公开(公告)号：US20070290175A1

公开(公告)日：2007-12-20

申请号：US11443262

申请日：2006-05-31

Applicant: Hyungrak Kim

Inventor： Hyungrak Kim

IPC: B32B15/02 ,  H01B1/12

CPC classification number: B22F1/0018 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/1241 ,  H05K2201/0218 ,  Y10S977/777 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: Metallic nanoparticles and processes for forming metallic nanoparticles. In one aspect, the invention is to a process for forming nanoparticles comprising the step of heating a solution comprising a first metal precursor and a nucleating agent (e.g., nucleate nanoparticles or a nucleate precursor) in the presence of a base under conditions effective to form the nanoparticles. The first metal precursor preferably comprises a cationic metal species having a low reduction potential. The invention is also to a nanoparticle or plurality of nanoparticles, each nanoparticle comprising a core having a largest dimension less than about 10 nm; and a metal layer substantially surrounding the core and having a largest dimension less than about 200 nm.

Abstract translation: 金属纳米粒子和形成金属纳米粒子的方法。 一方面，本发明涉及一种形成纳米颗粒的方法，其包括在有效形成的条件下，在碱的存在下加热包含第一金属前体和成核剂（例如，成核的纳米颗粒或成核前体）的溶液的步骤 纳米颗粒。 第一金属前体优选包含具有低还原电位的阳离子金属物质。 本发明还涉及纳米颗粒或多个纳米颗粒，每个纳米颗粒包含具有小于约10nm的最大尺寸的芯; 以及基本上围绕所述芯并具有小于约200nm的最大尺寸的金属层。

公开(公告)号：US20070245852A1

公开(公告)日：2007-10-25

申请号：US11812005

申请日：2007-06-14

Applicant: Hidekiyo Takaoka ,  Kosuke Nakano

Inventor： Hidekiyo Takaoka ,  Kosuke Nakano

IPC: C22C1/04

CPC classification number: B23K35/0244 ,  B23K35/025 ,  B23K35/226 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: In solder paste of the present invention, a first metal powder, a second metal powder, and a third metal powder are dispersed in a flux or a thermosetting resin. The first metal powder includes a first metal material such as Cu, Ag, Au, or Pd that serves as a base metal. A second metal material such as Sn or In that has a melting point lower than that of the first metal material is coated on the surface of the first metal material. The second metal powder is made of a metal material such as Sn or In that has a melting point lower than that of the first metal material. The third metal powder such as a Cu, Ag, Au or Pd powder has an average particle diameter smaller than that of the first metal material and can form compounds with the second metal material and the second metal powder. Accordingly, the likelihood of unreacted components remaining after a heat treatment can be suppressed, and even when a reflow treatment is repeated a plurality of times, a decrease in the bonding strength of solder bonding can be prevented.

Abstract translation: 在本发明的焊膏中，将第一金属粉末，第二金属粉末和第三金属粉末分散在助熔剂或热固性树脂中。 第一金属粉末包括用作贱金属的第一金属材料如Cu，Ag，Au或Pd。 具有比第一金属材料低的熔点的第二金属材料如Sn或In涂覆在第一金属材料的表面上。 第二金属粉末由熔点低于第一金属材料的Sn或In等金属材料制成。 第三金属粉末如Cu，Ag，Au或Pd粉末的平均粒径小于第一金属材料的平均粒径，并可与第二金属材料和第二金属粉末形成化合物。 因此，可以抑制在热处理后残留的未反应成分的可能性，并且即使重复多次回流处理，也可以防止焊接接合的接合强度的降低。

公开(公告)号：US20070216012A1

公开(公告)日：2007-09-20

申请号：US11735627

申请日：2007-04-16

Applicant: HIROSHI HOZOJI ,  Toshiaki Morita ,  Hiroshi Sasaki

Inventor： HIROSHI HOZOJI ,  Toshiaki Morita ,  Hiroshi Sasaki

IPC: H01L23/52 ,  H01L29/06

CPC classification number: H05K3/328 ,  H01L23/24 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L25/072 ,  H01L25/16 ,  H01L2223/6644 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/11332 ,  H01L2224/11505 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/27505 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/29344 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/351 ,  H05K1/183 ,  H05K3/102 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1131 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/2076 ,  H01L2224/83205 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an electrode formed on a substrate and an electrode formed on an electronic part to each other, the method comprises the step of bonding both the electrodes through a metal layer made up of aggregated particles of at least one kind of metal. Then, the metal particles have an average particle size of 1 to 50 nm. Preferably, the metal particles form a metal layer having a thickness of 5 to 100 μm.

Abstract translation: 电子部件安装方法，半导体模块和半导体器件，其可以减小安装面积和器件厚度。 在将形成在基板上的电极和形成在电子部件上的电极彼此接合的电子部件安装方法中，该方法包括通过由至少一种类型的聚集颗粒构成的金属层将两个电极接合的步骤 的金属。 然后，金属粒子的平均粒径为1〜50nm。 优选地，金属颗粒形成厚度为5至100μm的金属层。

公开(公告)号：US20070190349A1

公开(公告)日：2007-08-16

申请号：US10590861

申请日：2005-09-01

Applicant: Hiroya Ishida

Inventor： Hiroya Ishida

IPC: B05D7/00 ,  B22F1/02

CPC classification number: C23C18/1635 ,  C23C18/1651 ,  C23C18/1683 ,  C23C18/285 ,  C23C18/30 ,  C23C18/36 ,  H01R13/03 ,  H05K3/323 ,  H05K2201/0218 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: It is the object of the present invention to provide a conductive particle which has excellent adhesion between a base particle and a conductive layer, a conductive layer being resistant to breaking, impact resistance being improved, and an anisotropic conductive material using the conductive particle. The prevent invention is a conductive particle, which comprises a base particle and a conductive layer formed on a surface of said base particle, said conductive layer having a non-crystal nickel plating layer in contact with the surface of said base particle and a crystal nickel plating layer, and a proportion of a nickel crystal grain aggregate oriented in a nickel (111) plane derived from an integrated intensity ratio in X-ray diffraction measurement being 80% or more.

