公开(公告)号：US20150001566A1

公开(公告)日：2015-01-01

申请号：US14348076

申请日：2012-08-28

Applicant: Bernd Barchmann ,  Ralph Wirth

Inventor： Bernd Barchmann ,  Ralph Wirth

IPC: H01L33/46

CPC classification number: H01L33/46 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/30 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0058 ,  H05K1/02 ,  H05K2201/0355 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00

Abstract: A semiconductor lighting device may include a substrate populated with at least one semiconductor light source, wherein at least one reflective surface region of the substrate is covered with a light-reflecting layer, and wherein the light-reflecting layer has an aluminum carrier coated in a reflection-intensifying manner.

Abstract translation: 半导体照明装置可以包括填充有至少一个半导体光源的基板，其中基板的至少一个反射表面区域被光反射层覆盖，并且其中所述光反射层具有涂覆在所述基板上的铝载体 反射加剧的方式。

公开(公告)号：US20140342161A1

公开(公告)日：2014-11-20

申请号：US14352893

申请日：2011-10-18

Applicant: Xianping Zeng

Inventor： Xianping Zeng

IPC: C08G59/42 ,  H05K1/05 ,  C08L63/04

CPC classification number: C08G59/4223 ,  C08G59/24 ,  C08G59/3218 ,  C08G59/4215 ,  C08G59/4276 ,  C08L63/04 ,  H05K1/0326 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0355 ,  Y10T428/31522 ,  C08L67/00

Abstract: Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.

Abstract translation: 提供环氧树脂组合物和使用它们的预浸料和覆铜层压板。 环氧树脂组合物包含以下主要成分：（A）含有萘酚结构的环氧树脂; （B）活性酯固化剂; （C）固化促进剂。 本发明的环氧组合物可用于制备具有低吸水性和低介电损耗值的环氧树脂缩合物。 制造的预浸料和覆铜层压板具有良好的介电性能，耐湿性和耐热性能以及高玻璃化转变温度。

公开(公告)号：US08882983B2

公开(公告)日：2014-11-11

申请号：US12482202

申请日：2009-06-10

Applicant: Junghyun Cho ,  Bahgat Sammakia ,  Mark D. Poliks ,  Roy Magnuson ,  Biplab Kumar Roy

Inventor： Junghyun Cho ,  Bahgat Sammakia ,  Mark D. Poliks ,  Roy Magnuson ,  Biplab Kumar Roy

IPC: C25D9/08 ,  C25D5/48 ,  H05K1/16 ,  H05K3/18

CPC classification number: H05K3/0011 ,  C25D5/48 ,  C25D9/08 ,  C25D21/12 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/162 ,  H05K1/167 ,  H05K3/184 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2203/092 ,  H05K2203/135 ,  H05K2203/163

Abstract: A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.

Abstract translation: 一种在导电性基板上形成膜的方法，其特征在于，将具有导电性部分的基板浸渍在包含所述膜的金属离子陶瓷前体和过氧化物的溶液中; 对导电部分相对于溶液中的对电极施加电压电位，足以保护导电部分免受溶液的腐蚀，并且驱动在衬底上形成膜，控制溶液的pH，同时限制生产 的氢气通过电解接近导电部分的溶液; 并且保持电压电势足够的持续时间以在导电部分上产生膜。 可以在膜上形成电极以产生电气装置。 该膜可以是例如绝缘，电介质，电阻，半导体，磁性或铁磁性的。

公开(公告)号：US08858865B2

公开(公告)日：2014-10-14

申请号：US13138136

申请日：2010-01-13

Applicant: Youichirou Kaga ,  Hisayuki Imamura ,  Junichi Watanabe

Inventor： Youichirou Kaga ,  Hisayuki Imamura ,  Junichi Watanabe

IPC: B28B1/00 ,  H01L23/373 ,  H01L23/15 ,  C04B35/584 ,  H05K1/03 ,  C04B35/622 ,  H05K3/00

CPC classification number: H05K1/0306 ,  C04B35/584 ,  C04B35/622 ,  H01L23/15 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K3/0061 ,  H05K2201/0355 ,  H05K2203/1126 ,  H01L2924/00

