公开(公告)号：US20070120680A1

公开(公告)日：2007-05-31

申请号：US10582771

申请日：2004-12-16

Applicant: Poul Jorgensen

Inventor： Poul Jorgensen

IPC: G08B13/14

CPC classification number: G08B13/2414 ,  G08B13/2437 ,  H05K1/0393 ,  H05K1/162 ,  H05K2201/055 ,  H05K2201/09081

Abstract: A resonance security tag (1) comprises a dielectric foil material (2) provided with conductive material layer patterns (3-7) on both sides. The conductive material layer patterns are formed to provide an inductor (3) and a capacitor (4, 6) positioned inside the inductor (3), and mutually connected to form a resonance circuit. By cutting (9) the capacitor (4, 6) free of the dielectric foil material (2) and folding the capacitor (4, 6) away from the position inside the inductor (3), this part is left free for the penetration of magnetic flux through the inductor (3), whereby the detection level is improved and a possibility of reducing the size of the resonance security tag is provided.

Abstract translation: 共振安全标签（1）包括在两侧设置有导电材料层图案（3-7）的电介质箔材料（2）。 形成导电材料层图案以提供位于电感器（3）内的电感器（3）和电容器（4,6），并且相互连接以形成谐振电路。 通过切割（9）没有电介质箔材料（2）的电容器（4,6）并且将电容器（4,6）折叠离开电感器（3）内部的位置，该部分保持自由以便穿透 通过电感器（3）的磁通量，从而提高检测水平，并且提供减小谐振安全标签尺寸的可能性。

公开(公告)号：US20070091242A1

公开(公告)日：2007-04-26

申请号：US11502464

申请日：2006-08-11

Applicant: Eiji Oohira

Inventor： Eiji Oohira

IPC: G02F1/1345

CPC classification number: G02F1/133615 ,  H05K1/189 ,  H05K2201/09081 ,  H05K2201/10106

Abstract: The present invention aims at the miniaturization and the reduction of thickness of a liquid crystal display device. In a liquid crystal display device which includes: a liquid crystal display panel; a backlight which is arranged on a back-surface side of the liquid crystal display panel; and a flexible printed wiring board which has one end thereof connected to a terminal portion of the liquid crystal display panel, wherein the backlight includes a frame-like mold and a light source, the flexible printed wiring board is folded outside a frame of the frame-like mold and has a portion thereof arranged on a back-surface side of the frame-like mold, the light source is housed in the inside of the frame of the frame-like mold; and the light source is mounted on a surface which opposedly faces the liquid crystal display panel in a state that the flexible printed wiring board is folded out of surfaces of the flexible printed wiring board in the vicinity of a bent portion of the flexible printed wiring board, and the flexible printed wiring board has a cutout therein in a periphery of the light source.

Abstract translation: 本发明的目的在于液晶显示装置的小型化和厚度的减小。 一种液晶显示装置，包括：液晶显示面板; 布置在液晶显示面板的背面侧的背光源; 以及柔性印刷布线板，其一端连接到液晶显示面板的端子部分，其中背光源包括框架状模具和光源，柔性印刷线路板折叠在框架的框架外部 并且其一部分布置在框架状模具的背面侧，光源容纳在框架状模具的框架的内部; 并且将光源安装在与液晶显示面板相对的表面上，该柔性印刷电路板在柔性印刷电路板的柔性印刷线路板的弯曲部分附近被折叠出来， 并且柔性印刷布线板在光源的周围具有切口。

公开(公告)号：US07207107B2

公开(公告)日：2007-04-24

申请号：US10495564

申请日：2002-11-14

Applicant: Juergen Usner ,  Ando Welling

Inventor： Juergen Usner ,  Ando Welling

IPC: H05K3/02

CPC classification number: G06K19/0775 ,  B26D7/27 ,  B26F1/18 ,  B26F1/22 ,  G06K19/077 ,  H05K3/4084 ,  H05K2201/09081 ,  H05K2201/09836 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/082 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49156 ,  Y10T29/5136 ,  Y10T29/5148 ,  Y10T29/5313 ,  Y10T83/0207

Abstract: A method and apparatus for through-contacting flexible substrates 1, in particular circuit boards, having electrically conductive contact zones 4, 41 present on two opposing surfaces 1a, 1b of the substrate provides that a cut 11 is produced obliquely to the surfaces of the substrate in the area of the contact zones, and the two substrate areas 20, 30 adjoining the oblique cut are moved past each other until they lock behind each other. Moving them past each other is effected by a ram 12, by the action of compressed air 13, by applying a vacuum 14 or by a driving hook 15 fixed to the cutting tool. The two steps of producing the cut and moving the two substrate areas adjoining the cut past each other are effected in a common processing station, preferably in a single operation.

