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公开(公告)号：US09567494B2
公开(公告)日：2017-02-14
申请号：US14099370
申请日：2013-12-06
Applicant: DEXERIALS CORPORATION
Inventor： Noboru Araki
IPC: C09J7/00 , C09J4/00 , C08K3/00 , C08K5/00 , C08F220/06 , C08F222/10 , C08F220/18
CPC classification number: C09J7/00 , C08F220/06 , C08F220/18 , C08F222/1006 , C08F2220/1833 , C08K3/013 , C08K5/0025 , C08K2201/003 , C09J4/00 , C09J7/10 , C09J2201/134 , C09J2201/622 , C09J2433/00 , Y10T428/24372 , C08F2220/1858 , C08F2222/102
Abstract: Disclosed is a double-sided adhesive tape that has a difference in adhesion between the front and rear sides thereof and can be produced to have a reduced thickness by a simple method. The double-sided adhesive tape is a sheet-shaped cured product of an adhesive composition containing a resin composition and an inorganic filler. The resin composition contains (A) an acrylate-based monomer, (B) a monomer copolymerizable with (A), (C) a photopolymerization initiator, and (D) a photo-crosslinking agent. The inorganic filler has an average particle diameter of 30 μm or less and is localized on one side of the tape. The surface roughness (center line average roughness Ra) of the tape surface on the side on which the inorganic filler is localized is 0.01 to 0.50 μm.
Abstract translation: 公开了一种双面胶带，其在其前侧和后侧之间的粘合力差异，并且可以通过简单的方法制造成具有减小的厚度。 双面胶带是包含树脂组合物和无机填料的粘合剂组合物的片状固化产物。 树脂组合物含有（A）丙烯酸酯类单体，（B）可与（A）共聚的单体，（C）光聚合引发剂，（D）光交联剂。 无机填料的平均粒径为30μm以下，位于带的一侧。 无机填料一侧的带表面的表面粗糙度（中心线平均粗糙度Ra）为0.01〜0.50μm。
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公开(公告)号：US20160334549A1
公开(公告)日：2016-11-17
申请号：US15130808
申请日：2016-04-15
CPC classification number: G02B1/16 , C09J7/243 , C09J7/29 , C09J2201/134 , C09J2201/602 , C09J2203/318 , C09J2400/243 , C09J2400/263 , C09J2400/283 , C09J2423/046 , C09J2427/006 , C09J2433/00 , C09J2467/006 , G02B5/3025 , G02B5/3033
Abstract: The present disclosure provides an antistatic film and a polarizer attachment device. The antistatic film includes a static electricity elimination layer configured to eliminate static charges and an adhesive layer arranged at one surface of the static electricity elimination layer. According to the present disclosure, it is able to directly attach the antistatic film onto a bearing platform of the polarizer attachment device.
Abstract translation: 本公开提供了一种抗静电膜和偏振器附着装置。 所述抗静电膜包括构造成消除静电荷的静电消除层和布置在所述静电消除层的一个表面处的粘合剂层。 根据本公开，能够将抗静电膜直接附着在偏光板安装装置的轴承平台上。
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公开(公告)号：US20160229965A1
公开(公告)日：2016-08-11
申请号：US14872249
申请日：2015-10-01
Applicant: Zephyros, Inc.
Inventor： Craig Chmielewski , Brandon Madaus , Dawn Dombrowski
CPC classification number: C08J5/18 , C08G2650/56 , C08J2363/00 , C08J2409/02 , C08J2433/10 , C08J2463/00 , C08L71/00 , C09D171/00 , C09J7/10 , C09J7/25 , C09J2201/134 , C09J2201/36 , C09J2201/606 , C09J2201/61 , C09J2413/00 , C09J2413/006 , C09J2463/00 , C09J2463/006 , C09J2479/02 , C09J2479/026 , C08L9/02 , C08L63/00
Abstract: A handling film to be applied to an adhesive, wherein the handling film comprises a polyhydroxyamino ether thermoplastic, a monofunctional epoxy, and a carboxylated nitrile butadiene elastomer.