Abstract: A manufacturing method with which a high thermal conductivity silicon nitride substrate having excellent sintering performance can be manufactured without the occurrence of a molding crack or degreasing crack, as well as to provide a silicon nitride substrate, and a silicon nitride circuit board and a semiconductor module using the silicon nitride substrate. In the manufacturing method, in which a slurry is produced by mixing a silicon nitride powder, a sintering additive powder, and a binder in an organic solvent which is a dispersion medium, and the slurry is formed into a sheet, followed by degreasing and sintering, the oxygen content of the silicon nitride powder is 2.0 mass % or less and the specific surface area of the same is 3 to 11 m2/g, the additive ratio of the sintering additive powder is 4 to 15 mol %, and the water content ratio of the organic solvent is 0.03 to 3 mass %.

Abstract translation: 可以制造具有优异的烧结性能的高导热性氮化硅衬底而不发生成型裂纹或脱脂裂纹的制造方法，以及提供氮化硅衬底，以及氮化硅电路板和半导体模块 使用氮化硅衬底。 在通过在作为分散介质的有机溶剂中混合氮化硅粉末，烧结添加剂粉末和粘合剂而制备浆料的制造方法中，将浆料形成为片材，然后进行脱脂和烧结 ，氮化硅粉末的氧含量为2.0质量％以下，比表面积为3〜11m 2 / g，烧结添加剂粉末的添加比例为4〜15摩尔％，水分含量 有机溶剂的比例为0.03〜3质量％。

公开(公告)号：US08813353B2

公开(公告)日：2014-08-26

申请号：US12785037

申请日：2010-05-21

Applicant: Yasuhiko Inui ,  Takamichi Ogawa ,  Seiji Ichiyanagi ,  Jun Otsuka ,  Manabu Sato

Inventor： Yasuhiko Inui ,  Takamichi Ogawa ,  Seiji Ichiyanagi ,  Jun Otsuka ,  Manabu Sato

IPC: H05K3/20 ,  H01L23/498 ,  H05K1/16 ,  H01L23/50 ,  H01L21/48 ,  H05K1/09 ,  H05K3/46

CPC classification number: H05K1/162 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K3/4644 ,  H05K2201/0175 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718 ,  H05K2201/09736 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/4981 ,  Y10T407/1946 ,  Y10T407/1948 ,  H01L2924/00

Abstract: A dielectric structure including a metal foil, a dielectric layer and a conductor layer provided in this order, wherein the metal foil has a thickness of from 10 to 40 μm, the dielectric layer has a thickness of from 0.3 to 5 μm, and the conductor layer has a thickness of from 0.3 to 10 μm. The dielectric structure has plural vias which are separated from each other, and which penetrate through both of the dielectric layer and the conductor layer. The vias of the dielectric layer have different diameters which are in a range of from 100 to 300 μm, a diameter of each of the vias of the conductor layer is larger than a diameter of a corresponding via of the dielectric layer by 5 to 50 μm, and a minimum via pitch is from 100 to 350 μm.

Abstract translation: 包括依次设置的金属箔，电介质层和导体层的电介质结构体，其中金属箔的厚度为10〜40μm，电介质层的厚度为0.3〜5μm，导体 层的厚度为0.3〜10μm。 电介质结构具有彼此分离并且穿透介电层和导体层两者的多个通孔。 电介质层的通孔具有不同的直径，范围为100〜300μm，导体层的通孔的直径大于电介质层的通孔的直径为5〜50μm ，最小通孔间距为100〜350μm。

