05K3/041 ,  H05K3/244 ,  H05K2201/0326 ,  H05K2203/0108 ,  H05K2203/0143 ,  Y10T156/1041 ,  Y10T156/1054 ,  Y10T156/107

Abstract: A method of forming metallic connector patterns for solar cells, whereby an embosser having raised features shaped in the form of a metallic connector pattern is used to attach a portion of a metallic foil to a transparent conductive layer formed on a top transparent surface of a solar cell structure. The raised surfaces of the embosser press the metallic foil portion against the transparent conductive layer. Heat and pressure directed to the metallic foil portion attach the metallic foil portion to the underlying transparent conductive layer, and then the rest of the metallic foil, which is not attached to the transparent conductive layer, is removed.

Abstract translation: 一种用于形成用于太阳能电池的金属连接器图案的方法，由此使用具有以金属连接器图案形式形成的凸起特征的压花器将金属箔的一部分附接到形成在太阳能的顶部透明表面上的透明导电层 细胞结构。 压花机的凸起表面将金属箔部分压靠在透明导电层上。 引导到金属箔部分的热和压力将金属箔部分附着到下面的透明导电层上，然后除去未附着到透明导电层的金属箔的其余部分。

公开(公告)号：US20080121899A1

公开(公告)日：2008-05-29

申请号：US11593881

申请日：2006-11-07

Applicant: David G. Pires ,  Alan C. Thomas ,  Walter J. Paciorek ,  Ilona Budinavicius

Inventor： David G. Pires ,  Alan C. Thomas ,  Walter J. Paciorek ,  Ilona Budinavicius

IPC: H01L33/00 ,  H01L27/15 ,  H01L21/77

CPC classification number: G09G3/32 ,  G09G2300/0426 ,  G09G2300/06 ,  H01L25/0753 ,  H01L33/42 ,  H01L2924/0002 ,  H05K1/0265 ,  H05K1/0274 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/10272 ,  H01L2924/00

Abstract: An array of light emitting diodes coupled between a substrate and a transparent electrode include a pair of equipotential bus bars supplying electrical current simultaneously to at least two light emitting diodes, each located in its own area of transparent conductive material. In accordance with another aspect of the invention, a linear array of light emitting diodes has an electrode that includes a conductive island for each light emitting diode and a bus bar interconnecting and surrounding the conductive islands.

Abstract translation: 耦合在基板和透明电极之间的发光二极管阵列包括一对等电位汇流条，同时向至少两个发光二极管提供电流，每个发光二极管位于其自身的透明导电材料区域中。 根据本发明的另一方面，发光二极管的线性阵列具有包括用于每个发光二极管的导电岛的电极和互连并围绕导电岛的汇流条。

公开(公告)号：US20080080181A1

公开(公告)日：2008-04-03

申请号：US11641879

申请日：2006-12-20

Applicant: Sam Yu ,  Dalong Cheng

Inventor： Sam Yu ,  Dalong Cheng

IPC: F21V21/00

CPC classification number: H05K1/0274 ,  F21S4/24 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/12041 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/10106 ,  H01L2924/01047 ,  H01L2924/00 ,  H01L2924/01006 ,  H01L2924/0002 ,  H01L2224/45099

Abstract: A plane structure of light-emitting diode (LED) lighting apparatus is provided, it includes a transparent flexible tape with a first transparent pattern and a second transparent pattern, wherein the first transparent pattern is insulated from the second transparent pattern. A plurality of light-emitting diodes is electrically connected with the first transparent pattern. The LED lighting apparatus can also form the first transparent pattern and the second transparent pattern on two sides of the transparent flexible tape, or, furthermore, to form the first transparent pattern and the second transparent pattern stack to generate a multi-storey LED lighting apparatus. Such a plane of emitting diode is applied to various display, furniture decoration and lighting.