Abstract translation: 一种应用于粘合剂的处理膜，其中处理膜包括多羟基氨基醚热塑性塑料，单官能环氧树脂和羧化腈丁二烯弹性体。
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64.发明申请OPTICAL FILM WITH PRESSURE SENSITIVE ADHESIVE ON BOTH SIDES AND METHOD FOR PRODUCING IMAGE DISPLAY DEVICE USING THEREOF, AND METHOD FOR SUPPRESSING CURL OF OPTICAL FILM WITH PRESSURE SENSITIVE ADHESIVE ON BOTH SIDES 有权具有双面压敏粘合剂的光学膜和使用其制造图像显示装置的方法，以及用于抑制双面压敏粘合剂在光学膜上弯曲的方法公开(公告)号：US20160109631A1
公开(公告)日：2016-04-21
申请号：US14876946
申请日：2015-10-07
Applicant: NITTO DENKO CORPORATION
Inventor： Masaki MIZUTANI , Shou TAKARADA , Atsushi YASUI
CPC classification number: G02B5/3033 , C09J7/38 , C09J7/405 , C09J2201/134 , C09J2201/622 , C09J2203/318 , C09J2467/006
Abstract: The optical film with a pressure sensitive adhesive on both sides includes a first pressure sensitive adhesive layer having a thickness of 3 μm to 30 μm on first main surface of an optical film, and a second pressure sensitive adhesive layer having a thickness of 50 μm or more on second main surface of the optical film. A first protective sheet and a second protective sheet are releasably attached on the first pressure sensitive adhesive layer and the second pressure sensitive adhesive layer, respectively. The residual stress of the second pressure sensitive adhesive layer S2 (N/cm2), the thickness of the first protective sheet Y (μm); and the thickness of the second protective sheet Z (μm) satisfy the following relationship: 20≦Y≦80; 45≦Z; and Y+0.17 Z+10.6 S2≧63.
Abstract translation: 具有两面的压敏粘合剂的光学膜包括在光学膜的第一主表面上具有3μm至30μm的厚度的第一压敏粘合剂层和厚度为50μm的第二压敏粘合剂层或 更多在光学膜的第二主表面上。 第一保护片和第二保护片分别可剥离地附接在第一压敏粘合剂层和第二压敏粘合剂层上。 第二压敏粘合剂层S2的残余应力（N / cm 2），第一保护片Y的厚度（μm）; 并且第二保护片Z（μm）的厚度满足以下关系：20＆nlE; Y＆nlE; 80; 45＆nlE; Z; Y + 0.17Z +10.6S2≥63。
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65.发明授权Circuit connecting material and semiconductor device manufacturing method using same 有权电路连接材料和使用其的半导体器件制造方法公开(公告)号：US09202755B2
公开(公告)日：2015-12-01
申请号：US14387783
申请日：2013-03-06
Applicant: DEXERIALS CORPORATION
Inventor： Hironobu Moriyama
IPC: H01L21/00 , H01L21/78 , H01L23/00 , H01L21/683 , H01L25/065 , H01L25/00 , C09J7/00 , H01L21/56
CPC classification number: H01L21/78 , C09J7/00 , C09J7/10 , C09J2201/134 , C09J2201/36 , C09J2203/326 , H01L21/563 , H01L21/6836 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/91 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/11002 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16057 , H01L2224/16145 , H01L2224/16225 , H01L2224/27002 , H01L2224/27436 , H01L2224/29005 , H01L2224/29082 , H01L2224/2929 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81204 , H01L2224/81805 , H01L2224/81815 , H01L2224/81855 , H01L2224/83191 , H01L2224/83203 , H01L2224/83204 , H01L2224/83862 , H01L2224/9211 , H01L2224/94 , H01L2225/06513 , H01L2924/01322 , H01L2924/14 , Y10T403/479 , H01L2924/00 , H01L2224/11 , H01L2224/27 , H01L2924/01082 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2924/01051 , H01L2924/0665 , H01L2924/207 , H01L2224/81 , H01L2224/83 , H01L2924/05442 , H01L2924/05341 , H01L2924/0532
Abstract: Provided are a circuit connecting material able to provide good bonding with an opposing electrode, and a semiconductor device manufacturing method using the same. The present invention uses a circuit connecting material, in which a first adhesive layer to be adhered to the semiconductor chip side, and a second adhesive layer having a lowest melting viscosity attainment temperature higher than that of the first adhesive layer are laminated. When the semiconductor chip on which the circuit connecting material is stuck is mounted on a circuit board, a thickness of the first adhesive layer is within a range satisfying formula (1), thereby providing good bonding with the opposing electrode.
