公开(公告)号：US11335623B2

公开(公告)日：2022-05-17

申请号：US16338697

申请日：2017-09-11

Applicant: SHOWA DENKO K.K.

Inventor： Shinobu Tamura ,  Takayuki Matsuzawa

IPC: B21D53/02 ,  H01L21/48 ,  H01L23/473 ,  H05K7/20 ,  H02M7/48 ,  B23P15/26 ,  F28D21/00

Abstract: [Purpose] To provide is a method capable of producing a heat-dissipating unit easily and at low cost.
[Solution] The method of producing a heat-dissipating unit 12 includes: inserting pins 17 punched out of a second plate member 22 for pins into a plurality of through-holes 16 formed in a first plate member 20 for a substrate. In the first plate member 20, a plurality of substrate forming portions 25 is provided side by side in the longitudinal direction of the first plate member 20. In the second plate member 22, a plurality of pin punch-out portions 26 is provided side by side in the longitudinal direction of the second plate member 22. The method includes: a step A of forming the through-holes 16 in the substrate forming portion 25 of the first plate member 20; a step B of subjecting the pin punch-out portion 26 of the second plate member 22 to a half-punch out process to form half-punched-out pin forming portions 27 protruding from one surface side of the second plate member 22; a step C of forming the pins 17 by punching out the pin forming portions 27 from the second plate member 22 and simultaneously inserting the pins 17 into the through-holes 16 in the first plate member 20; and a step D of forming a substrate by cutting the substrate forming portion 25 with the pins 17 inserted in the through-holes 16 from the first plate member 20.

公开(公告)号：US11332686B2

公开(公告)日：2022-05-17

申请号：US16470713

申请日：2017-11-24

Applicant: SHOWA DENKO K.K.

Inventor： Naoya Fukumoto ,  Yuta Yamaguchi ,  Naoko Ito ,  Katsumi Murofushi

IPC: C10M107/38 ,  C08G65/331 ,  G11B5/725 ,  C10N40/18

Abstract: A fluorine-containing ether compound represented by formula (1) shown below. R4—CH2—R3—CH2—R2—CH2—R1—CH2—R2—CH2—R3—CH2—R4  (1) (In formula (1), R1 and R3 represent different perfluoropolyether chains, R2 represents a linking group containing one or more polar groups, and R4 represents a terminal group containing two or more polar groups.)

公开(公告)号：US20220146564A1

公开(公告)日：2022-05-12

申请号：US17519679

申请日：2021-11-05

Applicant: SHOWA DENKO K.K.

Inventor： Koichi Murata ,  Isaho KAMATA ,  Hidekazu TSUCHIDA ,  Akira MIYASAKA

IPC: G01R31/26 ,  H01L21/66 ,  G01R1/067 ,  G01R31/265 ,  C23C16/32 ,  C23C16/52 ,  C30B25/16 ,  C30B29/36

Abstract: A semiconductor wafer evaluation apparatus brings a contact maker (mercury liquefied at room temperature), as a Schottky electrode, into contact with a semiconductor wafer, intermittently applies a voltage from a pulse power supply, and evaluates the state (kinds, density) of point defects by an evaluation means based on the status of the electrostatic capacity of the semiconductor wafer. In this manner, the state (kinds, density) of the point defects in the plane of a large-diameter semiconductor wafer is directly evaluated using a large table.

公开(公告)号：US20220119739A1

公开(公告)日：2022-04-21

申请号：US17420569

申请日：2019-10-31

Applicant: SHOWA DENKO K.K.

Inventor： Susumu NAKAZAKI ,  Kuniaki MIYAHARA ,  Tomoyuki FUKUYO

IPC: C11D7/50 ,  C11D11/00 ,  C11D7/32 ,  C11D7/34 ,  H01L21/02 ,  B08B3/08

Abstract: Provided is a decomposing/cleaning composition for an adhesive polymer having a high etching rate and suppressed infiltration into a contact interface between a substrate such as a device wafer and an adhesive layer such as a fixing tape. The decomposing/cleaning composition of one embodiment is a decomposing/cleaning composition for an adhesive polymer containing a quaternary alkylammonium fluoride or a quaternary alkylammonium fluoride hydrate and an aprotic solvent, wherein the aprotic solvent contains (A) an N-substituted amide compound having no active hydrogens on the nitrogen atoms and (B) at least one organic sulfur oxide selected from the group consisting of sulfoxide compounds and sulfone compounds.

公开(公告)号：US20220119585A1

公开(公告)日：2022-04-21

申请号：US17269147

申请日：2019-08-16

Applicant: SHOWA DENKO K.K.

Inventor： Norihito NISHIMURA ,  Katsutoshi OHNO

IPC: C08G18/81 ,  C08G18/28 ,  C08G18/80 ,  C08G18/48 ,  C08G18/10

Abstract: The composition comprises a compound (A) represented by general formula (1) and a compound (B) represented by general formula (2), and comprises 0.00002 to 2.0 parts by mass of the compound (B) with respect to 100 parts by mass of the compound (A), (R1—COO)n—R2—(NCO)m   (1) g(R1—COO)n—R2—NHC(═O)NH—R2—(OCO—R1)m   (2) wherein in general formulae (1) and (2), R1 is an ethylenically unsaturated group having 2 to 7 carbon atoms; R2 is a (m+n)-valent hydrocarbon group having 1 to 7 carbon atoms and optionally contain an ether group; R1 and R2 in the general formula (1) are the same as R1 and R2 in the general formula (2); and n and m each represent an integer of one or two.