公开(公告)号：US08794499B2

公开(公告)日：2014-08-05

申请号：US13305999

申请日：2011-11-29

Applicant: Yasuyuki Sekimoto

Inventor： Yasuyuki Sekimoto

IPC: B23K31/00 ,  B23K31/02 ,  H05K3/40 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2203/1189

Abstract: In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting insulating resin layer. Bumps of a conductive paste containing metal fillers are formed on a metal foil which is to be contact-bonded to an insulating resin layer, the bumps are heated to bound the metal fillers to each other, and form a metallic bond between the bumps and the metal foil, the metal columns are press-fitted into the insulating resin layer to contact-bond the metal foil to the insulating resin layer, and join the tips of the metal columns to a metal foil, the metal columns are then reheated to form a metallic bond between the metal columns and the metal foil.

Abstract translation: 在基板的制造方法中，通过与配置在热固性绝缘树脂层上的金属箔之间的绝缘树脂层压配合的凸块的金属柱来形成连接。 在与绝缘树脂层接触接合的金属箔上形成含有金属填料的导电性糊料的凸起，将凸块加热以使金属填料彼此结合，并在凸点和凸起之间形成金属键 金属箔，将金属柱压入绝缘树脂层，将金属箔与绝缘树脂层接触，并将金属柱的顶端接合到金属箔上，然后将金属柱再加热形成 金属柱与金属箔之间的金属粘结。

公开(公告)号：US20140158410A1

公开(公告)日：2014-06-12

申请号：US14093669

申请日：2013-12-02

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： MING-JAAN HO

IPC: H05K1/09 ,  H05K3/02

CPC classification number: B32B15/08 ,  C08G73/10 ,  C08L79/08 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/281 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0108 ,  Y10T428/265 ,  Y10T428/31681

Abstract: A polyimide is formed by dehydrating a polyamic acid. The polyamic acid is formed by polymerizing a diamine and a fluorine dianhydride. The diamine is 2,2′-bis[4-(4-aminophenoxy) phenyl] propane, and the fluorine dianhydride is 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride. When a color of the polyimide is defined by Lab color space, b component is set from about −10 to about +10. The disclosure further relates to a copper-clad laminate, a flexible printed circuit, and a method for manufacturing the flexible printed circuit.

Abstract translation: 通过使聚酰胺酸脱水形成聚酰亚胺。 通过聚合二胺和氟二酐形成聚酰胺酸。 二胺是2,2'-双[4-（4-氨基苯氧基）苯基]丙烷，氟二酐是2,2-双（3,4-二羧基苯基）六氟丙烷二酐。 当聚酰亚胺的颜色由Lab颜色空间定义时，b分量设定为约-10至约+10。 本发明还涉及覆铜层压板，柔性印刷电路和用于制造柔性印刷电路的方法。

公开(公告)号：US08749342B2

公开(公告)日：2014-06-10

申请号：US13123127

申请日：2009-10-13

Applicant: Shigeo Ohsaka ,  Toshio Kurosawa ,  Takashi Natsume

Inventor： Shigeo Ohsaka ,  Toshio Kurosawa ,  Takashi Natsume

IPC: H01C1/012

CPC classification number: C23C14/04 ,  C23C14/044 ,  C23C14/08 ,  C23C14/165 ,  C23C14/542 ,  C23C14/562 ,  H05K1/167 ,  H05K2201/0355 ,  H05K2201/0391 ,  H05K2203/0361 ,  Y10T428/12493

Abstract: A copper foil with an electric resistance film in which a film with higher electrical resistivity than the metal foil is provided on the metal foil, wherein a plurality of electric resistance films with different electric resistance is arranged in parallel on the same metal foil. With conventionally used built-in resistor elements, one resistor element is configured of one type of substance on the copper foil. Nevertheless, when actually mounting the resistor elements, the circuit design tolerance can be increased and the number of man-hours can be reduced with two resistor elements and further with a plurality of resistor elements compared to a case with one resistor element. This invention aims to provide a metal foil with a built-in resistor element comprising two or more types of resistor elements on one metal foil.

