公开(公告)号：US09136702B2

公开(公告)日：2015-09-15

申请号：US13843860

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Moon Lee ,  Sung Kwon Wi ,  Ju Hwan Yang ,  Won Chul Sim ,  Young Do Kweon

IPC: H02H7/24 ,  H02H9/04 ,  H01T4/08 ,  H01T4/10 ,  H01C1/14 ,  H05K1/02 ,  H01C7/12

CPC classification number: H02H9/044 ,  H01C1/14 ,  H01C7/12 ,  H01T4/08 ,  H01T4/10 ,  H05K1/026 ,  H05K2201/09736 ,  H05K2201/09827

Abstract: Disclosed herein are an electrostatic discharge protection device including: a substrate; a pair of electrodes formed on the substrate so as to be spaced apart from each other; and an insulating layer formed on the electrodes, wherein each of the electrodes has a shape in which it protrudes from a cross section thereof toward a surface thereof, and a manufacturing method thereof, and a composite electronic component including the same.

Abstract translation: 这里公开了一种静电放电保护装置，包括：基板; 一对电极，形成在所述基板上以彼此间隔开; 以及形成在电极上的绝缘层，其中每个电极具有从其横截面向其表面突出的形状及其制造方法，以及包括该绝缘层的复合电子部件。

公开(公告)号：US20150257281A1

公开(公告)日：2015-09-10

申请号：US14642098

申请日：2015-03-09

Applicant: Marvell World Trade Ltd.

Inventor： Huahung Kao ,  Shiann-Ming Liou

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4611 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/0026 ,  H05K3/0035 ,  H05K3/10 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/4655 ,  H05K2201/09518 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2203/107 ,  Y10T156/1057 ,  H01L2924/00

Abstract: Embodiments include a multi-layer apparatus comprising a first dielectric layer, a second dielectric layer, a third dielectric layer and a fourth dielectric layer, wherein one or more of the dielectric layers include metal layers. The multi-layer apparatus further comprises a first via coupling a first metal layer and a second metal layer, a second via coupling the second metal layer and a fourth metal layer, a third via coupling the first metal layer and the second metal layer, and a fourth via coupling the third metal layer and the fourth metal layer. The first via is contiguous with the second via and the third via is contiguous with the fourth via. At least some of the vias have different depths relative to one another.

Abstract translation: 实施例包括包括第一电介质层，第二电介质层，第三电介质层和第四电介质层的多层设备，其中一个或多个电介质层包括金属层。 多层设备还包括第一通孔耦合第一金属层和第二金属层，耦合第二金属层和第四金属层的第二通孔，耦合第一金属层和第二金属层的第三通孔，以及 第四通孔，其耦合所述第三金属层和所述第四金属层。 第一通孔与第二通孔相邻，第三通孔与第四通孔相邻。 至少一些通孔相对于彼此具有不同的深度。

公开(公告)号：US20150136466A1

公开(公告)日：2015-05-21

申请号：US14275707

申请日：2014-05-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Youn PANG

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/03 ,  G03F7/30 ,  H05K1/11

CPC classification number: G03F7/30 ,  H05K3/0032 ,  H05K3/3452 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2203/041

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer having a connection pad; and a resist layer formed on the insulating layer and provided with an opening so that the connection pad is exposed, wherein a wall surface of an opening of the resist layer may have at least one protrusion.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 根据本发明的优选实施例，印刷电路板包括：具有连接垫的绝缘层; 以及形成在所述绝缘层上并具有开口以使得所述连接焊盘露出的抗蚀剂层，其中所述抗蚀剂层的开口的壁表面可以具有至少一个突起。

公开(公告)号：US08999537B2

公开(公告)日：2015-04-07

申请号：US13326169

申请日：2011-12-14

Applicant: Eunyoung Kim

Inventor： Eunyoung Kim

IPC: H01M14/00 ,  H05K1/11 ,  H01M10/42 ,  H01M2/10 ,  H05K3/34 ,  H05K3/30

CPC classification number: H01M10/425 ,  H01M2/1066 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10037

Abstract: A battery pack configured to prevent excess solder material from flowing down onto a protective circuit module (PCM) is disclosed. According to some aspects, the battery pack includes at least one battery cell, a protective circuit module (PCM) electrically connected to the battery cell, and a conductive tab configured to electrically connect the battery cell to the PCM. A tapered through hole is formed in the PCM so that the conductive tab is inserted into and fixed to the through hole.