Abstract translation: 提供能够提供与相对电极的良好结合的电路连接材料，以及使用该电路连接材料的半导体器件制造方法。 本发明使用其中粘附到半导体芯片侧的第一粘合剂层和具有比第一粘合剂层更高的最低熔融粘度达到温度的第二粘合剂层的电路连接材料。 当电路连接材料被卡住的半导体芯片安装在电路板上时，第一粘合层的厚度在满足公式（1）的范围内，从而与相对电极提供良好的结合。
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Patent Agency Ranking
66.发明申请公开(公告)号：US20150225625A1
公开(公告)日：2015-08-13
申请号：US14428222
申请日：2013-10-01
Applicant: MITSUBISHI PLASTICS, INC.
Inventor： Kahoru Niimi , Makoto Inenaga , Takahisa Uchida , Ryota Yamamoto
CPC classification number: C09J133/08 , B32B37/1284 , B32B37/18 , B32B38/0008 , B32B38/10 , B32B2037/1246 , B32B2037/1253 , B32B2307/42 , B32B2307/726 , B32B2457/20 , B32B2457/208 , C09J4/00 , C09J4/06 , C09J5/00 , C09J5/06 , C09J7/10 , C09J2201/134 , C09J2201/622 , C09J2203/318 , C09J2205/302 , C09J2433/00 , G02F1/13338 , G02F2001/133331 , G02F2202/28 , Y10T428/31935 , C08F2220/1825 , C08F218/08
Abstract: Provided is a novel double-sided pressure-sensitive adhesive sheet that can achieve both the repeelability and the reliability in the pressure sensitive adhesive surface such as the occurrence of foaming. Proposed is a repeelable double-sided pressure-sensitive adhesive sheet comprising a pressure sensitive adhesive layer containing a (meth)acrylate ester copolymer as a base polymer, in which the (meth)acrylate ester copolymer has a content of a carboxyl group-containing monomer as a copolymerization component of 2% by mass or less and the pressure sensitive adhesive layer is curable by heat or ultraviolet light and satisfies the following physical properties (1) and (2): (1) a 180° peel force is 5.0 N/cm or more when one surface of the double-sided pressure-sensitive adhesive sheet is superimposed on soda lime glass, a roller of 1 kg is reciprocated one time to crimp the two, the crimped resultant is allowed to stand for 24 hours in an environment of a temperature of 23° C. and a relative humidity of 40% RH, and then the double-sided pressure-sensitive adhesive sheet is peeled off from the soda lime glass at a temperature of 23° C. and a peel rate of 60 mm/min; and (2) a 180° peel force is 4.0 N/cm or less when one surface of the double-sided pressure-sensitive adhesive sheet is superimposed on soda lime glass, a roller of 1 kg is reciprocated one time to crimp the two, the crimped resultant is allowed to stand for 24 hours in an environment of a temperature of 23° C. and a relative humidity of 40% RH and allowed to absorb moisture by storing for 15 hours in a humidified environment of a temperature of 60° C. and 90% RH, and then the double-sided pressure-sensitive adhesive sheet is peeled off from the soda lime glass at a temperature of 23° C. and a peel rate of 60 mm/min immediately after absorbing moisture.
