Abstract:
A high voltage insulator for preventing instability in an ion implanter due to triple junction breakdown is described. In one embodiment, there is an apparatus for preventing triple junction instability in an ion implanter. In this embodiment, there is a first metal electrode and a second metal electrode. An insulator is disposed between the first metal electrode and the second metal electrode. The insulator has at least one surface between the first metal electrode and the second metal electrode that is exposed to a vacuum that transports an ion beam generated by the ion implanter. A first conductive layer is located between the first metal electrode and the insulator. The first conductive layer prevents triple junction breakdown from occurring at an interface of the first electrode, insulator and vacuum. A second conductive layer is located between the second metal electrode and the insulator opposite the first conductive layer. The second conductive layer prevents triple junction breakdown from occurring at an interface of the second electrode, insulator and vacuum.
Abstract:
An ion source element includes a cold cathode, a grid electrode, and an ion accelerator. The cold cathode, the grid electrode, and the ion accelerator are arranged in that order and are electrically separated from one another. A space between the cold cathode and the grid electrode is essentially smaller than a mean free path of electrons at an operating pressure. The ion source element is thus stable and suitable for various applications.
Abstract:
An on-axis ion source has an ionization chamber and an adjacent low-pressure region. The on-axis ion source also includes a capillary tube having an axial bore for supporting fluid communication between the ionization chamber and the adjacent low-pressure region, the axial bore of the capillary tube being substantially concentrically aligned with the orifice of a skimmer located downstream in the ion path from the capillary tube. A blocking element is provided in an aligned facing arrangement with the axial bore of the capillary tube and on an opposite side of the orifice relative to the capillary tube. The blocking element receives droplets or particles flowing through the axial bore of the capillary tube and passing through the orifice of the skimmer. The combination of an on-axis arrangement and the use of a blocking element results in improved signal-to-noise level due to enhanced ion transmission and reduction of noise arising from passage of undesolvated droplets and particles to the mass analyzer.
Abstract:
An emitting apparatus 50 has a gas cluster generation chamber 2 and a nozzle 3 as means for generating a gas cluster and emitting the gas cluster to a processing object 10. A group of gas clusters jetted from the nozzle 3 is shaped into a gas cluster stream 8 in a beam form when passing through a skimmer 4. Electrons are emitted from an electron gun 12 to the gas cluster stream 8, whereby the gas cluster in the gas cluster stream is ionized.
Abstract:
A vapor delivery system for delivering a steady flow of sublimated vapor to a vacuum chamber comprises a vaporizer of solid material, a mechanical throttling valve, and a pressure gauge, followed by a vapor conduit to the vacuum chamber. The vapor flow rate is determined by both the temperature of the vaporizer and the setting of the conductance of the mechanical throttle valve located between the vaporizer and the vacuum chamber. The temperature of the vaporizer is determined by closed-loop control to a set-point temperature. The mechanical throttle valve is electrically controlled, e.g. the valve position is under closed-loop control to the output of the pressure gauge. In this way the vapor flow rate can be generally proportional to the pressure gauge output. All surfaces exposed to the vapor from the vaporizer to the vacuum chamber are heated to prevent condensation. A gate valve and a rotary butterfly valve are shown acting as the upstream throttling valve. Employing a fixed charge of solid material, the temperature of the vaporizer may be held steady for a prolonged period, during which the throttle valve is gradually opened from a lower conductance of its operating range as the charge sublimes. When a greater valve displacement is reached, the temperature is raised, to enable the valve to readjust to its lower conductance setting from which it can again gradually open as more of the charge is consumed.
Abstract:
A new method and system for desorption ionization is described and applied to the ionization of various compounds, including peptides and proteins present on metal, polymer, and mineral surfaces. Desorption electrospray ionization (DESI) is carried out by directing charged droplets and/or ions of a liquid onto the surface to be analyzed. The impact of the charged particles on the surface produces gaseous ions of material originally present on the surface. The resulting mass spectra are similar to normal ESI mass spectra in that they show mainly singly or multiply charged molecular ions of the analytes. The DESI phenomenon was observed both in the case of conductive and insulator surfaces and for compounds ranging from nonpolar small molecules such as lycopene, the alkaloid coniceine, and small drugs, through polar compounds such as peptides and proteins. Changes in the solution that is sprayed can be used to selectively ionize particular compounds, including those in biological matrices. In vivo analysis is demonstrated.
Abstract:
Plasma ion implantation apparatus includes a process chamber, a platen located in the process chamber for supporting a substrate, a dopant source including a solid dopant element and a vaporizer to vaporize dopant material from the solid dopant element, a plasma source to produce a plasma containing ions of the dopant material, and an implant pulse source to apply implant pulses to the platen for accelerating the ions of the dopant material from the plasma into the substrate.
Abstract:
An ion beam extractor controls a direction and an intensity of ion beams by adjusting a voltage applied to a grid having slits formed therein, thereby enhancing uniformity of an etching rate of a wafer, leading to an increase of productivity of semiconductor diodes. The ion beam extractor comprises an ion source to produce an ion beam and at least one grid located at a rear end of the ion source in a progressing path of the ion beam produced by the ion source to adjust a direction of the ion beam by controlling a voltage applied to the at least one grid.
Abstract:
A target supplier accelerates a target material injected from a nozzle such that a velocity of the target material after accelerated is kept within a predetermined range. The target supplier includes: a target nozzle that injects a target material in a liquid droplet state or solid particle state; an electric charge supplying unit that supplies electric charge to the target material; a charge amount measuring unit that measures an amount of the electric charge supplied to the target material by the electric charge supplying unit; a control unit that controls the electric charge supplying unit in a feedback manner based on a measurement result obtained by the charge amount measuring unit; and an accelerator that accelerates the target material supplied with the electric charge by the electric charge supplying unit.
Abstract:
An ion implantation is disclosed that includes an ionization chamber having a restricted outlet aperture and configured so that the gas or vapor in the ionization chamber is at a pressure substantially higher than the pressure within an extraction region into which the ions are to be extracted external to the ionization chamber. The vapor is ionized by direct electron impact ionization by an electron source that is in a region adjacent the outlet aperture of the ionization chamber to produce ions from the molecules of the gas or vapor to a density of at least 1010 cm−3 at the aperture while maintaining conditions that limit the transverse kinetic energy of the ions to less than about 0.7 eV. The beam is transported to a target surface and the ions of the transported ion beam are implanted into the target.
Abstract translation:公开了一种离子注入,其包括具有限制的出口孔的电离室,并且被构造成使得离子化室中的气体或蒸汽的压力显着高于离子被提取外部的提取区域内的压力 电离室。 蒸汽通过电子源直接电离而电离,该电子源位于邻近离子化室的出口孔的区域中,以产生从气体或蒸汽的分子到至少10×10 6的密度的离子, SUP> cm -3,同时保持将离子的横向动能限制在小于约0.7eV的条件。 将光束输送到目标表面,并将输送的离子束的离子注入靶中。