公开(公告)号：US06864577B2

公开(公告)日：2005-03-08

申请号：US10132960

申请日：2002-04-26

Applicant: William J. Clatanoff ,  Gayle R. T. Schueller ,  Robert J. Schubert ,  Yusuke Saito ,  Hideo Yamazaki ,  Hideaki Yasui

Inventor： William J. Clatanoff ,  Gayle R. T. Schueller ,  Robert J. Schubert ,  Yusuke Saito ,  Hideo Yamazaki ,  Hideaki Yasui

IPC: H01L23/12 ,  H01L23/498 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/10681 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.

Abstract translation: 电路包括具有第一表面和第二表面的电介质层的衬底。 导电层形成在第一表面上。 在基板的电介质层中形成斜面通孔。 通孔具有第一表面中的第一宽度的第一开口和第二表面中的第二宽度的第二开口，第二宽度大于第一宽度。 导电插头连接到导电层。 插塞形成在通孔中并且从邻近第一开口朝向第二开口延伸并且在插头接口表面处邻近第二开口终止。 导电焊球连接到插头接口表面并延伸以从第二表面突出。

公开(公告)号：US20040262736A1

公开(公告)日：2004-12-30

申请号：US10831340

申请日：2004-04-26

Inventor： Sin-Gu Kang

IPC: H01L023/495 ,  H01L023/48 ,  H01L023/053

CPC classification number: H05K1/028 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/0989 ,  H05K2201/10681 ,  H01L2924/00

Abstract: Disclosed is a tape carrier package for electrically connecting LCD panel with source and gate driver PCBs and an LCD module to which the tape carrier package is applied. The tape carrier package includes: a first flexible film made of insulator; a conductive pattern formed on the first flexible film and having a plurality of input/output leads each having an input terminal and an output terminal; a semiconductor chip having a plurality of input/output terminals electrically connected with the input/output leads of the conductive pattern; and a second film made of insulator, the second film coating the conductive input/output leads such that the input/output leads are exposed by a selected length from respective ends thereof, wherein at least one selected lead of the input/output leads disposed at at least one sided end of the tape carrier package comprises a first portion and a second portion which is wider than the first portion, the second portion extending from a first selected position of the exposed leads to a second selected position of the second film passing over a boundary between the second film and the exposed leads.

Abstract translation: 公开了用于将LCD面板与源极和栅极驱动器PCB电连接的带载体封装以及应用带载体封装的LCD模块。 带状载体包括：由绝缘体制成的第一柔性膜; 形成在所述第一柔性膜上并具有多个具有输入端子和输出端子的输入/输出引线的导电图案; 具有与导电图案的输入/输出引线电连接的多个输入/输出端子的半导体芯片; 以及由绝缘体制成的第二膜，所述第二膜涂覆所述导电输入/输出引线，使得所述输入/输出引线从其相应端部暴露出选定长度，其中所述输入/输出引线中的至少一个选定引线设置在 所述带状载体封装的至少一侧端部包括第一部分和比所述第一部分宽的第二部分，所述第二部分从所述暴露引线的第一选定位置延伸到所述第二膜的第二选定位置， 第二膜和暴露引线之间的边界。

公开(公告)号：US06819371B2

公开(公告)日：2004-11-16

申请号：US10615818

申请日：2003-07-09

Applicant: Tsutomu Kanatsu

Inventor： Tsutomu Kanatsu

IPC: G02F11333

CPC classification number: H05K1/028 ,  G02F1/13452 ,  H05K1/147 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/10681

Abstract: In a flat panel display device, in which a display panel 1 loosely fitted on a main surface of a chassis 4 and circuit substrates held in hook portions provided on side surfaces of the chassis are connected each other through TCP's by bending the latter TCP's, and a method for manufacturing the same device, a main slit for a rounded portion of each TCP is formed in a rounded portion of the TCP and an auxiliary sub slit is also formed adjacent to the main slit. In order to reduce the peeling force exerted on connecting/fixing portions between the TCP's and the display panel, the circuit substrate is pulled up by bending the main and sub slits and then returning the sub slit to a flat state to insert the circuit substrate into the hook portions.

Abstract translation: 在平板显示装置中，其中松散地装配在底盘4的主表面上的显示面板1和保持在设置在底盘的侧表面上的钩部中的电路基板通过TCP相互连接，通过弯曲后者TCP，并且 制造同一装置的方法中，每个TCP的圆形部分的主狭缝形成在TCP的圆形部分中，辅助副狭缝也形成在与主狭缝相邻的位置。 为了减少施加在TCP和显示面板之间的连接/固定部分上的剥离力，通过弯曲主和副狭缝将电路基板拉起，然后将副狭缝返回到平坦状态以将电路基板插入 钩部。

