公开(公告)号：US07285730B2

公开(公告)日：2007-10-23

申请号：US10774551

申请日：2004-02-09

Applicant: Ken Furukuwa

Inventor： Ken Furukuwa

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/4046 ,  H01L23/3735 ,  H01L23/5384 ,  H01L25/072 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0355 ,  H05K2201/10416 ,  H01L2924/00

Abstract: In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 μm shorter relative to the thickness of the ceramic substrate; the metal circuit plates are attached to both surfaces of the ceramic substrate to stop up the through hole; and the metal column and the metal circuit plate are bonded together via the brazing material. For its manufacture, the metal column with brazing material is used that is made 40 to 140 μm longer relative to the thickness of the ceramic substrate by being formed of the metal column which is 0 to 150 μm shorter relative to the thickness of the ceramic substrate and has its both ends coated with the brazing material.

Abstract translation: 在陶瓷电路板中，在陶瓷基板的通孔内布置相对于陶瓷基板的厚度为0〜150μm的金属柱更短; 金属电路板安装在陶瓷基板的两个表面上，以阻止通孔; 并且金属柱和金属电路板通过钎焊材料结合在一起。 对于其制造，使用通过由相对于陶瓷基板的厚度为0〜150μm的金属柱形成的，相对于陶瓷基板的厚度为40〜140μm的金属柱， 并且其两端涂覆有钎焊材料。

公开(公告)号：US07273987B2

公开(公告)日：2007-09-25

申请号：US10063104

申请日：2002-03-21

Applicant: Charles Adrian Becker ,  Stanton Earl Weaver ,  Thomas Elliot Stecher

Inventor： Charles Adrian Becker ,  Stanton Earl Weaver ,  Thomas Elliot Stecher

IPC: H05K1/16

CPC classification number: H05K1/0204 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4611 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10416 ,  H01L2924/00

Abstract: A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes (“LEDs”) and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith.

Abstract translation: 灵活的互连结构允许从包括诸如发光二极管（“LED”）和/或激光二极管的发光元件的电气设备产生的热量的快速散热。 柔性互连结构包括：（1）至少一个柔性电介质膜，电路迹线和任选的电路部件形成在其上，其至少一部分通过其厚度去除; 和（2）至少一个附着在与形成电路迹线的表面相对的柔性电介质膜的一个表面上的散热片。 柔性互连结构可以包括多个这样的柔性介电膜，每个支撑电路迹线和/或电路部件，并且每个通过电绝缘层附接到另一个。 具有复杂形状的电气设备或光源由这种柔性互连结构和附接到散热器的发光元件形成为与其热接触。

公开(公告)号：US20060283624A1

公开(公告)日：2006-12-21

申请号：US11493469

申请日：2006-07-25

Applicant: Jerry Ok ,  Robert Greenberg

Inventor： Jerry Ok ,  Robert Greenberg

IPC: H01B17/26

CPC classification number: H05K3/4046 ,  H01L21/486 ,  H01L23/10 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/10287 ,  H05K2201/10416 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49162 ,  Y10T29/49163 ,  Y10T428/24926 ,  H01L2924/00

Abstract: A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of ≦40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable for implantation in a patient's body. The method involves: (a) providing an unfired, ceramic sheet having a thickness of ≦40 mils and preferably comprising ≦99% aluminum oxide; (b) forming multiple blind holes in said sheet; (c) inserting solid wires, preferably of platinum, in said holes; (d) firing the assembly of sheet and wires to a temperature sufficient to sinter the sheet material but insufficient to melt the wires; and (e) removing sufficient material from the sheet lower surface so that the lower ends of said wires are flush with the finished sheet lower surface.