Abstract translation: 存在于基板的两个相对表面1a，1b上的具有导电接触区域41,41的柔性基板1，特别是电路板的通过接触的方法和装置提供了一种切口11，其倾斜于 接触区域中的基板和与倾斜切口相邻的两个基板区域20,30彼此移动，直到它们彼此锁定。 通过压头空气13的作用，通过施加真空14或固定在切割工具上的驱动钩15，通过柱塞12进行移动。 在共同的处理站中，优选地在单个操作中实现产生切割和移动邻接切割的两个基板区域的两个步骤。

公开(公告)号：US20060049498A1

公开(公告)日：2006-03-09

申请号：US11259398

申请日：2005-10-26

Applicant: Zlata Kovac ,  Craig Mitchell ,  Thomas DiStefano ,  John Smith

Inventor： Zlata Kovac ,  Craig Mitchell ,  Thomas DiStefano ,  John Smith

IPC: H01L23/02

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

Abstract: An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

Abstract translation: 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

公开(公告)号：US20060014419A1

公开(公告)日：2006-01-19

申请号：US11002503

申请日：2004-12-02

Applicant: Chih-Chung Chao ,  Che-Chih Chang

Inventor： Chih-Chung Chao ,  Che-Chih Chang

IPC: H01R12/24

CPC classification number: G02F1/13452 ,  H01R12/62 ,  H01R12/7076 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09081 ,  H05K2201/10393

Abstract: Modules for fixing flexible printed circuit boards. A module comprises a casing and a flexible printed circuit board. The casing has a recess on a lateral side. The flexible printed circuit board has a flexible portion disposed in the recess, wherein the thickness of the flexible portion is substantially equal to the thickness of the recess.

Abstract translation: 用于固定柔性印刷电路板的模块。 模块包括壳体和柔性印刷电路板。 壳体在侧面具有凹部。 柔性印刷电路板具有设置在凹部中的柔性部分，其中柔性部分的厚度基本上等于凹部的厚度。

公开(公告)号：US06980017B1

公开(公告)日：2005-12-27

申请号：US09266237

申请日：1999-03-10

Applicant: Warren M. Farnworth ,  Salman Akram

Inventor： Warren M. Farnworth ,  Salman Akram

IPC: G01R1/04 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40 ,  G01R31/02 ,  G01R31/26

CPC classification number: H05K3/326 ,  G01R1/0466 ,  G01R31/2853 ,  H05K1/118 ,  H05K3/4092 ,  H05K2201/0373 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09081 ,  H05K2201/10734 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An interconnect for testing semiconductor components includes a substrate, and contacts on the substrate for making temporary electrical connections with bumped contacts on the components. Each contact includes a recess and a pattern of leads cantilevered over the recess configured to electrically engage a bumped contact. The leads are adapted to move in a z-direction within the recess to accommodate variations in the height and planarity of the bumped contacts. In addition, the leads can include projections for penetrating the bumped contacts, a non-bonding outer layer for preventing bonding to the bumped contacts, and a curved shape which matches a topography of the bumped contacts. The leads can be formed by forming a patterned metal layer on the substrate, by attaching a polymer substrate with the leads thereon to the substrate, or be etching the substrate to form conductive beams.

Abstract translation: 用于测试半导体部件的互连件包括基板和基板上的触点，用于与部件上的凸起触点进行临时电连接。 每个接触件包括一个凹部和悬在该凹部上的引线图案，其构造成电接合凸起的触点。 引线适于在凹部内在z方向上移动以适应凸起接触件的高度和平面度的变化。 此外，引线可以包括用于穿透凸起的触点的突起，用于防止与凸起的触点接合的非结合外层以及与凸起的触点的形状相匹配的弯曲形状。 可以通过在基板上形成图案化的金属层，通过将聚合物基板与其上的引线附接到基板上，或者蚀刻基板以形成导电梁来形成引线。

公开(公告)号：US20050202693A1

公开(公告)日：2005-09-15

申请号：US10863429

申请日：2004-06-08

Applicant: Min-Chien Kuo ,  Che-Chih Chang

Inventor： Min-Chien Kuo ,  Che-Chih Chang

IPC: G02F1/13 ,  H01R12/00 ,  H05K1/11 ,  H05K3/36

CPC classification number: G02F1/13452 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09081

Abstract: A flexible circuit board. The flexible circuit board is connected to an LCD module, comprising a first conductive portion, a second conductive portion, a third conductive portion, a conductive trace and a slot. The second conductive portion is disposed at the border of flexible circuit board and comprises a first contact pad. The third conductive portion is located between the first and second conductive portions. The conductive trace comprises a first trace segment a second trace segment. The first conductive segment connects the first conductive portion with the first contact pad, and the second trace segment connects the second conductive portion with the third conductive portion, wherein the slot is formed between the first and second trace segments.