公开(公告)号：US20040201809A1

公开(公告)日：2004-10-14

申请号：US10838241

申请日：2004-05-05

Inventor： Masuyuki Ohta ,  Masahiro Ishi ,  Kikuo Ono ,  Nobuyuki Suzuki

IPC: G02F001/1335

CPC classification number: G02F1/134363 ,  G02F1/133345 ,  G02F1/1368 ,  G02F2001/136218 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/10136 ,  H05K2201/10681

Abstract: An active matrix type liquid crystal display device having a first and a second substrate with a liquid crystal layer therebetween, a plurality of drain lines and gate lines formed on the first substrate and crossing each other in a matrix form, and a plurality of counter signal lines formed on the first substrate and extending along an extension direction of the gate lines. Pixels are delimited by adjacent ones of the drain lines and the gate lines. A counter signal line connects counter electrodes of neighboring pixels which are arranged with a drain line therebetween by crossing the drain line, and the counter electrodes of neighboring pixels which are arranged with a gate line therebetween are electrically connected by a connecting member. The connecting member is arranged so as to be spaced with respect to the drain line in plane view.

Abstract translation: 一种有源矩阵型液晶显示装置，其具有在其间具有液晶层的第一和第二基板，形成在第一基板上并以矩阵形式彼此交叉的多个漏极线和栅极线，以及多个计数器信号 形成在第一基板上并沿着栅极线的延伸方向延伸的线。 像素由相邻的漏极线和栅极线限定。 计数信号线通过与漏极线相交而连接排列在其间的相邻像素的对置电极，并且通过连接构件电连接在其间具有栅极线的相邻像素的对置电极。 连接构件布置成在平面视图中相对于排水管线间隔开。

公开(公告)号：US20040183985A1

公开(公告)日：2004-09-23

申请号：US10801224

申请日：2004-03-16

Applicant: Fujitsu Display Technologies Corporation

Inventor： Yoshihisa Taguchi

IPC: G02F001/1345

CPC classification number: H05K1/0268 ,  G02F1/1309 ,  H05K3/361 ,  H05K2201/09727 ,  H05K2201/10681

Abstract: A liquid crystal display apparatus that can detect a signal in an input signal wire and perform tests by measuring the resistance of the wire even without any signal input substrate is disclosed. The liquid crystal display apparatus includes an almost quadrilateral liquid crystal panel having a liquid crystal display part and a plurality of first drive IC substrates. The first drive IC substrates are aligned along an edge of the liquid crystal panel and connected to the liquid crystal panel. Each first drive IC substrate has a first drive IC and further includes a through wire to connect between distinct terminals of a plurality of terminals aligned along an edge thereof, and a test pad is formed on a portion of the through wire.

Abstract translation: 公开了一种液晶显示装置，其能够检测输入信号线中的信号，并且即使没有任何信号输入基板也可以通过测量线的电阻进行测试。 液晶显示装置包括具有液晶显示部分和多个第一驱动IC基板的几乎四边形的液晶面板。 第一驱动IC基板沿着液晶面板的边缘排列并连接到液晶面板。 每个第一驱动IC基板具有第一驱动IC，并且还包括用于连接沿着其边缘排列的多个端子的不同端子之间的通孔，并且在通孔的一部分上形成测试焊盘。

公开(公告)号：US20040174486A1

公开(公告)日：2004-09-09

申请号：US10806097

申请日：2004-03-23

Inventor： Kazuhiro Ogawa ,  Kazuhiko Yanagawa

IPC: G02F001/1343

CPC classification number: G02F1/13452 ,  G02F1/134363 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/244 ,  H05K3/28 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/09709 ,  H05K2201/10659 ,  H05K2201/10681 ,  H01L2924/00

Abstract: A liquid crystal display device which provides reliable connection between a semiconductor device and a printed circuit board includes a liquid crystal display panel, a printed circuit board disposed close to the liquid crystal display panel, and a semiconductor device of a film carrier type which is disposed to lie between the liquid crystal display panel and the printed circuit board, and terminals of the semiconductor device are respectively connected by an anisotropic conductive film to terminals of the printed circuit board that are disposed in opposition to the respective terminals of the semiconductor device.

Abstract translation: 提供半导体器件和印刷电路板之间的可靠连接的液晶显示装置包括液晶显示面板，靠近液晶显示面板设置的印刷电路板，以及设置在薄膜载体型的半导体器件 位于液晶显示面板和印刷电路板之间，并且半导体器件的端子分别通过各向异性导电膜连接到与半导体器件的各个端子相对设置的印刷电路板的端子。

公开(公告)号：US06674155B2

公开(公告)日：2004-01-06

申请号：US09902154

申请日：2001-07-11

Applicant: Kouki Nakahara ,  Hitoshi Morishita

Inventor： Kouki Nakahara ,  Hitoshi Morishita

IPC: H01L23495

CPC classification number: H05K1/0281 ,  G02F1/13452 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/0125 ,  H05K2201/09909 ,  H05K2201/10681 ,  H05K2201/2009

Abstract: A chip carrier film comprising a metal wiring formed on a surface of a base film, a first insulating film covering the metal wiring excluding a semiconductor chip connecting pad portion and a terminal connecting pad portion, a semiconductor chip connected to the semiconductor chip connecting pad portion of the metal wiring and mounted on the base film, and a second insulating film formed on a back face of the base film and having a different coefficient of curing shrinkage from that of the first insulating film. It is possible to obtain a chip carrier film capable of preventing the suspension of the base film from being generated by the self weight of the semiconductor chip when holding the base film by the delivery device and of carrying out mounting without a hindrance.