Abstract translation: 一种适于在厚度<40密耳的陶瓷片中形成气密电馈通件的方法和装置。 更具体地，该方法产生一种包括生物相容性和电化学稳定性并且适于植入患者体内的气密电馈通装置。 该方法包括：（a）提供厚度<= 40密耳，优选包含<= 99％氧化铝的未烧制的陶瓷片; （b）在所述片材中形成多个盲孔; （c）将优选铂的实心线插入所述孔中; （d）将片材和电线的组件烧制到足以烧结片材但不足以熔化电线的温度; 以及（e）从片材下表面去除足够的材料，使得所述电线的下端与成品片材下表面齐平。

公开(公告)号：US07120033B2

公开(公告)日：2006-10-10

申请号：US10196027

申请日：2002-07-16

Applicant: Kurt Gross ,  Hans Rappl

Inventor： Kurt Gross ,  Hans Rappl

IPC: H05K7/10

CPC classification number: H01L23/13 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/308 ,  H05K3/44 ,  H05K2201/1025 ,  H05K2201/10416 ,  H05K2201/1059 ,  Y10T29/49147 ,  Y10T29/49153 ,  H01L2924/00

Abstract: An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate (1) and the support plate (1) by providing a hole (4, 5), into which an electrically conducting bonding element (2) with a bondable surface (3) is pressed in such a way that the support plate (1) and the bonding element (2) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element (2).

Abstract translation: 在布置在导电支撑板（1）的电子电路（S）和支撑板（1）之间通过提供一个孔（4,5）而产生导电接合连接（B） 具有可粘合表面（3）的元件（2）以支撑板（1）和接合元件（2）进入导电和摩擦连接的方式被按压; 随后用接合元件（2）产生接合连接。

公开(公告)号：US20060152322A1

公开(公告)日：2006-07-13

申请号：US11296579

申请日：2005-12-07

Applicant: Ronald Whittaker ,  Joe Guerra ,  Ciprian Marcoci

Inventor： Ronald Whittaker ,  Joe Guerra ,  Ciprian Marcoci

IPC: H01F5/00

CPC classification number: H01F27/266 ,  H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

公开(公告)号：US20060061969A1

公开(公告)日：2006-03-23

申请号：US11228886

申请日：2005-09-16

Applicant: Thord Nilson ,  Ulf Karlsson ,  Jan Berglund ,  Ola Ro ,  Carl Forborgen ,  Erik Rocklinger

Inventor： Thord Nilson ,  Ulf Karlsson ,  Jan Berglund ,  Ola Ro ,  Carl Forborgen ,  Erik Rocklinger

IPC: H05K7/20

CPC classification number: H05K1/0204 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/10166 ,  H05K2201/10416

Abstract: A circuit arrangement comprises a circuit board (10), a semi-conductor (12) provided on a first side of the circuit board, and a heat sink (15) provided on a second side of the circuit board opposite to the first side and in heat transferring contact with the power semi-conductor. A heat conductive element (13) is provided in a hole (10a) in the circuit board, wherein the heat conductive element is positioned in heat transferring contact with both the semi-conductor and the heat sink for transfer of heat generated by the semi-conductor to the heat sink. A circuit arrangement is provided, wherein the provision of a low thermal resistance path through the circuit board by means of heat conductive elements provides a compact circuit arrangement well suited for assembly by means of an automated surface mounting process.

Abstract translation: 电路装置包括电路板（10），设置在电路板的第一侧上的半导体（12）和设置在电路板的与第一侧相对的第二侧的散热片（15），以及 与电力半导体传热接触。 导电元件（13）设置在电路板的孔（10a）中，其中导热元件位于与半导体和散热片两者的传热接触中，用于传递由半导体 导体到散热片。 提供了一种电路装置，其中通过导热元件提供通过电路板的低热阻路径提供了非常适合于通过自动表面安装工艺组装的紧凑的电路布置。

公开(公告)号：US20060023432A1

公开(公告)日：2006-02-02

申请号：US11191733

申请日：2005-07-28

Applicant: Jens Hockel ,  Patrick Muller

Inventor： Jens Hockel ,  Patrick Muller

IPC: H05K7/06

CPC classification number: H05K1/0204 ,  H05K2201/0323 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: A printed circuit board having a thermally conductive and electrically insulating layer (1) at the top side of the printed circuit board (6), and a heat conducting element (2) which thermally connects the layer (1) to the underside of the printed circuit board (6). Furthermore, a method for producing such a printed circuit board (6) is described.

