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公开(公告)号:US11835391B2
公开(公告)日:2023-12-05
申请号:US17506378
申请日:2021-10-20
Applicant: TIMBRE TECHNOLOGIES, INC.
Inventor: Saeed Assadi , James Pogge
IPC: G01J5/20 , G01T1/24 , G01T3/08 , H01L31/112
CPC classification number: G01J5/20 , G01T1/242 , G01T3/08 , H01L31/1121 , G01J2005/202
Abstract: A radiation detection device includes a plurality of field effect transistors (FETs) arranged to form a resonant cavity. The cavity includes a first end and a second end. The plurality of FETs provide an electromagnetic field defining an standing wave oscillating at a resonant frequency defined by a characteristic of the cavity. A radiation input passing through the cavity induces a perturbation of the electromagnetic field.
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公开(公告)号:US20230384166A1
公开(公告)日:2023-11-30
申请号:US18201540
申请日:2023-05-24
Applicant: NEC Corporation
Inventor: Mayumi KOSAKA
CPC classification number: G01J5/22 , H10N15/15 , G01J2005/202
Abstract: One object of the present invention is to provide a bolometer having low resistance.
The present invention relates to a bolometer including two electrodes and a bolometer film lying between the two electrodes to connect the two electrodes, wherein the bolometer film includes semiconducting carbon nanotubes in a proportion of 90% by mass or more to the total amount of carbon nanotubes and includes p-type semiconducting carbon nanotubes, and one or both of the two electrodes include(s) a monometal or alloy having lower work function than the p-type semiconducting carbon nanotubes at least in a part of the electrode.-
公开(公告)号:US11824078B2
公开(公告)日:2023-11-21
申请号:US17341348
申请日:2021-06-07
Applicant: Teledyne FLIR, LLC
Inventor: Eric A. Kurth , Marin Sigurdson , Robert F. Cannata , James L. Dale , Christopher Chan
CPC classification number: H01L27/14669 , G01J5/023 , G01J5/024 , G01J5/20 , G01J5/24 , H01L27/14636 , H01L27/14649 , H01L27/14683 , H04N5/33 , H04N25/75 , G01J2005/0077 , G01J2005/202
Abstract: Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a substrate having contacts and a surface. The surface defines a plane. The infrared imaging device further includes a microbolometer array coupled to the substrate. Each microbolometer of the microbolometer array includes a second having a first dimension that extends in a first direction substantially parallel to the plane and a second dimension that extends in a second direction away from the plane. The first dimension is less than the second dimension. The segment includes a metal layer and a layer formed on a side of the metal layer.
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公开(公告)号:US20230304867A1
公开(公告)日:2023-09-28
申请号:US17659333
申请日:2022-04-15
Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
Inventor: Kuang-Hao CHIANG , Shang-Yu CHUANG
IPC: G01J5/20
CPC classification number: G01J5/20 , G01J2005/202
Abstract: An infrared sensor includes a substrate, an active pixel array, a reference pixel array, a light absorbing layer, a sidewall spacer, and a shading layer. The active pixel array is over the substrate. The reference pixel is over the substrate, adjacent to the active pixel array, and having a reference pixel. The reference pixel includes a platform, a resistor, and an infrared sensing material layer. The resistor is on the platform. The infrared sensing material layer is over the resistor. The light absorbing layer is over the reference pixel. The sidewall spacer is over the reference pixel and extends along a sidewall of the light absorbing layer. The shading layer is conformally formed over the light absorbing layer and the sidewall spacer.
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公开(公告)号:US11761820B2
公开(公告)日:2023-09-19
申请号:US17325827
申请日:2021-05-20
Applicant: LYNRED
Inventor: Nicolas Boudou , Alexia Gorecki
IPC: H04N5/33 , G01J5/02 , H01L27/146 , G01J5/0803 , G01J5/20 , G01J5/0808
CPC classification number: G01J5/0225 , G01J5/0803 , G01J5/0808 , G01J5/20 , H01L27/14621 , H01L27/14629 , H01L27/14649 , H04N5/33 , G01J2005/202 , G01J2005/204
Abstract: An image sensor includes on a support a plurality of first pixels and a plurality of second pixels intended to detect an infrared radiation emitted by an element of a scene. Each of the pixels includes a bolometric membrane suspended above a reflector covering the support, wherein the reflector of each of the first pixels is covered with a first dielectric layer, and the reflector of each of the second pixels is covered with a second dielectric layer differing from the first dielectric layer by its optical properties.
