公开(公告)号：US20060050498A1

公开(公告)日：2006-03-09

申请号：US11157565

申请日：2005-06-21

Applicant: James Cady ,  Paul Goodwin

Inventor： James Cady ,  Paul Goodwin

IPC: H05K1/14

CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L23/5387 ,  H01L25/0652 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.

Abstract translation: 柔性电路用多个集成电路管芯填充在一侧或两侧。 在优选的模式中，柔性电路装有倒装芯片。 柔性电路的一侧具有在具有边缘连接器触点的优选模式中实现的连接设备。 柔性电路围绕基板设置以形成电路模块，该电路模块可以插入诸如通常在计算机板上找到的边缘连接器。

公开(公告)号：US20060050496A1

公开(公告)日：2006-03-09

申请号：US11005992

申请日：2004-12-07

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H05K1/14

CPC classification number: H01L25/0652 ,  G11C5/04 ,  G11C5/143 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flexible circuit is populated with integrated circuits. Integrated circuits populated on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. In a preferred embodiment, the overall module profile does not, consequently, include the thickness of the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flex circuit may be aligned using tooling holes in the flex circuit and substrate. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs.

公开(公告)号：US20060050488A1

公开(公告)日：2006-03-09

申请号：US11068688

申请日：2005-03-01

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H05K7/06

CPC classification number: G11C5/04 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs or include greater numbers of ICs.

公开(公告)号：US20050086015A1

公开(公告)日：2005-04-21

申请号：US10875189

申请日：2004-06-25

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: G01R23/165 ,  H04B1/00 ,  G01R13/00 ,  G06F19/00 ,  H04B15/00

CPC classification number: G01R23/165

Abstract: An apparatus for detecting spectral components in a predetermined frequency band within a signal includes first and second processing devices and first, second, and third connectors tuned to the frequency band. The first processing device includes first, second, and third elements. The second processing device includes fourth, fifth, and sixth elements. The first connector is coupled to the first and fourth elements, the second connector to the second and fifth elements, and the third connector to the third and sixth elements. An apparatus for analyzing spectral components in predetermined frequency bands within a signal includes an input for receiving the signal, a device for isolating a portion of the signal, and frequency detectors coupled in parallel to the device. Each frequency detector corresponds to a frequency band and generates an output signal component corresponding to a proportion of energy of the spectral components detected by the frequency detector.

Abstract translation: 用于检测信号内的预定频带中的频谱分量的装置包括调谐到频带的第一和第二处理装置和第一，第二和第三连接器。 第一处理装置包括第一，第二和第三元件。 第二处理装置包括第四，第五和第六元件。 第一连接器耦合到第一和第四元件，第二连接器连接到第二和第五元件，第三连接器耦合到第三和第六元件。 用于分析信号内的预定频带中的频谱分量的装置包括用于接收信号的输入端，用于隔离信号的一部分的装置以及与装置并联耦合的频率检测器。 每个频率检测器对应于频带，并且产生对应于由频率检测器检测的频谱分量的能量比例的输出信号分量。

公开(公告)号：US4595168A

公开(公告)日：1986-06-17

申请号：US583165

申请日：1984-02-24

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: E04G13/02 ,  B28B7/34 ,  B28B7/36

CPC classification number: E04G13/021 ,  Y10S249/02

Abstract: The present invention relates to a disposable concrete forming apparatus. The apparatus includes an elongate, tubular and rigid form having at least one inner wall surface defining an enclosure in which concrete can be poured and allowed to harden. The apparatus further includes a flexible liner of predetermined thickness which lines the inner surface to preclude formation of form lines on the hardened concrete that correspond to markings on the inner wall surface of the rigid form. The flexible liner has at least one outside wall surface for each inner wall surface and is movable between a compressed position permitting insertion of the liner into the enclosure and a normal expanded position with the outside wall surface pressing against the inner wall surface of the rigid form. As a result, no gap is present between the inner wall surface and the outer wall surface.

Abstract translation: 本发明涉及一次性混凝土成型装置。 该装置包括细长的管状和刚性形式，其具有限定外壳的至少一个内壁表面，混合物可以在其中倾倒并允许其硬化。 该装置还包括具有预定厚度的柔性衬里，其沿着内表面排除在硬化混凝土上形成对应于刚性形式的内壁表面上的标记的成形线。 柔性衬里具有用于每个内壁表面的至少一个外壁表面，并且可在允许衬套插入外壳的压缩位置和正常扩展位置之间移动，其中外壁表面压靠刚性形式的内壁表面 。 结果，在内壁表面和外壁表面之间不存在间隙。

公开(公告)号：US07760513B2

公开(公告)日：2010-07-20

申请号：US11397597

申请日：2006-04-03

Applicant: Julian Partridge ,  David Roper ,  Paul Goodwin

Inventor： Julian Partridge ,  David Roper ,  Paul Goodwin

IPC: H05K1/11

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. The populated flexible circuitry is disposed proximal to a rigid substrate to place the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The rigid substrate exhibits adhesion features that allow more advantageous use of thermoplastic adhesives with concomitant rework advantages and while providing flexibility in meeting dimensional specifications such as those promulgated by JEDEC, for example.

