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公开(公告)号：US20180248457A1
公开(公告)日：2018-08-30
申请号：US15553026
申请日：2016-12-26
Applicant: GOERTEK.INC
Inventor： Dezhang SHI , Yueguang ZHU
Abstract: Disclosed is a linear vibration motor, comprising a housing, a vibration assembly and a stator assembly, wherein the vibration assembly includes a mass block, a permanent magnet and an elastic sheet and the stator assembly includes a coil and a damping element; the damping element includes a main body and an elastic arm extending upwards from the main body, and the main body is fixed on an end of the mass block in the length direction; and the elastic sheet has a middle arm and a first connection arm and a second connection arm respectively provided at two ends of the middle arm, the surface of the middle arm adjacent to the mass block is abutted against the elastic arm, the first connection arm is fixedly connected to the housing, and the second connection arm is fixedly connected to the mass block.
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公开(公告)号：US10063208B2
公开(公告)日：2018-08-28
申请号：US15551244
申请日：2015-11-16
Applicant: Goertek.Inc
CPC classification number: H03G11/04 , H04R3/00 , H04R3/08 , H04R9/041 , H04R9/06 , H04R29/001 , H04R29/003 , H04R2499/11
Abstract: The present invention discloses a speaker device and electronic equipment. The speaker device comprises a speaker body, an audio signal input terminal connected with the speaker body, and a DC voltage signal input terminal connected with the speaker body. The electronic equipment comprises the speaker device and a DC voltage signal output circuit. The present invention further discloses a method for reducing a low frequency distortion degree of the speaker of the electronic equipment, and the method is realized by additionally providing a DC voltage signal to the input end of the speaker. In the present invention, a distortion degree of the speaker device at a low-frequency working condition can be reduced, and inconsistency of low frequency distortion of the speaker device, caused by mass production, can be reduced.
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公开(公告)号：US10020420B2
公开(公告)日：2018-07-10
申请号：US15529602
申请日：2015-08-18
Applicant: Goertek.Inc
Inventor： Quanbo Zou , Zhe Wang
IPC: H01L33/00 , H01L25/075 , H01L33/62
CPC classification number: H01L33/0095 , H01L24/95 , H01L25/0753 , H01L33/0079 , H01L33/62 , H01L2224/95 , H01L2933/0066
Abstract: A repairing method, manufacturing method, device and electronic apparatus of micro-LED are disclosed. The method for repairing micro-LED defects comprises: obtaining a micro-LED defect pattern on a receiving substrate; forming micro-LEDs (703b) corresponding to the defect pattern on a laser-transparent repair carrier substrate (707); aligning the micro-LEDs (703b) on the repair carrier substrate (707) with defect positions on the receiving substrate, and bringing the micro-LEDs (703b) into contact with pads at the defect positions; and irradiating the repair carrier substrate with a laser from the repair carrier substrate side, to lift-off the micro-LEDs from the repair carrier substrate (707).
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公开(公告)号：US20180124506A1
公开(公告)日：2018-05-03
申请号：US15560877
申请日：2015-12-14
Applicant: Goertek.Inc
Inventor： Liguo SUN , Lianshan GE
CPC classification number: H04R1/2857 , H04M1/035 , H04R1/345
Abstract: The present invention discloses a sound wave filtering structure. The sound wave filtering structure comprises a cavity wall, a cavity cover and a slit. The cavity cover is mounted on the cavity wall. The cavity wall and the cavity cover are combined to form an inner cavity. The slit is formed on the cavity wall and/or the cavity cover. The cavity wall and the cavity cover seal the inner cavity. A space in the inner cavity is communicated with the outside only through the slit. On the other hand, the present invention further provides a side sound generating speaker module. The side sound generating speaker module at least comprises a side sound generating cavity and the above-described sound wave filtering structure. The side sound generating cavity is configured to guide sound waves to be transmitted from a side surface of a single speaker body. The sound wave filtering structure is arranged on the side sound generating cavity. The slit faces the interior of the side sound generating cavity. The sound wave filtering structure provided by the present invention can adjust and filter high-frequency sound waves. Especially, in the side sound generating speaker module, the sound wave filtering structure can significantly improve the sound quality of the high-frequency sound waves.
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公开(公告)号：US20180113041A1
公开(公告)日：2018-04-26
申请号：US15559331
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang ZHENG
CPC classification number: G01L9/12 , B81B7/02 , B81B2201/0264 , G01L9/0073 , G01L13/025
Abstract: The present invention discloses a differential capacitive MEMS pressure sensor and a manufacturing method thereof. The MEMS pressure sensor includes a sensitive structural layer, which includes a common sensitive part and a common supporting part located on the edge of the common sensitive part, a thickness of the common supporting part being larger than that of the common sensitive part; and the MEMS pressure sensor also includes an upper fixed electrode structural layer and a lower fixed electrode structural layer which are vertically symmetric relative to the sensitive structural layer and used for forming differential capacitors with the common sensitive part. According to the MEMS pressure sensor of the present invention, by the differential capacitor structures, inhibition of chips on common-mode signals is enhanced, and a signal to noise ratio of output signals is improved. Meanwhile, the thickness of the common supporting part of the present invention is larger than that of the common sensitive part, such that the peripheral common supporting part can shield strains caused by temperatures and stresses. Therefore, the strains transmitted to the common sensitive part because of temperature and stress changes are greatly reduced, and temperature stability and stress stability of the chips are improved.