Abstract translation: 一种印刷电路板，其在印刷电路板（6）的顶侧具有导热和电绝缘层（1），以及导热元件（2），其将层（1）热连接到印刷电路板 电路板（6）。 另外，对印刷电路板（6）的制造方法进行说明。

公开(公告)号：US20050152118A1

公开(公告)日：2005-07-14

申请号：US10926070

申请日：2004-08-26

Applicant: Sung-wook Cho

Inventor： Sung-wook Cho

IPC: G06F1/20 ,  G11B17/04 ,  G11B33/12 ,  G11B33/14 ,  H01L23/13 ,  H01L23/34 ,  H01L23/367 ,  H05K1/02 ,  H05K7/20

CPC classification number: G11B33/123 ,  G06F1/20 ,  G11B17/056 ,  G11B33/1426 ,  H01L23/13 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K7/20436 ,  H05K2201/09054 ,  H05K2201/10416 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A device to cool an integrated circuit element, the device having a printed circuit board with a through hole smaller than the integrated circuit element; a cooling pad attached to a first element surface of the integrated circuit element, and positioned inside the through hole; and a heat transfer portion connected with a heat absorption body and making contact with the cooling pad, to transfer heat to the heat absorption body, so that the integrated circuit element is cooled by transferring the heat generated in the integrated circuit element, which is mounted on a first surface of the printed circuit board, to the heat absorption body, which is disposed facing a second surface of the printed circuit board opposite the first surface.

Abstract translation: 一种用于冷却集成电路元件的装置，该装置具有具有比该集成电路元件小的通孔的印刷电路板; 安装在集成电路元件的第一元件表面上并位于通孔内的冷却垫; 以及与吸热体连接并与冷却垫接触的传热部，将热量传递到吸热体，使得集成电路元件通过传递集成电路元件中产生的热而被冷却，该集成电路元件安装 在所述印刷电路板的第一表面上，与所述印刷电路板的与所述第一表面相对的第二表面设置的吸热体。

公开(公告)号：US06908318B2

公开(公告)日：2005-06-21

申请号：US10484175

申请日：2002-08-06

Applicant: Kohichiro Kawate

Inventor： Kohichiro Kawate

IPC: H05K3/40 ,  H05K3/46 ,  H01R4/58 ,  C09J7/00

CPC classification number: H05K3/4046 ,  H05K3/4614 ,  H05K2201/10378 ,  H05K2201/10416 ,  H05K2203/1189 ,  Y10T156/1057 ,  Y10T428/24917

Abstract: A batch electrically connecting sheet makes it possible to form an electric connection with mechanical, thermal, and electrical stability at plural points of contact. A batch electrically connecting sheet comprises a heat-resistant sheet having plural perforations, conductive blocks, inserted in the perforations, having ridges including indentations and projections; the projections are outstanding from the perforations, and the conductive blocks are thicker than the heat-resistant sheet, and the heat-resistant sheet has an adhesive layer composed of a heat curable adhesive agent applied on at least one surface thereof, covering the projections of the conductive blocks.

Abstract translation: 一批电连接片可以在多个接触点处形成机械，热和电稳定性的电连接。 批次电连接片包括具有多个穿孔的耐热片，插入穿孔中的导电块，具有包括凹陷和突起的脊; 突起从穿孔突出，并且导电块比耐热片厚，并且耐热片具有由施加在其至少一个表面上的可热固化粘合剂构成的粘合剂层，覆盖突起 导电块。

公开(公告)号：US20040240183A1

公开(公告)日：2004-12-02

申请号：US10457247

申请日：2003-06-09

Inventor： Toshio Ishizaki

IPC: H05K007/20 ,  H01L023/34

CPC classification number: H05K1/0243 ,  H01L23/3677 ,  H01L23/66 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K1/0306 ,  H05K3/4046 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10416 ,  H01L2924/00

Abstract: A ceramic laminated board is provided which has thermal via holes penetrating the inside from the main face of the board. In the thermal via hole, a heat transfer body is placed which has a metallic body and a composite material provided entirely orpartiallybetween themetallicbody and the ceramic laminated board. The composite material is higher in thermal conductivity than air and is lower in thermal expansion coefficient than the metallic body.

Abstract translation: 提供一种陶瓷层压板，其具有从板的主面穿透内部的热通孔。 在热通孔中，放置传热体，其具有金属体和完全或部分地设置在金属体和陶瓷层压板之间的复合材料。 复合材料的导热性高于空气，热膨胀系数低于金属体。