Abstract translation: 提供了一种发光二极管（LED）照明装置的平面结构，其包括具有第一透明图案和第二透明图案的透明柔性带，其中第一透明图案与第二透明图案绝缘。 多个发光二极管与第一透明图案电连接。 LED照明装置还可以在透明柔性带的两侧上形成第一透明图案和第二透明图案，或者还形成第一透明图案和第二透明图案叠层以产生多层LED照明装置 。 这种发光二极管应用于各种显示器，家具装饰和照明。

公开(公告)号：US20080049410A1

公开(公告)日：2008-02-28

申请号：US11769386

申请日：2007-06-27

Applicant: Toshiyuki KAWAGUCHI ,  Kazutoki TAHARA ,  Tsutomu SAGA ,  Mitsuaki NEGISHI

Inventor： Toshiyuki KAWAGUCHI ,  Kazutoki TAHARA ,  Tsutomu SAGA ,  Mitsuaki NEGISHI

IPC: H05K9/00

CPC classification number: H05K1/0234 ,  H05K1/0298 ,  H05K1/167 ,  H05K2201/0191 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2201/093 ,  H05K2201/09309

Abstract: The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 μm or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member. Moreover, the present invention relates to a noise suppressing structure including: a first conductive layer; a second conductive layer; a noise suppressing layer provided between the first conductive layer and the second conductive layer, the noise suppressing layer being to be electromagnetically-coupled with the first conductive layer, the noise suppressing layer comprising a metallic material or a conductive ceramic, and the noise suppressing layer having a thickness of 5 to 300 nm; a first insulating layer provided between the first conductive layer and the noise suppressing layer; and a second insulating layer provided between the second conductive layer and the noise suppressing layer; wherein the noise suppressing structure has: a region (I) in which the noise suppressing layer and the first conductive layer face each other; and a region (II) in which the noise suppressing layer and the first conductive layer do not face each other but the noise suppressing layer and the second conductive layer face each other, the regions (I) and (II) neighboring each other.

Abstract translation: 布线构件技术领域本发明涉及一种布线构件，其包括：具有表面粗糙度Rz为2μm以下的光滑表面的铜箔层; 含有金属材料或导电陶瓷的噪声抑制层，其厚度为5〜200nm; 以及设置在铜箔层的光滑表面和噪声抑制层之间的绝缘树脂层，并且还涉及配备有配线构件的印刷线路板。 此外，本发明涉及一种噪声抑制结构，包括：第一导电层; 第二导电层; 设置在第一导电层和第二导电层之间的噪声抑制层，噪声抑制层与第一导电层电磁耦合，噪声抑制层包括金属材料或导电陶瓷，噪声抑制层 具有5〜300nm的厚度; 设置在所述第一导电层和所述噪声抑制层之间的第一绝缘层; 以及设置在所述第二导电层和所述噪声抑制层之间的第二绝缘层; 其中所述噪声抑制结构具有：所述噪声抑制层和所述第一导电层彼此面对的区域（I）; 以及区域（I）和（II）彼此相邻的区域（II），其中噪声抑制层和第一导电层彼此不相对，但是噪声抑制层和第二导电层彼此面对。

公开(公告)号：US20070124926A1

公开(公告)日：2007-06-07

申请号：US11674454

申请日：2007-02-13

Applicant: Yukihiro Ishimaru ,  Seiichi Nakatani ,  Yoshiyuki Saito

Inventor： Yukihiro Ishimaru ,  Seiichi Nakatani ,  Yoshiyuki Saito

IPC: H05K1/03

CPC classification number: H05K3/4038 ,  H05K1/167 ,  H05K3/105 ,  H05K3/4644 ,  H05K2201/0326 ,  H05K2203/107 ,  H05K2203/171 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: In a circuit board according to the present invention, on a substrate, in at least a portion of a phase change layer including a phase change material that is capable of changing alternately between an electrically insulating state and an electrically conductive state, a conductive path is formed that has been put into an electrically conductive state by a phase change in the phase change layer, wherein the phase change material includes a chalcogenide semiconductor, changes between the electrically insulating state and the electrically conductive state by irradiation of laser light, goes into the electrically conductive state in a crystalline phase, and goes into the electrically insulating state in an amorphous phase. In this way, a conductive path is formed by irradiating laser light onto a phase change layer using phase change in a phase change layer formed from a phase change material that is capable of changing alternately between an electrically insulating state and an electrically conductive state, and therefore very small-dimension minute vias and conductors can be formed. Furthermore, subsequent repair, rework, or trimming also is easy.