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Patent Agency Ranking
66.发明申请公开(公告)号：US20180069149A1
公开(公告)日：2018-03-08
申请号：US15559801
申请日：2015-11-04
Applicant: Goertek.Inc
Inventor： Quanbo ZOU , Manen LU , Zhe WANG
IPC: H01L33/00 , H01L27/15 , H01L25/075 , H01L33/20 , H01L21/68 , H01L21/786
CPC classification number: H01L33/0095 , H01L21/68 , H01L21/786 , H01L25/0753 , H01L27/15 , H01L33/0079 , H01L33/20
Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronics apparatus of micro-LED. The method for transferring micro-LEDs comprises: forming a mask layer on the backside of a laser-transparent original substrate, wherein micro-LEDs are formed on the front-side of the original substrate; bringing the micro-LEDs on the original substrate in contact with preset pads on a receiving substrate; and irradiating the original substrate from the original substrate side with laser through the mask layer, to lift-off micro-LEDs from the original substrate.
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公开(公告)号：US20180048951A1
公开(公告)日：2018-02-15
申请号：US15554980
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang ZHENG
CPC classification number: H04R1/04 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003
Abstract: The present invention discloses a package structure of a MEMS microphone. The package structure comprises a closed inner cavity formed by a package shell in a surrounding manner, as well as a MEMS chip and an ASIC chip which are located in the closed inner cavity, wherein a sound hole allowing sound to flow into the closed inner cavity is formed in the package shell; the MEMS chip comprises a substrate as well as a vibrating diaphragm and a back plate which are provided on the substrate; the vibrating diaphragm divides the closed inner cavity into a front cavity and a back cavity; and a sound-absorbing structure is provided in the back cavity.
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公开(公告)号：US20180044174A1
公开(公告)日：2018-02-15
申请号：US15554652
申请日：2015-12-14
Applicant: Goertek.Inc
Inventor： Guoguang ZHENG
CPC classification number: B81B7/02 , B81B3/0021 , B81B7/0061 , B81B2201/0228 , B81B2201/0235 , B81B2201/0264 , B81B2203/04 , B81C1/00166 , B81C1/00269 , G01L9/12 , G01L19/04 , G01P15/125
Abstract: The present invention discloses a integrated structure of an MEMS pressure sensor and an MEMS inertia sensor, comprising: an insulating layer formed on a substrate, a first lower electrode and a second lower electrode both formed on the insulating layer, further comprising a first upper electrode forming an air pressure-sensitive capacitor together with the first lower electrode, and a second upper electrode forming a reference capacitor together with the second lower electrode; further comprising an inertia-sensitive structure supported above the substrate by a third support part, and a fixed electrode plate forming an inertia detecting capacitor of an inertia sensor together with the inertia-sensitive structure; and a cover body which packages the inertia detecting capacitor composed of the inertia-sensitive structure and the fixed electrode plate on the substrate. The integrated structure according to the present invention integrates the MEMS inertia sensor and the MEMS pressure sensor on the same substrate, which may effectively reduce the area of the chip, so as to reduce the cost of the chip. Single packaging may complete the packaging of the entire chip and reduce the cost of the chip packaging.
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公开(公告)号：US20180041842A1
公开(公告)日：2018-02-08
申请号：US15554942
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang ZHENG
CPC classification number: H04R19/04 , H04R3/005 , H04R7/04 , H04R7/16 , H04R19/005 , H04R31/003 , H04R2201/003 , H04R2410/01
Abstract: The present invention discloses a MEMS microphone element, comprising a base, the base being provided with a first opening and a second opening which run through from top to bottom; and a first capacitor and a second capacitor disposed on the base in parallel, the first capacitor being disposed on the first opening, and the second capacitor being disposed on the second opening, wherein the first capacitor comprises a first back pole plate located below, and a first vibrating diaphragm located above and opposite to the first back pole plate, the second capacitor comprises a second back pole plate located above, and a second vibrating diaphragm located on below and opposite to the second back pole plate; and the first capacitor and the second capacitor form a pair of differential capacitors together.
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公开(公告)号：US20170374468A1
公开(公告)日：2017-12-28
申请号：US15540202
申请日：2015-11-13
Applicant: Goertek.Inc
Inventor： Hairong Wang , Lianwen Shan , Xinfeng Yang
CPC classification number: H04R7/06 , B29C45/14 , B29C45/16 , B29L2031/38 , B32B15/088 , G10K13/00 , H04R7/10 , H04R7/125 , H04R7/16 , H04R9/06 , H04R2307/025 , H04R2307/204 , H04R2307/207
Abstract: Disclosed is a vibrating diaphragm assembly, which relates to the technical field of electroacoustic products. The vibrating diaphragm assembly comprises a vibrating diaphragm, wherein the vibrating diaphragm comprises a middle part and a folding ring part surrounding the periphery of the middle part; the vibrating diaphragm comprises a vibrating diaphragm substrate layer and a silica gel layer; the silica gel layer is at least partially combined with the vibrating diaphragm substrate layer; the vibrating diaphragm substrate layer is a high molecular material layer; the silica gel layer is combined on the surface of the folding ring part; and the silica gel layer and the high molecular material layer are formed through injection molding. The vibrating diaphragm assembly of the present invention can improve the compliance of a vibrating diaphragm by arranging a silica gel layer on the surface of a folding ring part and compounding the silica gel layer and a high molecular material layer, improve the chemical stability and the temperature adaptability thereof, optimize the acoustic performance, and improve the product qualification rate.
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