公开(公告)号：US06657606B2

公开(公告)日：2003-12-02

申请号：US09886128

申请日：2001-06-22

Applicant: Sin-Gu Kang ,  Sun-Kyu Son ,  Kyung-Seop Kim ,  Min-Sung Choi

Inventor： Sin-Gu Kang ,  Sun-Kyu Son ,  Kyung-Seop Kim ,  Min-Sung Choi

IPC: G09G336

CPC classification number: H05K3/361 ,  G02F1/13452 ,  H05K1/0269 ,  H05K1/0281 ,  H05K3/28 ,  H05K2201/09781 ,  H05K2201/10681 ,  H05K2201/2009 ,  H05K2203/0588 ,  H05K2203/166

Abstract: A liquid crystal display device has a flexible circuit board which can prevent the disconnections of output side conductive layer patterns formed at the border portion of the solder resist layer. A flexible base film has a liquid crystal panel engaging portion, engaged with a liquid crystal panel on one side thereof. A driving IC is formed at the central portion of the base film to apply driving signals to driving devices of the liquid crystal panel. A first conductive layer patterns are extended on the base film from the driving IC to the liquid crystal panel engaging portion to electrically connect the driving IC to the liquid crystal panel. A solder resin layer exposes the first conductive layer patterns formed on the liquid crystal panel engaging portion and covers the first conductive layer patterns of the periphery of the driving IC. A reinforcing member prevents the first conductive layer patterns from disconnecting due to the bending fatigue of the border portion of the liquid crystal panel engaging portion and the solder resin layer.

公开(公告)号：US20030218238A1

公开(公告)日：2003-11-27

申请号：US10391746

申请日：2003-03-20

Inventor： Hiroshi Kikuchi ,  Norio Nakazato ,  Hideko Ando ,  Takashi Suga ,  Satoru Isomura ,  Takashi Kubo ,  Hiroyasu Sasaki ,  Masanori Fukuhara ,  Naotaka Tanaka ,  Fujiaki Nose

IPC: H01L023/02

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1903 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K3/361 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10659 ,  H05K2201/10681 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

Abstract translation: 来自具有布置在其两侧的表面层信号引线和表面层GND引线的带状线段的高频信号经由封装衬底的信号表面层布线直接输入到半导体芯片，并通过焊料凸块电极 。 或者，来自半导体芯片的高频信号经由带状线路部分反向输出到外部。 由于仅在封装衬底的整个表面层处的微带线传输高频信号，所以高频信号可以仅通过表层的微带线传输，而不需要通过通孔等。 因此，可以不损失频率特性来发送高频信号，并且可以在高频率传输时以低损耗的方式发送高质量的高频信号。

公开(公告)号：US06633002B2

公开(公告)日：2003-10-14

申请号：US09575092

申请日：2000-05-19

Applicant: Noriaki Atou

Inventor： Noriaki Atou

IPC: H01B700

CPC classification number: H05K1/028 ,  H01L2224/50 ,  H05K3/28 ,  H05K2201/0394 ,  H05K2201/10681 ,  H01L2924/00012

Abstract: A tape carrier with high density wiring patterns and having high flexibility, a tape carrier package using such tape carrier, and a method of manufacturing them. The tape carrier has a base film made of an insulating material and having wiring patterns formed thereon. The tape carrier also has a bending area for bending the tape carrier therein. In the bending hole region, a plurality of round holes are formed regularly. Diameter of each of the holes is larger than a space between the wiring patterns in the bending area. Preferably, the centers of the holes are located at grid points of an assumed predetermined grid and at the intersections of diagonal lines connecting the grid points. Also, the center of each of the plurality of holes is located on the center line of a space between adjacent wiring patterns in the bending area.

Abstract translation: 具有高密度布线图案并且具有高柔性的带载体，使用这种带载体的带载体包装及其制造方法。 带载体具有由绝缘材料制成并具有形成在其上的布线图案的基膜。 带载体还具有用于在其中弯曲带载体的弯曲区域。 在弯曲孔区域中，规则地形成多个圆孔。 每个孔的直径大于弯曲区域中的布线图案之间的空间。 优选地，孔的中心位于假设的预定网格的网格点处，并且位于连接网格点的对角线的交点处。 此外，多个孔的每一个的中心位于弯曲区域中的相邻布线图案之间的空间的中心线上。