Abstract translation: 灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。 填充的柔性电路设置在刚性衬底附近，以将集成电路放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或两层集成电路。 刚性基材表现出粘合特征，其允许更有利地使用具有伴随返工优点的热塑性粘合剂，并且同时提供满足例如由JEDEC公布的尺寸规格的柔性。

公开(公告)号：US20090309214A1

公开(公告)日：2009-12-17

申请号：US12546350

申请日：2009-08-24

Applicant: Leland Szewerenko ,  Julian Partridge ,  Wayne Lieberman ,  Paul Goodwin

Inventor： Leland Szewerenko ,  Julian Partridge ,  Wayne Lieberman ,  Paul Goodwin

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/20

CPC classification number: H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat spreaders employed by circuit modules constructed according to traditional or new technologies.

Abstract translation: 在电路模块上提供湍流诱发器。 在基板或散热器表面上方，可将湍流发生器添加到现有模块中，或者集成到基于传统或新技术构建的电路模块所采用的基板或散热器中。

公开(公告)号：US20090052124A1

公开(公告)日：2009-02-26

申请号：US12263060

申请日：2008-10-31

Applicant: James Douglas Wehrly, JR. ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

Inventor： James Douglas Wehrly, JR. ,  James Wilder ,  Mark Wolfe ,  Paul Goodwin

IPC: H05K7/20

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

Abstract translation: 灵活的电路采用集成电路（IC），并且触点沿柔性电路分布，以提供与应用环境的连接。 柔性电路围绕刚性衬底设置，将IC放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。 衬底优选地由导热材料设计，并且一个或多个热扩散器与至少一些IC热接触。 可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。 在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

公开(公告)号：US07480152B2

公开(公告)日：2009-01-20

申请号：US11005992

申请日：2004-12-07

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H05K1/11

CPC classification number: H01L25/0652 ,  G11C5/04 ,  G11C5/143 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flexible circuit is populated with integrated circuits. Integrated circuits populated on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. In a preferred embodiment, the overall module profile does not, consequently, include the thickness of the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flex circuit may be aligned using tooling holes in the flex circuit and substrate. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs.

Abstract translation: 灵活的电路装有集成电路。 填充在最靠近基板的柔性电路一侧的集成电路在至少部分地设置在优选实施例中是基板中的窗口，凹穴或切割区域。 在优选实施例中，整个模块轮廓不因此包括衬底的厚度。 其他实施例可以仅填充柔性电路的一侧，或者可以仅移除足够的衬底材料以减少但不消除整个衬底对整体轮廓的贡献。 柔性电路可以使用柔性电路和基板中的加工孔对准。 柔性电路可以表现出一个或两个或更多个导电层，并且可以具有分层结构的变化或具有分裂层。 其他实施例可能错开或抵消IC。

公开(公告)号：US07468893B2

公开(公告)日：2008-12-23

申请号：US11058979

申请日：2005-02-16

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H05K7/00

CPC classification number: G11C5/04 ,  H01L2224/16225 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572

Abstract: Modules with larger areas for device mounting but minimized profiles are provided. In preferred embodiments, modules that employ one or more flex circuits have sculpted supportive substrates to selectively accommodate larger or taller profile devices. In several preferred embodiments, higher profile circuits such as AMBs, for example, are disposed in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. In other preferred embodiments, both the substrate and the flexible circuitry have openings into which a device of greater profile such as, for example, an AMB or a logic device with or without a resident heat sink are provided with a volume to occupy without adding the full profile of the taller device to the profile of the module itself.

Abstract translation: 提供了更大面积的模块，用于器件安装，但最小化配置文件。 在优选实施例中，使用一个或多个柔性电路的模块具有雕刻的支撑衬底，以选择性地容纳更大或更高的轮廓设备。 在几个优选实施例中，例如，诸如AMB的更高轮廓的电路被布置在基板中的窗口，凹部或切口区域中。 在其它优选实施例中，衬底和柔性电路都具有开口，其中具有更大轮廓的装置（例如AMB或具有或不具有驻留散热器的逻辑装置）具有容积而不加入 更高的设备的完整配置文件到模块本身的配置文件。