Abstract translation: 公开了一种电池组，其被配置为防止多余的焊料材料向下流到保护电路模块（PCM）上。 根据一些方面，电池组包括至少一个电池单元，电连接到电池单元的保护电路模块（PCM）和被配置为将电池单元电连接到PCM的导电接头。 在PCM中形成锥形通孔，使得导电片插入并固定到通孔。

公开(公告)号：US20150053457A1

公开(公告)日：2015-02-26

申请号：US14196324

申请日：2014-03-04

Applicant: SAMSUNG ELECTRO-MECHANICS., LTD.

Inventor： SUNG HAN KIM ,  JIN HO HONG ,  YONG II KWON ,  SA YONG LEE ,  EUN SIL KIM ,  SANG HYUN SHIN ,  KEUN YONG LEE

IPC: H05K3/44 ,  H05K1/02

CPC classification number: H05K3/1258 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/107 ,  H05K2201/09036 ,  H05K2201/09827 ,  H05K2203/025 ,  H05K2203/0568

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. According to the preferred embodiment of the present invention, the printed circuit board includes: a glass substrate through which light is not transmitted; a positive photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and buried in the positive photosensitive insulating layer.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 根据本发明的优选实施例，印刷电路板包括：不透光的玻璃基板; 形成在玻璃基板上的正性感光绝缘层; 以及形成在玻璃基板上并埋入正光敏绝缘层中的电路图案。

公开(公告)号：US08952262B2

公开(公告)日：2015-02-10

申请号：US13599326

申请日：2012-08-30

Applicant: Daisuke Yamashita ,  Kazunaga Higo ,  Tetsuji Tsukada

Inventor： Daisuke Yamashita ,  Kazunaga Higo ,  Tetsuji Tsukada

IPC: H05K1/16 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H01L23/64 ,  H01L23/498 ,  H05K3/46 ,  H05K1/02 ,  H01L23/50

CPC classification number: H05K1/185 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49139

Abstract: A component-incorporated wiring substrate is provided. Some embodiments include a plate-like component incorporated in a core substrate and a build-up layer having an insulation layer and a conductor layer disposed in alternating layers. The component has terminal electrodes formed at its opposite ends having a side surface and a main surface. An insulation layer disposed on the main surface of the component has via conductors formed therein which are connected to the side surfaces and the main surfaces of the respective terminal electrodes. The via conductors are tapered, such that their via diameter decreases in a direction toward the terminal electrode, and their via diameter at a position where they connect to the main surface is greater than a length of the main surface. Accordingly, the area of connection between the via conductors and the corresponding terminal electrodes is increased, improving connection reliability through enhancement of tolerance for positional deviation.

Abstract translation: 提供了一种构成部件的布线基板。 一些实施例包括结合在芯基板中的板状部件和具有设置在交替层中的绝缘层和导体层的堆积层。 该部件具有在其相对端形成的端子电极，其侧表面和主表面。 设置在部件的主表面上的绝缘层具有形成在其中的通孔导体，其连接到各个端子电极的侧表面和主表面。 通孔导体是锥形的，使得它们的通孔直径在朝向端子电极的方向上减小，并且它们在它们连接到主表面的位置处的通孔直径大于主表面的长度。 因此，通孔导体与对应的端子电极之间的连接面积增加，通过增加位置偏差的公差来提高连接的可靠性。

公开(公告)号：US20150014034A1

公开(公告)日：2015-01-15

申请号：US14060365

申请日：2013-10-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Nam Hwang ,  Ju Wan Nam ,  Seung Wan Woo ,  Yee Na Shin

IPC: H05K1/18 ,  H05K3/46 ,  H05K3/30

CPC classification number: H05K3/4697 ,  H01L24/19 ,  H01L2224/04105 ,  H05K1/185 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09827 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.