公开(公告)号：US20220112373A1

公开(公告)日：2022-04-14

申请号：US17421903

申请日：2019-09-18

Applicant: SHOWA DENKO K.K.

Inventor： Chika MINEZAKI

IPC: C08L79/08

Abstract: Provided is a thermosetting resin composition which exhibits low water absorption and excellent reflow resistance properties without compromising heat resistance or moldability. This thermosetting resin composition contains a polyalkenylphenol compound (A), a polymaleimide compound (B), a liquid polybutadiene compound (C) and a radical initiator (D). The liquid polybutadiene compound (C) has structural units represented by formula (1)-1 and, optionally, structural units represented by formula (l)-2 and, optionally, structural units other than the structural units represented by formula (1)-1 and formula (1)-2. If the average number of structural units represented by formula (1)-1 per molecule is denoted by m, the average number of structural units represented by formula (1)-2 per molecule is denoted by n and the average number of structural units other than the structural units represented by formula (1)-1 and formula (1)-2 is denoted by w, the value of m/(m+n+w) is 0.15-1.

公开(公告)号：US11295775B2

公开(公告)日：2022-04-05

申请号：US16953894

申请日：2020-11-20

Applicant: SHOWA DENKO K.K.

Inventor： Kota Hasegawa ,  Katsuaki To

IPC: G11B5/667 ,  G11B5/65 ,  G11B5/66

Abstract: A magnetic recording medium includes a nonmagnetic substrate, a soft magnetic underlayer, an orientation control layer, a perpendicular magnetic layer, and a protection layer that are arranged in this order. The perpendicular magnetic layer includes a first magnetic layer and a second magnetic layer that are arranged in this order on the orientation control layer. The first magnetic layer has a granular structure including an oxide at grain boundary parts of magnetic grains, and the second magnetic layer is closest to the protection layer among layers within the perpendicular magnetic layer, and includes magnetic grains made of a CoCrPt alloy, and a nitride of carbon or a hydride of carbon.

公开(公告)号：US11279664B2

公开(公告)日：2022-03-22

申请号：US16082349

申请日：2017-01-30

Applicant: SHOWA DENKO K.K.

Inventor： Daisuke Yagyu ,  Yuta Yamaguchi ,  Naoya Fukumoto ,  Tsuyoshi Kato ,  Shoko Uetake ,  Hiroyuki Tomita ,  Ryuuta Miyasaka ,  Naoko Ito ,  Ichiro Ota ,  Katsumi Murofushi

IPC: C07C43/23 ,  C10M105/54 ,  G11B5/725 ,  C10M107/38 ,  C07C43/178 ,  C07D277/24 ,  C07D303/26 ,  C07D333/16 ,  C07D409/12 ,  G11B5/733 ,  C10N30/06 ,  C10N40/18 ,  C10N50/00

Abstract: The present invention relates to a fluorine-containing ether compound represented by Formula (1), R1—R2—CH2—R3—CH2—R4  (1). (In Formula (1), R1 is an end group including an organic group having at least one double bond or triple bond, R2 is a divalent linking group bonded to R1 by etheric oxygen, R3 is a perfluoropolyether chain, R4 is an end group having two or three polar groups with each polar group being bonded to different carbon atoms, and the carbon atoms, to which the polar groups are bonded, being bonded to each other via a linking group including carbon atoms to which the polar groups are not bonded.)

公开(公告)号：US20220064354A1

公开(公告)日：2022-03-03

申请号：US17421061

申请日：2019-11-26

Applicant: SHOWA DENKO K.K.

Inventor： Naoki SEKIOKA ,  Masanao KAMIJO ,  Noriko OGAWA

IPC: C08F279/02 ,  C08L11/02 ,  C08F2/26 ,  C08F2/30 ,  C09J151/04

Abstract: A method for producing a chloroprene graft copolymer latex includes a step of adding an ethylenic double bond-containing silane coupling agent (B) to a chloroprene polymer latex and graft copolymerizing the ethylenic double bond-containing silane coupling agent (B) to the chloroprene polymer (A) in the chloroprene polymer latex at 10° C. to 50° C. (inclusive). The amount of the ethylenic double bond-containing silane coupling agent (B) added is 0.4 parts by mass to 9.0 parts by mass (inclusive) per 100 parts by mass of the chloroprene polymer (A). The present invention also relates to an adhesive containing the chloroprene graft copolymer latex and to a method for using the adhesive. The present invention can provide a method for producing a chloroprene graft copolymer latex containing no organic solvent and having high adhesive strength to glass, an adhesive containing the same, and a method for using the adhesive.

公开(公告)号：US11261395B2

公开(公告)日：2022-03-01

申请号：US16972813

申请日：2019-06-10

Applicant: SHOWA DENKO K.K.

Inventor： Tsuyoshi Kato ,  Kentaro Watanabe ,  Yasuyuki Ueda

IPC: C10M103/02 ,  C10M105/72 ,  G11B5/725 ,  C07C57/50 ,  C07C65/30 ,  C07C225/06 ,  C07C305/22 ,  C07D487/22 ,  C10M105/60 ,  C10M105/70 ,  C10N20/00 ,  C10N40/18

Abstract: The invention provides a fullerene compound; a lubricant that is for a magnetic recording medium and that contains the fullerene compound; and a magnetic recording medium. The fullerene compound is an ionic liquid that is represented by general formula (1) and is formed from a Bronsted acid (Hn1X) and a Bronsted base ([R2R3)N—]m1—R1); wherein one of the Brønsted acid and the Broønsted base contains a group having a fullerene; and the other contains a perfluoroalkyl chain.