公开(公告)号：US20060116005A1

公开(公告)日：2006-06-01

申请号：US11289736

申请日：2005-11-28

Applicant: Cheng Yu ,  Hsueh Chang ,  Mao-Yuan Huang

Inventor： Cheng Yu ,  Hsueh Chang ,  Mao-Yuan Huang

IPC: H01R12/00

CPC classification number: H05K1/118 ,  H01R12/79 ,  H01R13/631 ,  H01R13/6335 ,  H05K1/0281 ,  H05K3/0058 ,  H05K2201/09109 ,  H05K2201/2009

Abstract: A reinforced flexible printed circuit board (20) includes a conductive portion (21) and a connection portion (22). The conductive portion includes a first metallic wire layer (13) having a plurality of conductive metallic wires, and two first insulation layers (24). The connection portion includes a second metallic wire layer (16) having a plurality of conductive metallic wires, two second insulation layers (17), and a reinforcement board (19) having a hand-grip portion (291). The reinforcement board is attached to one of the second insulation layers to reinforce the connection portion, and the hand-grip portion is positioned at an end of the reinforcement board so that it is convenient for workers to assemble the reinforced flexible printed circuit board to other components.

Abstract translation: 增强的柔性印刷电路板（20）包括导电部分（21）和连接部分（22）。 导电部分包括具有多个导电金属线的第一金属线层（13）和两个第一绝缘层（24）。 连接部分包括具有多个导电金属线，两个第二绝缘层（17）和具有手柄部分（291）的加强板（19）的第二金属线层（16）。 加强板附接到第二绝缘层中的一个以加强连接部分，并且手柄部分位于加强板的端部，使得工人便于将加强的柔性印刷电路板组装到其它部分 组件。

公开(公告)号：US06963491B2

公开(公告)日：2005-11-08

申请号：US10725835

申请日：2003-12-02

Applicant: Kazuo Fujii ,  Yoshihisa Ishihara ,  Aaron M. Stewart

Inventor： Kazuo Fujii ,  Yoshihisa Ishihara ,  Aaron M. Stewart

IPC: G06F1/16 ,  G06F1/18 ,  H01R13/11 ,  H01R13/115 ,  H01R43/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K7/10

CPC classification number: H01R13/112 ,  H01R43/0207 ,  H05K1/141 ,  H05K3/281 ,  H05K3/30 ,  H05K2201/09109 ,  H05K2203/0271

Abstract: In part, and in addition to apparatus and methods presented, an expansion board to be connected/disconnected to/from its mother board easily is provided. A face of a CDC (Communication Daughter Card), which is an expansion board to be connected to the mother board of a computer system is covered by an insulating sheet. In the CDC, an edge of one end of this insulating sheet is extended so as to form a projection. A user can take this projection with fingers, thereby carrying and connecting/disconnecting the CDC to/from the mother board easily.

公开(公告)号：US06918179B2

公开(公告)日：2005-07-19

申请号：US10119922

申请日：2002-04-10

Applicant: Lee Curtis Randall ,  Thomas Stanley Truman ,  Daniel James Winarski ,  George G. Zamora

Inventor： Lee Curtis Randall ,  Thomas Stanley Truman ,  Daniel James Winarski ,  George G. Zamora

IPC: H05K1/00 ,  H05K3/00 ,  H01R43/00 ,  H05K13/00

CPC classification number: B25B27/00 ,  H01R12/62 ,  H01R43/00 ,  H05K1/028 ,  H05K3/4691 ,  H05K2201/09109 ,  H05K2201/2027 ,  Y10T29/49151 ,  Y10T29/49169 ,  Y10T29/49194 ,  Y10T29/49199 ,  Y10T29/53257 ,  Y10T29/53283 ,  Y10T29/53909

Abstract: A method for preforming of two or more flexible cables in an arrangement consisting of a combination of rigid printed circuit boards and flexible cable sections extending therebetween. Moreover, also provided is an apparatus for the preforming of two or more flexible cable sections of a combination of rigid printed circuit boards and therewith interposed flexible cable sections which are adapted to interconnect the rigid printed circuit boards. The apparatus consists of a tool constituted of an elongated cylindrical member having a tapered leading end which narrows into an ultra-thin flat end section of a blade-like configuration, and which is adapted to be pushed between the flexible cables and so as to preform the flexible cable sections and cause them to yield in a predetermined outwardly bowed permanently relationship between the rigid printed circuit boards at the opposite ends thereof to lengthen the fatigue life of the conductors in the flexible cable sections.

