公开(公告)号：US20240222834A1

公开(公告)日：2024-07-04

申请号：US18396641

申请日：2023-12-26

Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY

Inventor： Xiaojun Bi ,  Jian Li ,  Ziang Xu ,  Zixuan Wei

IPC: H01P3/08 ,  H01P3/00 ,  H05K1/02

CPC classification number: H01P3/087 ,  H01P3/003 ,  H05K1/0219 ,  H05K2201/0707

Abstract: The disclosure discloses a low-loss transmission line structure, which belongs to the field of radio frequency transmission lines and includes at least two metal layers stacked in a vertical manner. A dielectric layer is filled between the metal layers. The metal layers include a signal transmission strip in a middle portion. Ground strips are provided on both sides of the signal transmission strip. Through holes are evenly distributed on the dielectric layer, and the signal transmission strips on each of the metal layers are connected through the through holes to form a signal transmission line. The ground strips on each metal layer are connected through the through holes.

公开(公告)号：US20230319977A1

公开(公告)日：2023-10-05

申请号：US18328323

申请日：2023-06-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryota SATO ,  Motohiko KUSUNOKI ,  Tadashi NOMURA

IPC: H05K1/02 ,  H05K1/14 ,  H05K9/00 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/147 ,  H05K9/0084 ,  H05K1/185 ,  H05K2201/0707

Abstract: To provide circuit module capable of shielding electromagnetic wave passing not only on side of electronic component but also below electronic component. Circuit module according to present disclosure includes main board, one first electronic component mounted on main board, and submodule mounted on main board. Submodule includes sub board, and second electronic component. Sub board includes bottom plate mounted on main board, and side plate extending upward from bottom plate. Second electronic component is mounted upper surface of bottom plate. Shield pattern are formed on lower surface of bottom plate, and outer side surface of side plate.

公开(公告)号：US20190150271A1

公开(公告)日：2019-05-16

申请号：US16184571

申请日：2018-11-08

Applicant: RAYTHEON COMPANY

Inventor： Semira M. Azadzoi ,  James E. Benedict ,  John P. Haven ,  Thomas V. Sikina ,  Andrew R. Southworth

IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0218 ,  H01P3/08 ,  H01P11/003 ,  H05K1/0219 ,  H05K1/0221 ,  H05K1/0251 ,  H05K1/112 ,  H05K3/0044 ,  H05K3/107 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4611 ,  H05K2201/0707 ,  H05K2201/09036 ,  H05K2201/09545 ,  H05K2203/0228

Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.

公开(公告)号：US20180330859A1

公开(公告)日：2018-11-15

申请号：US16043053

申请日：2018-07-23

Applicant: Keyssa Licensing, Inc.

Inventor： Stephen Robert Venuti ,  Steve Novak

IPC: H01F7/02 ,  H05K1/18

CPC classification number: H01F7/0242 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/0707 ,  H05K2201/10098 ,  H05K2203/104 ,  H05K2203/166 ,  Y02P70/611

Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.

公开(公告)号：US20180317351A9

公开(公告)日：2018-11-01

申请号：US15299975

申请日：2016-10-21

Applicant: Cinch Connectivity Solutions, Inc.

Inventor： Robert Joseph Baumler ,  Mark Daniel Dvorak ,  James Richard Kerekes

IPC: H05K9/00 ,  H01R13/03 ,  H01R13/6594 ,  H01R13/6598 ,  H01R24/50 ,  H05K1/18

CPC classification number: H05K9/0064 ,  H01R13/03 ,  H01R13/6594 ,  H01R13/6598 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/18 ,  H05K9/00 ,  H05K9/0066 ,  H05K9/0086 ,  H05K2201/0707

Abstract: The device includes a body and a plurality of contact portions. The body is substantially planar. The plurality of contact portions are associated with the body so as to form ports. The plurality of contact portions are in electrical communication with the body. The port of each contact portion having an inside diameter substantially equal to ID1. The body and the contact portions are constructed of a conductive metallic material.

公开(公告)号：US20180310440A1

公开(公告)日：2018-10-25

申请号：US15769548

申请日：2016-10-20

Applicant: THOMSON Licensing

Inventor： Mickey Jay HUNT ,  Randy Wayne CRAIG ,  Theodore Paul CORBIN ,  William John TESTIN ,  William Philip DERNIER

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K9/006 ,  H05K1/0216 ,  H05K9/0033 ,  H05K2201/0707 ,  H05K2201/09854 ,  H05K2201/10371 ,  H05K2201/2072

Abstract: The present disclosure relates to a printed circuit board assembly including a printed circuit board, a first shielding structure located on a first surface of the printed circuit board and having a first extension element extending from the first shielding structure and through a first hole in the printed circuit board, a second shielding structure located on a second surface of the printed circuit board. According to at least one embodiment on the present disclosure, a first contacting element of the first extension element makes a mechanical and electrical contact between the first shielding structure and the second shielding structure in a contact region entirely located outside the first hole from which the first extension element is extending through.