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公开(公告)号：US20150166841A1
公开(公告)日：2015-06-18
申请号：US14413295
申请日：2013-07-09
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Saori Ueda , Toshihiro Suwa , Shunsuke Suzuki , Jun Fujita
CPC classification number: C09J7/00 , B32B7/12 , B32B27/36 , B32B37/1284 , B32B38/0008 , B32B2037/1246 , B32B2250/02 , B32B2255/10 , B32B2255/26 , B32B2307/412 , B32B2310/0831 , B32B2457/20 , C08J5/128 , C08J2367/00 , C08J2433/04 , C08K5/3492 , C09J4/00 , C09J5/06 , C09J7/10 , C09J11/06 , C09J133/066 , C09J2201/134 , C09J2201/606 , C09J2205/31 , C09J2433/00 , C09J2467/006 , Y10T428/31797
Abstract: A transparent pressure sensitive adhesive sheet with a front surface and a back surface, fabricated by changing the intensity of the ultraviolet light irradiation between the front surface and the back surface. The transparent pressure sensitive adhesive sheet is obtained by ultraviolet light irradiation of an ultraviolet light hardening pressure sensitive adhesive sheet that contains a (meth)acrylic copolymer, a cleavage type photoinitiator, and an ultraviolet light absorber. The amount of ultraviolet light irradiation varies between the first surface and the second surface and the adhesive force varies between the first surface and the second surface.
Abstract translation: 通过改变前表面和后表面之间的紫外线照射的强度制造的具有前表面和后表面的透明压敏粘合片。 通过紫外光照射含有（甲基）丙烯酸共聚物，裂解型光引发剂和紫外线吸收剂的紫外线硬化压敏粘合片来获得透明压敏粘合片。 紫外线照射量在第一表面和第二表面之间变化，并且粘合力在第一表面和第二表面之间变化。
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68.发明申请DOUBLE-SIDED ADHESIVE TAPE HAVING A FIRST OUTER IMPACT-ADHESIVE SIDE AND A SECOND OUTER SIDE THAT CAN BE HEAT ACTIVATED 有权具有第一外部冲击粘合侧面和可以被激活的第二外侧的双面粘合带公开(公告)号：US20150159053A1
公开(公告)日：2015-06-11
申请号：US14403634
申请日：2013-05-15
Applicant: TESA SE
Inventor： Uwe Schümann , Kirstin Weiland , Hermann Neuhaus-Steinmetz , Dennis Perlbach , Arne Koops , Thomas Schubert , Olga Kirpicenok , Sarah Reich
CPC classification number: C09J7/10 , B32B37/182 , B32B38/0008 , C08G18/12 , C08G18/3206 , C08G18/4812 , C08G18/4825 , C08G18/4829 , C08G18/6674 , C08G18/755 , C08G2170/20 , C08L23/02 , C08L23/14 , C08L2205/02 , C09J5/02 , C09J7/00 , C09J7/35 , C09J7/38 , C09J7/385 , C09J123/02 , C09J123/14 , C09J133/08 , C09J175/04 , C09J175/08 , C09J177/00 , C09J2201/134 , C09J2201/36 , C09J2201/40 , C09J2201/606 , C09J2201/61 , C09J2423/00 , C09J2423/10 , C09J2433/00 , C09J2467/005 , C09J2475/00 , C09J2477/00 , Y10T428/249983 , Y10T428/2826 , C08G18/758
Abstract: The invention relates to a double-sided adhesive tape having a first outer impact-adhesive side and a second outer side that can be heat activated, comprising an at least two-layer product structure comprising the layers A and B. Layer A is an impact-adhesive layer chemically cross-linked by means of thermal initiation or an impact-adhesive carrier layer chemically cross-linked by means of thermal initiation. Layer B is a layer on the basis of a thermoplastic plastic. Layer A and layer B are in direct contact with each other, and the surface of layer B that is in direct contact with layer A has been corona- or plasma-pretreated. The double-sided adhesive tape is characterized in that the corona or plasma pretreatment is performed in an atmosphere comprising nitrogen, carbon dioxide, or a noble gas or a mixture of at least two of said gases.
