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51.发明申请LOW LOSS RADIO FREQUENCY SIGNAL COMMUNICATION WITHIN A PACKAGE, A BOARD AND/OR A WAVE GUIDE 审中-公开在包装，板和/或波导中的低损失无线电频率信号通信公开(公告)号：US20090085200A1
公开(公告)日：2009-04-02
申请号：US11864803
申请日：2007-09-28
Applicant: Raviprakash Nagaraj
Inventor： Raviprakash Nagaraj
IPC: H01L23/34
CPC classification number: H01L23/66 , H01L23/585 , H01L24/17 , H01L2223/6616 , H01L2223/6622 , H01L2223/6627 , H01L2224/13099 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/1903 , H01L2924/3011 , H01L2924/3025 , H05K1/0222 , H05K1/0243 , H05K3/3436 , H05K2201/037 , H05K2201/09618 , H05K2201/09809 , H05K2201/10734 , H01L2924/00
Abstract: In some embodiments an integrated circuit package includes a coaxial arrangement of one or more ground via surrounding a signal via. The one or more ground via and the signal via extend through the package to allow transmission of signals between an integrated circuit and a board. Other embodiments are described and claimed.
Abstract translation: 在一些实施例中，集成电路封装包括围绕信号通孔的一个或多个接地通路的同轴布置。 一个或多个接地通孔和信号通孔延伸穿过封装，以允许集成电路和电路板之间的信号传输。 描述和要求保护其他实施例。
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公开(公告)号：US20090080832A1
公开(公告)日：2009-03-26
申请号：US12313320
申请日：2008-11-18
Applicant: Bryce D. Horine , Gary A. Brist , Stephen H. Hall
Inventor： Bryce D. Horine , Gary A. Brist , Stephen H. Hall
CPC classification number: H05K1/024 , H01P3/121 , H01P11/002 , H05K3/4611 , H05K3/4614 , H05K3/462 , H05K2201/037 , H05K2201/0379 , H05K2201/09981 , Y10T156/1002
Abstract: In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of a quasi-waveguide, and printed circuit board material is laminated to the plated channel using thermoset adhesive. Other embodiments are described and claimed.
Abstract translation: 在一些实施例中，通道形成在印刷电路板材料中，形成的通道被电镀以形成准波导的至少两个侧壁，并且使用热固性粘合剂将印刷电路板材料层压到电镀通道上。 描述和要求保护其他实施例。
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公开(公告)号：US07480435B2
公开(公告)日：2009-01-20
申请号：US11322601
申请日：2005-12-30
Applicant: Gary A. Brist , Bryce D. Horine , Stephen H. Stephen
Inventor： Gary A. Brist , Bryce D. Horine , Stephen H. Stephen
IPC: G02B6/10
CPC classification number: H05K1/024 , H01P3/121 , H01P11/002 , H05K3/4611 , H05K3/4614 , H05K3/462 , H05K2201/037 , H05K2201/0379 , H05K2201/09981
Abstract: In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of an embedded waveguide, and printed circuit board material is laminated to the plated channel. Other embodiments are described and claimed.
Abstract translation: 在一些实施例中，通道形成在印刷电路板材料中，形成的通道被电镀以形成嵌入式波导的至少两个侧壁，并且将印刷电路板材料层压到电镀通道。 描述和要求保护其他实施例。
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公开(公告)号：US20070154155A1
公开(公告)日：2007-07-05
申请号：US11322601
申请日：2005-12-30
Applicant: Gary Brist , Bryce Horine , Stephen Stephen
Inventor： Gary Brist , Bryce Horine , Stephen Stephen
IPC: G02B6/10
CPC classification number: H05K1/024 , H01P3/121 , H01P11/002 , H05K3/4611 , H05K3/4614 , H05K3/462 , H05K2201/037 , H05K2201/0379 , H05K2201/09981
Abstract: In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of an embedded waveguide, and printed circuit board material is laminated to the plated channel. Other embodiments are described and claimed.