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公开(公告)号:US11676744B2
公开(公告)日:2023-06-13
申请号:US17669755
申请日:2022-02-11
Applicant: TDK CORPORATION
Inventor: Susumu Aoki , Shinji Hara , Naoki Ohta , Maiko Shirokawa
CPC classification number: H01C7/008 , G01J5/20 , H01C1/14 , G01J2005/0077 , G01J2005/202
Abstract: A thermistor element includes: a thermistor film; a pair of first electrodes in contact with one surface of the thermistor film; an insulation film opposite to a contact side of the pair of first electrodes, the contact side on which the pair of first electrodes is in contact with the thermistor film; and at least one opening portion located in a region which overlaps each of the first electrodes when viewed in a plan view and passing through the insulation film. Each first electrode has a first portion located where each of the first electrodes and the opening portion overlap when viewed in a plan view and a second portion outside of where each of the first electrodes and the opening portion overlap when viewed in a plan view and is over the first portion and second portion to be in contact with the one surface of the thermistor film.
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公开(公告)号:US11668607B2
公开(公告)日:2023-06-06
申请号:US17540004
申请日:2021-12-01
Applicant: TDK CORPORATION
Inventor: Maiko Shirokawa , Shinji Hara , Naoki Ohta , Susumu Aoki , Eiji Komura
IPC: G01J5/22 , G01J5/0831 , G01J5/20
CPC classification number: G01J5/22 , G01J5/0831 , G01J2005/202
Abstract: A thermistor element includes a thermistor film, a first electrode provided in contact with one surface of the thermistor film, and a pair of second electrodes provided in contact with the other surface of the thermistor film, wherein the thermistor film includes an oxide having a spinel crystal structure and having a [111] preferred orientation in a film thickness direction.
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68.
公开(公告)号:US20190154576A1
公开(公告)日:2019-05-23
申请号:US15571197
申请日:2016-05-03
Inventor: Kevin R. Maschhoff , Gerard M. Perron , John J. Polizotti
CPC classification number: G01N21/41 , G01J3/18 , G01J3/2823 , G01J5/007 , G01J5/0205 , G01J5/041 , G01J5/061 , G01J5/20 , G01J2005/202 , G01N21/3518 , G01N21/3554 , G01N2021/1793 , G01N2021/3531 , G01W1/04 , H01L31/107
Abstract: A mid-wave infrared system provides high spatial and temporal resolution measurements of atmospheric temperatures and moisture fields using a constellation of low earth orbit satellites. The disclosed system is smaller, lighter, less complex, and requires less energy than existing systems, due to implementation of an infrared avalanche photodiode array detector that provides enhanced sensitivity with reduced cooling requirements, and an Offner spectrometer having a novel a refractive element inserted near the grating that reduces the size and power requirements of the spectrometer. Embodiments of the disclosed method include deploying a constellation of devices for cooperative infrared sensing of atmospheric phenomena at similar rates, lower cost, and much higher resolution compared to geosynchronous approaches. Some embodiments further include combined analysis of measurements obtained by the disclosed devices with complementary measurements made by other low-earth and high-earth orbital and/or ground-based devices.
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公开(公告)号:US20180202865A1
公开(公告)日:2018-07-19
申请号:US15316182
申请日:2015-05-07
Applicant: TODOS TECHNOLOGIES LTD.
Inventor: YOAV SHOHAM
CPC classification number: G01J5/24 , G01J5/0806 , G01J5/20 , G01J2005/202
Abstract: A sensing device (20) includes a pair of infrared sensors comprising respective temperature-sensitive transistors (32, 34), which are configured to generate respective output signals in response to incident thermal radiation, and which are coupled together in a differential circuit topology so as to amplify a difference between the respective output signals.
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公开(公告)号:US09945727B2
公开(公告)日:2018-04-17
申请号:US15534110
申请日:2015-12-10
Applicant: Robert Bosch GmbH
Inventor: Ashwin K. Samarao , Gary O'Brien , Ando Feyh , Fabian Purkl , Gary Yama
CPC classification number: G01J5/20 , G01J5/024 , G01J5/0853 , G01J2005/202 , H01L27/14669 , H01L27/2472 , H01L31/02019 , H01L31/0224 , H01L31/11 , H01L45/1616
Abstract: A MEMS device includes a bolometer attached to a silicon wafer by a base portion of at least one anchor structure. The base portion comprises a layer stack having a metal-insulator-metal (MIM) configuration such that the base portion acts as a resistive switch such that, when the first DC voltage is applied to the patterned conductive layer, the base portion transitions from a high resistive state to a low resistive state, and, when the second DC voltage is applied to the patterned conductive layer, the base portion transitions from a high resistive state to a low resistive state.
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