公开(公告)号：US09961761B2

公开(公告)日：2018-05-01

申请号：US15091667

申请日：2016-04-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Katsuya Yachi

IPC: H01J31/49 ,  H05K1/02 ,  H05K1/14 ,  A61B6/00

CPC classification number: H05K1/0216 ,  A61B6/4266 ,  A61B6/5258 ,  H05K1/141 ,  H05K2201/0707 ,  H05K2201/10151 ,  H05K2201/10606

Abstract: A radiation imaging apparatus, comprising a sensor panel in which a plurality of sensors configured to detect radiation are arrayed, a first circuit board that is arranged on the sensor panel and includes a circuit configured to read out a signal from each sensor, and a second circuit board that is arranged on the first circuit board and includes a circuit configured to read out a signal from each sensor, and whose radiant noise generation amount at a driving time of the circuit is larger than a radiant noise generation amount at a driving time of the circuit of the first circuit board, wherein the first circuit board is arranged between the sensor panel and the second circuit board.

公开(公告)号：US20180110164A1

公开(公告)日：2018-04-19

申请号：US15783330

申请日：2017-10-13

Applicant: IBIDEN CO., LTD

Inventor： Toshiki FURUTANI ,  Takema Adachi ,  Hidetoshi Noguchi ,  Shota Tachibana

IPC: H05K9/00 ,  H05K13/00

CPC classification number: H05K9/0086 ,  H05K9/003 ,  H05K9/0084 ,  H05K9/0088 ,  H05K13/0084 ,  H05K2201/0338 ,  H05K2201/0707

Abstract: A shield cap for protecting an electronic component includes a cap member having a ceiling portion, a side wall portion and a partition wall portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The cap member is formed such that the ceiling portion has an inner region and an outer region surrounding the inner region, the side wall portion is supporting the outer region, and the partition wall portion is supporting the inner region, the ceiling portion has a first surface facing the side wall portion and the partition portion and a second surface on the opposite side and includes a reinforcing material positioned between the first and second surfaces, and the cap member is formed such that the side wall, ceiling and partition wall portions are forming multiple accommodation spaces to accommodate multiple electronic components.

公开(公告)号：US20180092210A1

公开(公告)日：2018-03-29

申请号：US15274302

申请日：2016-09-23

Applicant: Apple Inc.

Inventor： Albert Wang ,  Paul A. Martinez

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H05K3/30 ,  H05K3/28 ,  H05K3/36 ,  H05K3/34 ,  H05K3/40 ,  H05K3/00

CPC classification number: H05K1/145 ,  H05K1/0218 ,  H05K1/0278 ,  H05K1/0281 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/186 ,  H05K3/0047 ,  H05K3/284 ,  H05K3/303 ,  H05K3/341 ,  H05K3/361 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4614 ,  H05K2201/042 ,  H05K2201/0707 ,  H05K2201/09118 ,  H05K2201/10522 ,  H05K2201/10734 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: Methods and devices related to the design and fabrication of molded cores for printed circuit board assemblies and system-on-package (SIP) devices are discussed. The discussed printed circuit board assemblies may have multiple electrical components embedded in a molded core matrix and forming electrical connections with one or more printed circuit boards attached to the molded core matrix. Methods for sourcing of electrical components and production of the molded cores and printed circuit board assemblies are also discussed. The methods and devices may increase a volumetric density of electrical components in printed circuit board assemblies and provide improved mechanical properties to the electrical circuit device.

公开(公告)号：US20180070464A1

公开(公告)日：2018-03-08

申请号：US15812905

申请日：2017-11-14

Applicant: Apple Inc.

Inventor： Matthew Dean ROHRBACH

IPC: H05K5/02 ,  H05K9/00 ,  F16M11/04 ,  F16M11/22 ,  B60R11/02 ,  H05K1/02 ,  H01F7/02 ,  G06F1/16 ,  F16M13/02 ,  F16M13/00 ,  F16M11/24 ,  H04M1/04 ,  B60R11/00

CPC classification number: H05K5/0204 ,  B60R11/0252 ,  B60R2011/0028 ,  F16M11/041 ,  F16M11/22 ,  F16M11/242 ,  F16M13/00 ,  F16M13/022 ,  G06F1/1633 ,  H01F7/0252 ,  H04B1/3877 ,  H04M1/04 ,  H05K1/0216 ,  H05K1/0298 ,  H05K9/002 ,  H05K2201/0707

Abstract: A magnetic stand for a tablet device is disclosed. The magnetic stand is configured to rigidly hold a portion of the tablet device in place and to shield the magnetic field from adversely affecting nearby devices susceptible to strong magnetic fields. The shielding portion of the magnetic stand allows for significant increases in magnetic field strength when compared to similarly configured, unshielded products.