Abstract translation: 在一些实施例中，通道形成在印刷电路板材料中，形成的通道被电镀以形成嵌入式波导的至少两个侧壁，并且将印刷电路板材料层压到电镀通道。 描述和要求保护其他实施例。
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55.发明授权Method and stiffener-embedded waveguide structure for implementing enhanced data transfer 失效用于实现增强型数据传输的方法和加强肋嵌入式波导结构公开(公告)号：US07088199B2
公开(公告)日：2006-08-08
申请号：US10857742
申请日：2004-05-28
Applicant: Gerald Keith Bartley , Darryl John Becker , Paul Eric Dahlen , Philip Raymond Germann , Andrew B. Maki , Mark Owen Maxson
Inventor： Gerald Keith Bartley , Darryl John Becker , Paul Eric Dahlen , Philip Raymond Germann , Andrew B. Maki , Mark Owen Maxson
IPC: H01P5/02
CPC classification number: H01P3/12 , H05K1/0237 , H05K1/0272 , H05K3/0061 , H05K2201/037
Abstract: A method and stiffener-embedded waveguide structure are provided for implementing enhanced data transfer for printed circuit board applications. At least one microwave channel is defined within a stiffener. The microwave channel provides a high frequency path for data transfers. Use of the waveguide channel in the stiffener for data transfers can replace or supplement otherwise required transmission paths in an associated printed circuit board.
Abstract translation: 提供了一种用于实现印刷电路板应用的增强数据传输的方法和加强肋嵌入式波导结构。 在加强件内限定至少一个微波通道。 微波通道为数据传输提供了高频路径。 在加强件中用于数据传输的波导通道的使用可替代或补充相关印刷电路板中所需的传输路径。
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Patent Agency Ranking
56.发明申请Method and stiffener-embedded waveguide structure for implementing enhanced data transfer 失效用于实现增强型数据传输的方法和加强肋嵌入式波导结构公开(公告)号：US20050264380A1
公开(公告)日：2005-12-01
申请号：US10857742
申请日：2004-05-28
Applicant: Gerald Bartley , Darryl Becker , Paul Dahlen , Philip Germann , Andrew Maki , Mark Maxson
Inventor： Gerald Bartley , Darryl Becker , Paul Dahlen , Philip Germann , Andrew Maki , Mark Maxson
CPC classification number: H01P3/12 , H05K1/0237 , H05K1/0272 , H05K3/0061 , H05K2201/037
Abstract: A method and stiffener-embedded waveguide structure are provided for implementing enhanced data transfer for printed circuit board applications. At least one microwave channel is defined within a stiffener. The microwave channel provides a high frequency path for data transfers. Use of the waveguide channel in the stiffener for data transfers can replace or supplement otherwise required transmission paths in an associated printed circuit board.
Abstract translation: 提供了一种用于实现印刷电路板应用的增强型数据传输的方法和加强肋嵌入式波导结构。 在加强件内限定至少一个微波通道。 微波通道为数据传输提供了高频路径。 在加强件中用于数据传输的波导通道的使用可替代或补充相关印刷电路板中所需的传输路径。
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57.发明申请Microstrip line, resonator element, filter, high-frequency circuit and electronic device using the same 审中-公开微带线，谐振元件，滤波器，高频电路及使用其的电子器件公开(公告)号：US20050012572A1
公开(公告)日：2005-01-20
申请号：US10874577
申请日：2004-06-24
Applicant: Yutaka Ida , Yoshikazu Yagi , Tsutomu Ieki , Hiroaki Tanaka , Osamu Chikagawa
Inventor： Yutaka Ida , Yoshikazu Yagi , Tsutomu Ieki , Hiroaki Tanaka , Osamu Chikagawa
CPC classification number: H01P3/081 , H01P1/20363 , H01P1/20381 , H01P3/088 , H01P7/082 , H01P11/003 , H05K1/0237 , H05K1/0242 , H05K1/162 , H05K3/107 , H05K3/4092 , H05K2201/037 , H05K2201/09036 , H05K2201/098 , H05K2201/09981
Abstract: A microstrip line includes a strip conductor, a line electrode, and edge electrodes provided at the edges on both sides of the line electrode. The construction of the microstrip line greatly reduces the edge effect of the line electrode and decreases the conductor loss of the line electrode.