Abstract translation: 一种用于在由刚性印刷电路板和在其之间延伸的柔性电缆部分的组合组成的布置中预成型两个或多个柔性电缆的方法。 此外，还提供了一种用于预先形成刚性印刷电路板的组合的两个或多个柔性电缆部分以及适于互连刚性印刷电路板的插入的柔性电缆部分的装置。 该装置由具有锥形前端的细长圆柱形构件构成的工具组成，该锥形前端狭窄成为叶片状结构的超薄平坦端部，并且适于被推入柔性电缆之间并且预成型件 柔性电缆部分并使它们在刚性印刷电路板的相对端处以预定的向外弯曲的永久关系屈服，以延长柔性电缆部分中的导体的疲劳寿命。

公开(公告)号：US20030194913A1

公开(公告)日：2003-10-16

申请号：US10119922

申请日：2002-04-10

Applicant: International Business Machines Corporation

Inventor： Lee Curtis Randall ,  Thomas Stanley Truman ,  Daniel James Winarski ,  George G. Zamora

IPC: H05K001/00 ,  H01R012/00

CPC classification number: B25B27/00 ,  H01R12/62 ,  H01R43/00 ,  H05K1/028 ,  H05K3/4691 ,  H05K2201/09109 ,  H05K2201/2027 ,  Y10T29/49151 ,  Y10T29/49169 ,  Y10T29/49194 ,  Y10T29/49199 ,  Y10T29/53257 ,  Y10T29/53283 ,  Y10T29/53909

Abstract: A method for preforming of two or more flexible cables in an arrangement consisting of a combination of rigid printed circuit boards and flexible cable sections extending therebetween. Moreover, also provided is an apparatus for the preforming of two or more flexible cable sections of a combination of rigid printed circuit boards and therewith interposed flexible cable sections which are adapted to interconnect the rigid printed circuit boards. The apparatus consists of a tool constituted of an elongated cylindrical member having a tapered leading end which narrows into an ultra-thin flat end section of a blade-like configuration, and which is adapted to be pushed between the flexible cables and so as to preform the flexible cable sections and cause them to yield in a predetermined outwardly bowed permanently relationship between the rigid printed circuit boards at the opposite ends thereof to lengthen the fatigue life of the conductors in the flexible cable sections.

Abstract translation: 一种用于在由刚性印刷电路板和在其之间延伸的柔性电缆部分的组合组成的布置中预成型两个或多个柔性电缆的方法。 此外，还提供了一种用于预先形成刚性印刷电路板的组合的两个或多个柔性电缆部分以及适于互连刚性印刷电路板的插入的柔性电缆部分的装置。 该装置由具有锥形前端的细长圆柱形构件构成的工具组成，该锥形前端狭窄成为叶片状结构的超薄平坦端部，并且适于被推入柔性电缆之间并且预成型件 柔性电缆部分并使它们在刚性印刷电路板的相对端处以预定的向外弯曲的永久关系屈服，以延长柔性电缆部分中的导体的疲劳寿命。

公开(公告)号：US20030173105A1

公开(公告)日：2003-09-18

申请号：US10383227

申请日：2003-03-07

Inventor： Koji Kondo ,  Satoshi Takeuchi ,  Tomohiro Yokochi ,  Katsumi Yamazaki ,  Masakazu Terada

IPC: H05K001/03

CPC classification number: H05K3/4691 ,  H05K1/118 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0909 ,  H05K2201/09109 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.

Abstract translation: 在刚性柔性印刷电路板的制造方法中，在多个树脂膜的一部分中形成用于限定除去部分的两侧的狭缝，并且将多个树脂膜堆叠并结合以形成电路板。 然后，从电路板切割产品部分。 在接合之前，将分离片设置在多个树脂膜的预定相邻层之间，以将去除部分与产品部分的残留部分分离。 因此，当从电路板切割产品部分时，由于去除部分由分离片，狭缝和产品部分的切割轮廓限定，所以移除部分与产品部分分离。

公开(公告)号：US20030150634A1

公开(公告)日：2003-08-14

申请号：US10149168

申请日：2003-02-03

Inventor： Gert Jakob ,  Herbert Gentner ,  Rainer Selig ,  Erwin Liegl ,  Stefan Rysy ,  Juergen Enzner ,  Udo Lunz ,  Hermann Maier ,  Ralf Haug

IPC: H05K005/00

CPC classification number: H01R12/62 ,  H05K1/118 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09109 ,  H05K2201/09709 ,  H05K2201/10977 ,  H05K2203/1572

Abstract: An undetachable electrical and mechanical connection (4) between a contact element (7) has contacts (31) and a counter-contact element (8) has counter-contacts (27) with a flexible section (39) of the contact element (7) in at least the area of the contacts (31). Furthermore, the contact element (7) has at least one first and second layer (21, 22) which, in the area of the flexible section (39), define a gap (23) between them in which the counter-contact element (8) is located, the first and second layer (21, 22) each having at least one contact (31) on the inside surfaces (40) of the layers facing each other and the counter-contact part (8) having at least one counter-contact on each of its top and bottom (25, 26).