Abstract translation: 这里公开了具有嵌入式电子装置的印刷电路板及其制造方法。 根据本发明的优选实施例，具有嵌入式电子设备的印刷电路板包括：具有形成在其两个表面上的电路层的芯基板; 形成在芯基板上的锥形空腔; 以及嵌入腔内的电子装置。

公开(公告)号：US08925192B2

公开(公告)日：2015-01-06

申请号：US12757163

申请日：2010-04-09

Applicant: Kota Noda ,  Tsutomu Yamauchi

Inventor： Kota Noda ,  Tsutomu Yamauchi

IPC: H01K3/10 ,  H05K1/11 ,  H05K3/00 ,  H05K3/46 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K1/115 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0554 ,  H05K2203/1572 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for manufacturing printed wiring board includes irradiating laser on first surface of substrate such that first opening portion having first opening on the first surface and inner diameter decreasing toward the second surface is formed, irradiating laser on second surface of the substrate such that second opening portion having second opening on the second surface and inner diameter decreasing toward the first surface is formed and that the second portion joins the first portion and forms a penetrating hole penetrating through the substrate, forming a first circuit on the first surface, forming a second circuit on the second surface, and filling the hole with plating such that a through-hole conductor which electrically connects the first and second circuits is formed. The first opening has diameter same as or greater than diameter of the second opening, and the first portion has depth less than depth of the second portion.

Abstract translation: 一种制造印刷电路板的方法，包括：在基板的第一表面上照射激光，使得形成在第一表面上具有第一开口的第一开口部分和朝向第二表面减小的内径;在基板的第二表面上照射激光使得第二开口 形成在第二表面上具有第二开口的部分和朝向第一表面减小的内径，并且第二部分接合第一部分并形成穿透基板的穿透孔，在第一表面上形成第一电路，形成第二电路 在第二表面上，并且用电镀填充孔，从而形成电连接第一和第二电路的通孔导体。 第一开口具有与第二开口的直径相同或更大的直径，并且第一部分的深度小于第二部分的深度。

公开(公告)号：US08826530B2

公开(公告)日：2014-09-09

申请号：US12732635

申请日：2010-03-26

Applicant: Ayao Niki ,  Atsushi Ishida ,  Ryojiro Tominaga

Inventor： Ayao Niki ,  Atsushi Ishida ,  Ryojiro Tominaga

IPC: H01K3/10 ,  H05K3/46 ,  H05K3/00 ,  C25D7/12 ,  H05K3/42 ,  C25D5/02 ,  H05K3/38

CPC classification number: H05K3/0032 ,  C25D5/02 ,  C25D7/12 ,  C25D7/123 ,  H05K3/387 ,  H05K3/422 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2203/095 ,  H05K2203/1572 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.

Abstract translation: 一种用金属膜制造衬底的方法包括制备在第一表面的相对侧具有第一表面和第二表面的绝缘衬底，在绝缘衬底中形成具有从第一表面的第一表面逐渐变细的内壁的穿透孔 所述绝缘基板朝向所述第二表面，在所述穿透孔的内壁上形成含有聚合引发剂和可聚合化合物的组合物层，用能量照射所述组合物层，使得聚合物形成在所述聚合物的内壁上 穿孔，在聚合物上涂布电镀催化剂，在贯通孔的内壁上形成电镀金属膜。

公开(公告)号：US20140209356A1

公开(公告)日：2014-07-31

申请号：US14231780

申请日：2014-04-01

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Norio SAKAI ,  Yoshihito OTSUBO

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/19105 ,  H05K1/115 ,  H05K3/4629 ,  H05K3/4652 ,  H05K2201/09709 ,  H05K2201/09827 ,  Y10T29/49165

Abstract: A multilayer wiring substrate includes a substrate main body and a plurality of wiring lines. The substrate main body includes first and second main surfaces. The plurality of wiring lines extend from the first main surface toward the second main surface side in the substrate main body. The substrate main body includes a plurality of insulator layers laminated on each other. The wiring lines each include via conductors separately provided in the plurality of insulator layers. In at least one of the plurality of wiring lines, a diameter of the via conductor provided in a first insulator layer defining the first main surface of the substrate main body is smaller than a diameter of the via conductor provided in at least one of the plurality of insulator layers other than the first insulator layer.

Abstract translation: 多层布线基板包括基板主体和多条布线。 基板主体包括第一和第二主表面。 多个布线从基板主体的第一主面向第二主面侧延伸。 基板主体包括彼此层叠的多个绝缘体层。 布线各自包括分开设置在多个绝缘体层中的通孔导体。 在多个布线中的至少一个中，设置在限定基板主体的第一主表面的第一绝缘体层中的通孔导体的直径小于设置在多个布线中的至少一个布线中的通孔导体的直径 的除了第一绝缘体层之外的绝缘体层。