公开(公告)号：US20190186839A1

公开(公告)日：2019-06-20

申请号：US15842849

申请日：2017-12-14

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Han-Min Liu ,  Jian Zhang ,  Xiao-Xiang Zhou

IPC: F28D15/02

Abstract: A protection element for heat dissipation unit includes a main body and a protection element. The main body is divided into a working zone and a sealing zone. The sealing zone is located around an outer periphery of the working zone and is provided with a notch area, to which a fluid-adding and air-evacuating pipe is connected. The protection element is a ductile structure correspondingly arranged at the notch area to contact with the sealing zone of the main body and the pipe. With the arrangement of the protection element, the fluid-adding and air-evacuating pipe is protected against collision and impact and accordingly, the main body of the heat dissipation unit is protected against vacuum and working fluid leakage.

公开(公告)号：US20190162480A1

公开(公告)日：2019-05-30

申请号：US15826603

申请日：2017-11-29

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Ching-Hang Shen ,  Fu-Kuei Chang

IPC: F28D15/02 ,  F28D15/04 ,  F28F3/08

CPC classification number: F28D15/0283 ,  F28D15/0275 ,  F28D15/046 ,  F28F3/08 ,  F28F2245/02

Abstract: An airtight penetration structure for heat dissipation device includes a first plate member, a second plate member, and a plurality of hollow shaft members. The first and the second plate member are closed to each other to together define a closed chamber between them. The hollow shaft members are respectively provided at two free ends with a first and a second flange. The hollow shaft members are correspondingly extended through fastening holes provided on the first and the second plate member with the first and the second flanges attached to and flush with outer surfaces of the first and the second plate member to seal around the fastening holes, so that the closed chamber between the first and the second plate member is in an airtight state.

公开(公告)号：US10274999B2

公开(公告)日：2019-04-30

申请号：US14923447

申请日：2015-10-27

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Jian-Wu Yin ,  Rong-Xian Zhang

IPC: G06F1/20 ,  H01L23/34 ,  F04D13/06

Abstract: A water-cooling device includes a liquid reservoir main body having a heat exchange chamber, a pump having a stator and a rotor and a heat exchange component connected with the liquid reservoir main body. The heat exchange chamber is for a cooling liquid to pass through. The rotor is connected with an impeller and exposed to the cooling liquid in the heat exchange chamber. The stator is integrally embedded in the liquid reservoir main body by embedded injection molding. The stator is isolated from the heat exchange chamber. According to the design of the water-cooling device, the structural strength of the liquid reservoir main body is enhanced and a waterproof effect for the stator is achieved.

公开(公告)号：US10251306B2

公开(公告)日：2019-04-02

申请号：US15275490

申请日：2016-09-26

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Jung-Yi Chiu ,  Fu-Kuei Chang

IPC: F28F7/00 ,  H05K7/20 ,  F28F3/08 ,  F28F3/04 ,  F28F9/02

Abstract: A water cooling heat dissipation structure includes a first and a second plate, a water cooling heat dissipation body, which is composed of a plurality of stacked heat dissipation members. The first plate, the heat dissipation members, and the second plate are in sequence stacked up into one and another to integrally form the water cooling heat dissipation structure by heat treatment. The water cooling heat dissipation body has a top side attached to one side of the first plate and a bottom side thereof attached to the second plate, so as to secure two sides of a flow passage of the water cooling heat dissipation body. A first and a second connecting portion is respectively provided on two sides of the first plate or the water cooling heat dissipation body, and the first and the second connecting portion is communicable with the flow passage.

公开(公告)号：US10247488B2

公开(公告)日：2019-04-02

申请号：US14857779

申请日：2015-09-17

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC: F28D15/00 ,  F28F3/02 ,  F28D15/02 ,  H01L23/427 ,  H01L21/48

Abstract: A heat dissipation device includes a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate, so as to have reduced manufacturing costs and provide uniform temperature effect.

公开(公告)号：US20190078844A1

公开(公告)日：2019-03-14

申请号：US16190176

申请日：2018-11-14

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Chun-Ming Wu

IPC: F28D15/04 ,  F28D15/02

Abstract: A thin heat pipe structure includes a main body having a chamber. The chamber has a wick structure and a working fluid provided therein, and internally defines an evaporating section and at least one condensing section. The condensing section is extended towards at least one or two ends of the evaporating section. The wick structure is provided with at least one groove. The groove is extended through the wick structure along a thickness direction of the main body to connect to two opposite wall surfaces of the chamber, and also extended along a length direction of the main body to communicate with the condensing section and the evaporating section. With these arrangements, the thin heat pipe structure has an extremely small overall thickness and is flexible.

公开(公告)号：US20190041105A1

公开(公告)日：2019-02-07

申请号：US15669977

申请日：2017-08-07

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Jian-Wu Yin

IPC: F25B21/02

Abstract: A heat-exchange structure for water cooling device includes a main body and a first thermoelectric cooling chip. The main body internally defines at least one first space communicably connected to at least one first port and at least one second port; and the first space has a first open side and allows a cooling fluid to flow therethrough. The first thermoelectric cooling chip has a first cold side and a first hot side, and is connected to the main body with the first cold side facing toward and closing the first open side of the main body. The cooling fluid in the first space of the main body is directly cooled by the first thermoelectric cooling chip, so that the cooling fluid of the water cooling device can be cooled at a further upgraded cooling efficiency.

公开(公告)号：US10184477B2

公开(公告)日：2019-01-22

申请号：US15368702

申请日：2016-12-05

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Bor-Haw Chang ,  Yu-Tzu Chen ,  Chung-Shu Wang

IPC: F04D19/00 ,  F04D25/08 ,  F04D25/16 ,  F04D29/66

Abstract: A series fan inclination structure includes an inclined frame body assembly, a first rotor assembly and a second rotor assembly. The inclined frame body assembly has a receiving space. The receiving space includes a first space, a second space and a flow guide passage. A first base seat is obliquely disposed in the first space. A second base seat is obliquely disposed in the second space. The flow guide passage is formed between the first and second base seats in communication with the first and second spaces. The first and second rotor assemblies are correspondingly rotatably disposed on the first and second base seats. The series fan inclination structure is able to greatly reduce the vibration and lower the noise caused by the interaction of the dipole.

公开(公告)号：US20180376620A1

公开(公告)日：2018-12-27

申请号：US16058994

申请日：2018-08-08

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Hsiu-Wei Yang

IPC: H05K7/20 ,  F28F21/04 ,  F28F21/08

Abstract: A back cover unit applied to handheld electronic device with heat conduction and heat dissipation effect includes a ceramic back cover having an outer surface and an inner surface. The inner surface faces a receiving space of a handheld electronic device. A cooling chip is disposed on the inner surface in contact with at least one heat source in the receiving space. The outer surface of the ceramic back cover faces an external environment, whereby the heat generated by the heat source can be transferred through the cooling chip to the ceramic back cover to dissipate the heat.

公开(公告)号：US20180361460A1

公开(公告)日：2018-12-20

申请号：US15793003

申请日：2017-10-25

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Kuei-Feng CHIANG ,  Chih-Yeh LIN

IPC: B21D53/04 ,  B23K20/02 ,  F28F3/02 ,  F28F21/08

Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.