Abstract translation: 本发明涉及一种具有第一外部冲击粘合剂侧和可以热活化的第二外侧的双面胶带，其包括包含层A和B的至少两层产品结构。层A是冲击 通过热引发化学交联的粘合层或通过热引发化学交联的冲击粘合剂载体层。 层B是基于热塑性塑料的层。 层A和层B彼此直接接触，并且与层A直接接触的层B的表面已进行电晕或等离子体预处理。 双面胶带的特征在于，电晕或等离子体预处理在包括氮气，二氧化碳或惰性气体或至少两种所述气体的混合物的气氛中进行。
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69.发明申请公开(公告)号：US20150140738A1
公开(公告)日：2015-05-21
申请号：US14387783
申请日：2013-03-06
Applicant: DEXERIALS CORPORATION
Inventor： Hironobu Moriyama
CPC classification number: H01L21/78 , C09J7/00 , C09J7/10 , C09J2201/134 , C09J2201/36 , C09J2203/326 , H01L21/563 , H01L21/6836 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/91 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/11002 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16057 , H01L2224/16145 , H01L2224/16225 , H01L2224/27002 , H01L2224/27436 , H01L2224/29005 , H01L2224/29082 , H01L2224/2929 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81204 , H01L2224/81805 , H01L2224/81815 , H01L2224/81855 , H01L2224/83191 , H01L2224/83203 , H01L2224/83204 , H01L2224/83862 , H01L2224/9211 , H01L2224/94 , H01L2225/06513 , H01L2924/01322 , H01L2924/14 , Y10T403/479 , H01L2924/00 , H01L2224/11 , H01L2224/27 , H01L2924/01082 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2924/01051 , H01L2924/0665 , H01L2924/207 , H01L2224/81 , H01L2224/83 , H01L2924/05442 , H01L2924/05341 , H01L2924/0532
Abstract: Provided are a circuit connecting material able to provide good bonding with an opposing electrode, and a semiconductor device manufacturing method using the same. The present invention uses a circuit connecting material, in which a first adhesive layer to be adhered to the semiconductor chip side, and a second adhesive layer having a lowest melting viscosity attainment temperature higher than that of the first adhesive layer are laminated. When the semiconductor chip on which the circuit connecting material is stuck is mounted on a circuit board, a thickness of the first adhesive layer is within a range satisfying formula (1), thereby providing good bonding with the opposing electrode.
Abstract translation: 提供能够提供与相对电极的良好结合的电路连接材料，以及使用该电路连接材料的半导体器件制造方法。 本发明使用其中粘附到半导体芯片侧的第一粘合剂层和具有比第一粘合剂层更高的最低熔融粘度达到温度的第二粘合剂层的电路连接材料。 当电路连接材料被卡住的半导体芯片安装在电路板上时，第一粘合层的厚度在满足公式（1）的范围内，从而与相对电极提供良好的结合。
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公开(公告)号：US20140370221A1
公开(公告)日：2014-12-18
申请号：US14302870
申请日：2014-06-12
Applicant: Nitto Denko Corporation , Nitto Denko America, Inc. , Nitto Denko Automotive New Jersey, Inc.
Inventor： Yu-chu Chen , Shigeki Muta
CPC classification number: C09J7/22 , C08K5/0066 , C09J7/21 , C09J7/26 , C09J7/30 , C09J7/38 , C09J11/02 , C09J2201/128 , C09J2201/134 , C09J2203/314 , C09J2205/102 , C09J2400/143 , C09J2400/243 , C09J2400/283 , C09J2421/00 , Y10T428/1405 , Y10T428/24942 , Y10T428/249983 , Y10T442/209
Abstract: A lightweight two-sided adhesive tape containing a porous substrate interposed between a first adhesive layer and a second adhesive layer capable of being removed from a surface without leaving significant amounts of adhesive residue on the surface. The first adhesive layer contains one or more adhesives, and one or more powders. The second adhesive layer contains one or more adhesives, and optionally, one or more powders.
Abstract translation: 一种轻质的双面胶带，其包含介于第一粘合剂层和能够从表面除去的第二粘合剂层之间的多孔基材，而不会在表面上留下大量的粘合剂残留物。 第一粘合剂层含有一种或多种粘合剂和一种或多种粉末。 第二粘合剂层含有一种或多种粘合剂，以及任选的一种或多种粉末。
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