Abstract translation: 柔性电路板。 柔性电路板连接到LCD模块，包括第一导电部分，第二导电部分，第三导电部分，导电迹线和狭槽。 第二导电部分设置在柔性电路板的边界处，并且包括第一接触焊盘。 第三导电部分位于第一和第二导电部分之间。 导电迹线包括第一迹线段和第二迹线段。 第一导电段将第一导电部分与第一接触焊盘连接，第二迹线段将第二导电部分与第三导电部分连接，其中狭槽形成在第一和第二迹线段之间。

公开(公告)号：US20050193553A1

公开(公告)日：2005-09-08

申请号：US11106121

申请日：2005-04-14

Applicant: Andreas Schubert ,  Sven Hochmann ,  Ralf God ,  Jorg Schneider

Inventor： Andreas Schubert ,  Sven Hochmann ,  Ralf God ,  Jorg Schneider

IPC: B21D39/03 ,  H01P11/00 ,  H01R4/10 ,  H01R4/58 ,  H01R43/00 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01P11/00 ,  B21D39/03 ,  H05K1/118 ,  H05K3/326 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/09081 ,  H05K2203/0195 ,  Y10T29/49016 ,  Y10T29/5313

Abstract: At least two components are brought to rest on each other at least in an assembly portion, with a carrier element contacting a first one of the two components at least in the assembly portion, and at least one projection passing through the components in the assembly portion in the direction towards the carrier element. The carrier element is planarly supported at least in the assembly portion against the passing-through movement of the projection, and the passing of the projection through the components. The opposed planar support of the carrier element effects a plastic deformation of the passed-through material of the components in the direction transversely to the passing-through movement of the projection by deforming the carrier element.

Abstract translation: 至少两个部件至少在组装部分中彼此搁置，其中载体元件至少在组装部分中接触两个部件中的第一部件，并且至少一个突出部通过组件部分中的部件 在朝向载体元件的方向上。 载体元件至少在组件部分中被平坦地支撑以抵抗突起的穿过运动，并且突起穿过部件。 载体元件的相对的平面支撑件通过使载体元件变形来影响元件的穿通材料在垂直于突起的穿过运动的方向上的塑性变形。

公开(公告)号：US20050179456A1

公开(公告)日：2005-08-18

申请号：US11101309

申请日：2005-04-07

Applicant: Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih

Inventor： Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H05K3/32 ,  H05K3/40 ,  G01R31/02

CPC classification number: G01R31/2886 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/07307 ,  G01R1/07342 ,  G01R3/00 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2924/00013 ,  H01L2924/00014 ,  H05K1/118 ,  H05K3/326 ,  H05K3/328 ,  H05K3/4015 ,  H05K2201/09081 ,  H05K2203/049 ,  Y10T29/49004 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/49222 ,  Y10T29/49815 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

Abstract translation: 描述电子设备探头。 探针通过将多根线球焊接到扇形基板表面上的接触位置而形成。 电线被切断留下残留物。 其中具有电导体图案的图案化聚合物片材设置在延伸穿过片材中的孔的短截线上。 电线的端部被压扁以将聚合物片材放置在适当位置。 导线连接到聚合物片上的电导体，该电导体转换成聚合物片上的接触垫。 将第二根线球焊接到聚合物片上的垫上并切割以留下第二个短截线。 聚合物片材被激光切割，使得每个第二短截线自由地独立于其它第二螺柱移动。 第二短截线的端部设置在诸如FC芯片的电子设备的接触位置，以测试电子设备。

公开(公告)号：US20040266244A1

公开(公告)日：2004-12-30

申请号：US10861316

申请日：2004-06-04

Applicant: Infineon Technologies AG

Inventor： Stefan Jung ,  Christl Lauterbach

IPC: H01R025/00

CPC classification number: D03D15/00 ,  D03D1/0088 ,  D03D15/02 ,  D10B2401/16 ,  H01R12/515 ,  H01R12/592 ,  H05K3/321 ,  H05K3/326 ,  H05K3/328 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2201/10287

Abstract: Contact-making device and method for connecting an electric conductor, in particular a wire-like and/or thread-like electric conductor which is arranged in a textile material, electrically to an electronic component. The device includes a substrate material, and at least one contact, which is formed on the substrate material, to connect the electric conductor electrically to the electronic component, the contact comprising a movable section and an immovable section. The movable section is formed such that, during the electrical connection operation, it is arranged substantially on a surface side opposite the immovable section.

Abstract translation: 用于将电导体，特别是布置在纺织材料中的线状和/或线状导电体电连接到电子部件的接触制造装置和方法。 该装置包括衬底材料和形成在衬底材料上的至少一个触点，以将电导体电连接到电子部件，该触点包括可动部分和不可移动部分。 可移动部分形成为使得在电连接操作期间，其基本上布置在与不可移动部分相对的表面侧上。