Abstract translation: 在根据本发明的电路板中，在基板上，在包括能够在电绝缘状态和导电状态之间交替变化的相变材料的相变层的至少一部分中，导电路径为 形成为通过相变层中的相变而导致导电状态，其中相变材料包括硫族化物半导体，通过激光的照射在电绝缘状态和导电状态之间的变化进入 在结晶相中导电状态，并且在非晶相中进入电绝缘状态。 以这种方式，通过使用在能够在电绝缘状态和导电状态之间交替变化的相变材料形成的相变层中的相变来将激光照射到相变层上形成导电路径，以及 因此可以形成非常小尺寸的微通孔和导体。 此外，随后的修理，返修或修整也很容易。

公开(公告)号：US20070035688A1

公开(公告)日：2007-02-15

申请号：US10566549

申请日：2004-07-26

Applicant: Noriyoshi Matsuura

Inventor： Noriyoshi Matsuura

IPC: G02F1/1345

CPC classification number: G02F1/13458 ,  G02F1/1345 ,  G02F1/13452 ,  G02F1/1362 ,  H05K1/111 ,  H05K1/117 ,  H05K3/244 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/0326 ,  H05K2201/09745 ,  H05K2201/099 ,  Y02P70/611

Abstract: An object of the invention is to provide a terminal structure which can reduce a connection resistance and prevent corrosion and to provide an electronic apparatus based on the terminal structure. An electronic apparatus comprising a transparent conductive layer (10) supported by a substrate (8) and a metal layer (20) of a material having a resistivity lower than that of the transparent conductive layer (10), the metal layer (20) being extended on the transparent conductive layer (10), the transparent conductive layer (10) having an oxidation resistivity higher than that of the metal layer (20) and forming a terminal (10T) for connecting to peripheral circuitry (50). The metal layer (20) extends on an extending portion (10L) of the transparent conductive layer (10) outside the terminal (10T) of the transparent conductive layer (10), and/or on the periphery of or in the vicinity of a coupling area (11) for making the transparent conductive layer (10) to be exposed to the exterior within an area of the terminal (10T) of the transparent conductive layer (10). There is provided an electrically insulating layer (30) which covers at least a part of the terminal (10T) of the transparent conductive layer (10) and the whole of the metal layer (20) and which extends on the area other than the coupling area (11) within the area of the terminal (10T) of the transparent conductive layer (10).

Abstract translation: 本发明的目的是提供一种能够降低连接电阻并防止腐蚀并且基于端子结构提供电子设备的端子结构。 一种电子设备，包括由基板（8）支撑的透明导电层（10）和具有比所述透明导电层（10）的电阻率低的材料的金属层（20），所述金属层（20）为 在所述透明导电层（10）上延伸，所述透明导电层（10）的氧化电阻率高于所述金属层（20）的氧化电阻率，并且形成用于连接到外围电路（50）的端子（10T）。 金属层（20）在透明导电层（10）的位于透明导电层（10）的端子（10T）外侧的延伸部分（10L）上和/或在其周围或附近延伸 用于使透明导电层（10）在透明导电层（10）的端子（10T）的区域内暴露于外部的耦合区域（11）。 提供一种电绝缘层（30），其覆盖透明导电层（10）的端子（10T）和整个金属层（20）的至少一部分，并且在除了 在透明导电层（10）的端子（10T）的区域内的耦合区域（11）。