Abstract translation: 微带线包括带状导体，线电极和设置在线电极两侧边缘的边缘电极。 微带线的结构大大降低了线电极的边缘效应，并降低了线电极的导体损耗。
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58.发明授权Voltage tunable laminated dielectric materials for microwave waveguide applications 有权用于微波波导应用的电压可调叠层电介质材料公开(公告)号：US06794960B2
公开(公告)日：2004-09-21
申请号：US10068355
申请日：2002-02-06
Applicant: Luna H. Chiu , Yongfei Zhu , Xubai Zhang , Steven C. Stowell , Andrey Kozyrev , Somnath Sengupta , Louise Sengupta
Inventor： Luna H. Chiu , Yongfei Zhu , Xubai Zhang , Steven C. Stowell , Andrey Kozyrev , Somnath Sengupta , Louise Sengupta
IPC: H01P318
CPC classification number: H05K1/162 , H01P1/181 , H01P3/003 , H01P3/06 , H01P3/081 , H01P3/088 , H01P3/122 , H01P7/06 , H01Q3/44 , H05K1/024 , H05K2201/0187 , H05K2201/037 , H05K2203/105 , H05K2203/171
Abstract: A tunable dielectric structure includes a first layer of dielectric material, a second layer of dielectric material positioned adjacent to the first layer of dielectric material, with the second layer of dielectric material having a dielectric constant that is less than the dielectric constant of the first layer of dielectric material, and electrodes for applying a controllable voltage across the first dielectric material, thereby controlling a dielectric constant of the first dielectric material, wherein at least one of the electrodes is positioned between the first and second layers of dielectric material. The dielectric materials can be formed in various shapes and assembled in various orientations with respect to each other. The tunable dielectric structure is used in various devices including coaxial cables, cavity antennas, microstrip lines, coplanar lines, and waveguides.
Abstract translation: 可调电介质结构包括第一介电材料层，邻近第一介电材料层定位的第二介电材料层，第二介电材料层的介电常数小于第一层的介电常数 以及用于在第一介电材料上施加可控电压的电极，从而控制第一介电材料的介电常数，其中至少一个电极位于第一和第二介电层之间。 介电材料可以形成为各种形状并且以各种取向相对于彼此组装。 可调电介质结构用于包括同轴电缆，空腔天线，微带线，共面线和波导在内的各种装置。
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59.发明授权Voltage tunable laminated dielectric materials for microwave applications such as a coaxial cable 有权用于微波应用的电压可调叠层电介质材料，如同轴电缆公开(公告)号：US06683517B2
公开(公告)日：2004-01-27
申请号：US10068734
申请日：2002-02-06
Applicant: Luna H. Chiu , Yongfei Zhu , Xubai Zhang , Steven C. Stowell , Andrey Kozyrev , Somnath Sengupta , Louise Sengupta
Inventor： Luna H. Chiu , Yongfei Zhu , Xubai Zhang , Steven C. Stowell , Andrey Kozyrev , Somnath Sengupta , Louise Sengupta
IPC: H01P306
CPC classification number: H05K1/162 , H01P1/181 , H01P3/003 , H01P3/06 , H01P3/081 , H01P3/088 , H01P3/122 , H01P7/06 , H01Q3/44 , H05K1/024 , H05K2201/0187 , H05K2201/037 , H05K2203/105 , H05K2203/171
Abstract: A tunable dielectric structure includes a first layer of dielectric material, a second layer of dielectric material positioned adjacent to the first layer of dielectric material, with the second layer of dielectric material having a dielectric constant that is less than the dielectric constant of the first layer of dielectric material, and electrodes for applying a controllable voltage across the first dielectric material, thereby controlling a dielectric constant of the first dielectric material, wherein at least one of the electrodes is positioned between the first and second layers of dielectric material. The dielectric materials can be formed in various shapes and assembled in various orientations with respect to each other. The tunable dielectric structure is used in various devices including coaxial cables, cavity antennas, microstrip lines, coplanar lines, and waveguides.
Abstract translation: 可调电介质结构包括第一介电材料层，邻近第一介电材料层定位的第二介电材料层，第二介电材料层的介电常数小于第一层的介电常数 以及用于在第一介电材料上施加可控电压的电极，从而控制第一介电材料的介电常数，其中至少一个电极位于第一和第二介电层之间。 介电材料可以形成为各种形状并且以各种取向相对于彼此组装。 可调电介质结构用于包括同轴电缆，空腔天线，微带线，共面线和波导在内的各种装置。
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60.发明申请公开(公告)号：US20020055199A1
公开(公告)日：2002-05-09
申请号：US09984438
申请日：2001-10-30
Inventor： Leif Bergstedt , Spartak Gevorgian
IPC: H01L021/00
CPC classification number: H01P3/121 , H01P11/002 , H05K1/0237 , H05K1/024 , H05K2201/0187 , H05K2201/037 , H05K2201/09809
Abstract: The invention relates to a microwaveguide that is integrated in the dielectric layer of a conductor carrier, e.g. a printed circuit board. The waveguide enables different types of active and/or passive functions intended to influence the signals sent through the waveguide to be integrated at appropriate positions in the waveguide.
Abstract translation: 本发明涉及一种集成在导体载体的介电层中的微波导体，例如， 印刷电路板。 波导使不同类型的有源和/或无源功能旨在影响通过波导发送的信号，以集成在波导中的适当位置。
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