Abstract translation: 接触元件（7）之间的不可触及的电气和机械连接（4）具有触点（31），并且反向接触元件（8）具有反触点（27），其中接触元件（7）的柔性部分（39） ）至少在触点（31）的区域中。 此外，接触元件（7）具有至少一个第一和第二层（21,22），其在柔性部分（39）的区域中在它们之间限定间隙（23），其中反接触元件 8）位于第一和第二层（21,22），每个在彼此面对的层的内表面（40）上具有至少一个触点（31），并且反接触部分（8）具有至少一个 在其顶部和底部（25,26）中的每一个上相互接触。

公开(公告)号：US06509529B2

公开(公告)日：2003-01-21

申请号：US09960164

申请日：2001-09-20

Applicant: Sundar Kamath ,  David Chazan ,  Jan I. Strandberg ,  Solomon I. Beilin

Inventor： Sundar Kamath ,  David Chazan ,  Jan I. Strandberg ,  Solomon I. Beilin

IPC: H05K103

CPC classification number: H05K1/0271 ,  H01L23/3735 ,  H01L23/5383 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/0272 ,  H05K2201/0133 ,  H05K2201/068 ,  H05K2201/09109 ,  H05K2201/10416 ,  H05K2201/10734 ,  H01L2224/0401

Abstract: A wiring substrate with reduced thermal expansion stress. A wiring substrate, such as a laminated PWB, thin film circuit, lead frame, or chip carrier accepts an integrated circuit, such as a die, a flip chip, or ball grid array package. The wiring substrate has a thermal expansion stress reduction insert, void, or constructive void in a thermal expansion stress region proximate to the integrated circuit. The thermal expansion stress reduction insert or void may extend a selected distance from the edge or edges of the integrated circuit attachment area. The thermal expansion stress reduction insert or void improves the flexibility of the wiring substrate in the region that is joined to the integrated circuit, thus reducing thermal stress between components of the wiring substrate-integrated circuit assembly. In another embodiment, layers of a laminated wiring substrate are intentionally not bonded beneath the chip attach area, thus allowing greater flexibility of the upper layer of the laminate.

Abstract translation: 具有降低的热膨胀应力的布线基板。 诸如层叠PWB，薄膜电路，引线框架或芯片载体的布线基板可以接受诸如管芯，倒装芯片或球栅阵列封装的集成电路。 布线基板在靠近集成电路的热膨胀应力区域中具有热膨胀应力减小插入件，空隙或构造空隙。 热膨胀应力减小插入物或空隙可以从集成电路连接区域的边缘或边缘延伸选定的距离。 热膨胀应力减小插入物或空隙提高了接合到集成电路的区域中的布线基板的柔性，从而降低了布线基板集成电路组件的部件之间的热应力。 在另一个实施例中，层叠布线基板的层有意地不粘合在芯片附着区域下方，从而允许层压体的上层更大的灵活性。

公开(公告)号：US20020066961A1

公开(公告)日：2002-06-06

申请号：US09998327

申请日：2001-12-03

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Satoru Tomekawa ,  Yoshihisa Yamashita ,  Takeshi Suzuki ,  Yoshihiro Kawakita ,  Tadashi Nakamura

IPC: H01L023/48

CPC classification number: H05K3/4069 ,  H05K1/0271 ,  H05K3/0035 ,  H05K3/20 ,  H05K3/384 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0355 ,  H05K2201/09109 ,  H05K2203/0361 ,  H05K2203/1461 ,  Y10T428/24

Abstract: A connecting strength at a bonding site between a wiring layer 1c and a conductor 1d is enhanced by comparing a bonding strength between a wiring layer 14 provided by covering the conductor 1d on an insulating base 1a and the conductor 1d with a bonding strength between the wiring layer 1c and the insulating base 1a in an adjacency of the conductor to set the latter relatively lower.