Abstract translation: 在金属箔上设置有具有电阻率高于金属箔的膜的具有电阻膜的铜箔，其中在同一金属箔上平行布置具有不同电阻的多个电阻膜。 使用传统使用的内置电阻元件，一个电阻元件由铜箔上的一种物质构成。 然而，当实际安装电阻元件时，与一个电阻器元件相比，可以增加电路设计容差并且可以使用两个电阻元件减少工作时间，并且还可以减少多个电阻元件。 本发明的目的是提供一种具有内置电阻元件的金属箔，该金属箔在一个金属箔上包括两种或多种类型的电阻元件。

公开(公告)号：US20140141274A1

公开(公告)日：2014-05-22

申请号：US14028682

申请日：2013-09-17

Applicant: Nan Ya Plastics Corporation

Inventor： MING-JEN TZOU ,  KUO-CHAO CHEN ,  YA-MEI LIN

IPC: H05K1/09

CPC classification number: H05K3/022 ,  B32B7/06 ,  B32B15/01 ,  B32B15/20 ,  C25D1/04 ,  C25D3/38 ,  C25D3/562 ,  C25D5/14 ,  C25D7/0614 ,  H05K1/09 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/0726 ,  Y10T428/12396 ,  Y10T428/12903 ,  Y10T428/1291

Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

Abstract translation: 具有本发明的黑色超薄铜箔的铜箔结构体包括载体箔，黑化层，剥离层和超薄铜箔。 载体箔包括无光泽表面和光泽表面，其中黑化层设置在其上。 剥离层设置在由选自铜，钴，镍和锰中的一种形成的黑色层上，而剥离层由选自钼，镍，铬和钾的一种形成。 接着，将超薄铜箔设置在剥离层上。 激光钻孔可应用于高密度多层印刷线路板内层的黑色超薄铜箔，从而消除了传统的黑化或褐变化学过程。 黑色超薄铜箔与聚酰亚胺薄（PI）或其他基材的组合显示出理想的外观。

公开(公告)号：US20140138126A1

公开(公告)日：2014-05-22

申请号：US14164900

申请日：2014-01-27

Applicant: Tatsuta Electric Wire & Cable Co., Ltd.

Inventor： Norihiro YAMAGUCHI ,  Hiroaki UMEDA ,  Ken YUKAWA

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/46 ,  H01B1/22 ,  H05K1/0298 ,  H05K1/095 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/462 ,  H05K2201/0191 ,  H05K2201/0272 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0278 ,  H05K2203/0425 ,  H05K2203/1105 ,  H05K2203/111 ,  H05K2203/1194 ,  H05K2203/1461 ,  H05K2203/1572 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using alloying paste as the conductive paste in which at least part of the metal powder is melted and the metal powders adjacent to each other are alloyed, using a pre-preg having a ratio A/B of at least 10 before subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature profile rising from 60° C. to 200° C., and preheating the pre-preg before the drilling step to reduce the ratio A/B to below 10.

Abstract translation: 在制造多层板的方法中，包括：通过激光束加工形成通孔的钻孔步骤，用含有树脂成分和金属粉末的导电膏填充通孔的步骤，以及步骤 在填充的导电糊料上和下方布置图案化板的铜层或铜层部分并对其进行压制，通过使用合金糊作为导电浆料，获得导电性和长期稳定性优异的多层印刷线路板，其中至少 使用在进行预热之前，使用比例A / B为10以上的预浸料，将金属粉末的一部分熔融并且彼此相邻的金属粉末合金化，其中A是在拐点处的储能模量， 储能模量从增加到减少变化，B是在从60℃升高的温度分布中储能模量从降低到升高的拐点处的储能模量 到200℃，并且在钻井步骤之前预热预浸料以将A / B比率降低到10以下。