Abstract translation: 通过将绝缘基体1a上的导体1d覆盖的布线层14与导体1d之间的接合强度与导体1d之间的接合强度进行比较，可以提高布线层1c和导体1d之间的接合部位的连接强度 层1c和绝缘基底1a在导体的邻近处，以使后者相对较低。

公开(公告)号：US06299053B1

公开(公告)日：2001-10-09

申请号：US09375172

申请日：1999-08-16

Applicant: Sundar Kamath ,  David Chazan ,  Jan I. Strandberg ,  Solomon I. Beilin

Inventor： Sundar Kamath ,  David Chazan ,  Jan I. Strandberg ,  Solomon I. Beilin

IPC: B23K3102

CPC classification number: H05K1/0271 ,  H01L23/3735 ,  H01L23/5383 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/0272 ,  H05K2201/0133 ,  H05K2201/068 ,  H05K2201/09109 ,  H05K2201/10416 ,  H05K2201/10734 ,  H01L2224/0401

Abstract: A wiring substrate with reduced thermal expansion stress. A wiring substrate, such as a laminated PWB, thin film circuit, lead frame, or chip carrier accepts an integrated circuit, such as a die, a flip chip, or ball grid array package. The wiring substrate has a thermal expansion stress reduction insert, void, or constructive void in a thermal expansion stress region proximate to the integrated circuit. The thermal expansion stress reduction insert or void may extend a selected distance from the edge or edges of the integrated circuit attachment area. The thermal expansion stress reduction insert or void improves the flexibility of the wiring substrate in the region that is joined to the integrated circuit, thus reducing thermal stress between components of the wiring substrate-integrated circuit assembly. In another embodiment, layers of a laminated wiring substrate are intentionally not bonded beneath the chip attach area, thus allowing greater flexibility of the upper layer of the laminate.

Abstract translation: 具有降低的热膨胀应力的布线基板。 诸如层叠PWB，薄膜电路，引线框架或芯片载体的布线基板可以接受诸如管芯，倒装芯片或球栅阵列封装的集成电路。 布线基板在靠近集成电路的热膨胀应力区域中具有热膨胀应力减小插入件，空隙或构造空隙。 热膨胀应力减小插入物或空隙可以从集成电路连接区域的边缘或边缘延伸选定的距离。 热膨胀应力减小插入物或空隙提高了接合到集成电路的区域中的布线基板的柔性，从而降低了布线基板集成电路组件的部件之间的热应力。 在另一个实施例中，层叠布线基板的层有意地不粘合在芯片附着区域下方，从而允许层压体的上层更大的灵活性。

公开(公告)号：US5966293A

公开(公告)日：1999-10-12

申请号：US990635

申请日：1997-12-15

Applicant: Hannsjorg Obermaier ,  Keunmyung Lee

Inventor： Hannsjorg Obermaier ,  Keunmyung Lee

IPC: G06F13/40 ,  H05K3/00 ,  H05K3/46 ,  H05K7/14 ,  H05K7/10

CPC classification number: H05K3/4691 ,  G06F13/409 ,  H05K7/1442 ,  H05K7/1459 ,  H05K2201/044 ,  H05K2201/09109 ,  H05K3/4614

Abstract: An electrical interconnection structure. The electrical interconnection structure includes a mother board substrate having a plurality of layers. At least one layer includes a signal path having a characteristic impedance of Z.sub.O and a conductive ground plane. A signal via passes through each layer of the mother board substrate. The signal via electrically is connected to the signal path. A ground via passes through each layer of the mother board substrate. The ground via is electrically connected to the conductive ground plane. The electrical interconnection structure further includes a plurality of flex circuits. Each flex circuit includes a flex signal path having a characteristic impedance of Z.sub.O and a flex ground plane. Each flex signal path is electrically connected to the signal via and each flex ground plane is electrically connected to the ground via. The connections between the flex signal path and the signal via, and between the flex ground plane and the ground via can be permanent or separable.

Abstract translation: 电互连结构。 电互连结构包括具有多个层的母板衬底。 至少一层包括具有ZO的特性阻抗和导电接地平面的信号路径。 信号通孔穿过母板基板的每一层。 电信号通过信号通路连接。 接地通孔穿过母板基板的每一层。 接地通孔电连接到导电接地平面。 电互连结构还包括多个柔性电路。 每个柔性电路包括具有ZO的特性阻抗和柔性接地平面的弯曲信号路径。 每个柔性信号路径电连接到信号通孔，并且每个柔性接地平面电连接到接地通孔。 柔性信号路径和信号通孔之间，以及柔性接地平面和接地通道之间的连接可以是永久的或可分离的。