Abstract translation: 本发明的目的是提供一种导电颗粒，其具有优异的基础颗粒和导电层之间的粘附性，耐断裂性，耐冲击性得到改善的导电层以及使用该导电颗粒的各向异性导电材料。 防止发明是一种导电颗粒，其包括基体颗粒和形成在所述基础颗粒的表面上的导电层，所述导电层具有与所述基础颗粒的表面接触的非结晶镍镀层和结晶镍 并且在X射线衍射测定中，从镍（111）面取向的镍晶粒聚集体的积分强度比的比例为80％以上。

公开(公告)号：US20070145585A1

公开(公告)日：2007-06-28

申请号：US11500018

申请日：2006-08-07

Applicant: Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

Inventor： Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

IPC: H01L23/48

CPC classification number: H05K3/323 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29444 ,  H01L2224/2989 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K2201/0218 ,  H05K2201/0233 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle.Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.

Abstract translation: 本发明的实施方案包括导电颗粒，其包含在聚合物树脂颗粒的表面上形成的具有小于约1.5重量％的磷含量的导电镍/金（Ni / Au）复合金属层。 也包括其形成方法。 具有小于约1.5重量％的磷的Ni / Au复合金属层的导电颗粒可以具有相对高的导电性，同时提供Ni / Au金属层对聚合物树脂颗粒的相对良好的粘附。 本发明的其它实施方案提供了包含根据本发明实施方案的导电颗粒的各向异性粘合剂组合物。

公开(公告)号：US20070075299A1

公开(公告)日：2007-04-05

申请号：US11500307

申请日：2006-08-08

Applicant: Yasunori Ninomiya ,  Masashi Totokawa ,  Hirokazu Imai ,  Yukinori Migitaka

Inventor： Yasunori Ninomiya ,  Masashi Totokawa ,  Hirokazu Imai ,  Yukinori Migitaka

IPC: H01B1/12

CPC classification number: H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0272 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/29 ,  Y10T428/2933

Abstract: A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.

Abstract translation: 通过将多种导电填料混合到热固性树脂中形成导电粘合剂。 导电填料包括由铜基金属制成的芯材，由银制成的涂膜和多个由银制成的颗粒。 涂覆膜设置在芯材上以覆盖芯材，并且将颗粒设置在涂膜的表面上。 因此，防止芯材的表面露出。 导电粘合剂可以适合用于粘接两个部件。

公开(公告)号：US20060145352A1

公开(公告)日：2006-07-06

申请号：US11338529

申请日：2006-01-23

Applicant: Tasao Soga ,  Hanae Hata ,  Tetsuya Nakatsuka ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

Inventor： Tasao Soga ,  Hanae Hata ,  Tetsuya Nakatsuka ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: H01L23/48

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/262 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/045 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05669

Abstract: In an electronic device which realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a bonding portion between a semiconductor device and a substrate is formed of metal balls made of Cu, or the like, and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

Abstract translation: 在实现温度分级接合中的高温侧焊接的电子设备中，半导体器件与衬底之间的接合部分由Cu等金属球形成，并且由金属球和Sn形成的化合物 ，金属球通过化合物结合在一起。

公开(公告)号：US07025906B2

公开(公告)日：2006-04-11

申请号：US10087913

申请日：2002-03-05

Applicant: Kozo Shimizu ,  Yasuo Yamagishi

Inventor： Kozo Shimizu ,  Yasuo Yamagishi

IPC: H01B1/22

CPC classification number: H01B1/22 ,  H01B1/02 ,  H01C7/005 ,  H01C7/008 ,  H01C17/06526 ,  H01C17/06586 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K3/321 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2203/0425 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: A conductive composition layer, conductive particles as a raw material, a conductive composition therefor, a manufacturing method of the conductive composition layer, etc. are provided wherewith heat conductance can be accelerated between electronic devices or electronic devices can be electrically connected. The conductive composition layer is formed by subjecting to heat treatment at a temperature lower than 230° C. a conductive composition comprising conductive particles having a metal base material and a metal coating material thereon as well as a thermosetting resin having a curing temperature that is lower than 230° C. and/or a thermoplastic resin having a melting point that is lower than 230° C.

公开(公告)号：US06838022B2

公开(公告)日：2005-01-04

申请号：US10205251

申请日：2002-07-25

Applicant: S. Kumar Khanna

Inventor： S. Kumar Khanna

IPC: H01B1/22 ,  H01C17/065 ,  H01L21/60 ,  H05K3/32

CPC classification number: H01L24/29 ,  H01B1/22 ,  H01C17/06526 ,  H01C17/06586 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/10727 ,  H01L2924/00

Abstract: An anisotropic conductive compound includes an electrically conducting material suspended in a binder. The electrically conducting material includes nickel coated particles having a coating of silver or gold over the nickel coat and/or gold or silver coated nickel particles. In one embodiment, the binder is formed from the reaction product of a catalyst and a compound comprising an aromatic epoxy resin, a dimer fatty acid diglycidyl ester and oxirane. In another embodiment, the binder is formed from the reaction product of a novalac resin, a catalyst and either a heat polymerized aromatic epoxy resin or a phenoxy modified epoxy novalac resin.

Abstract translation: 各向异性导电化合物包括悬挂在粘合剂中的导电材料。 导电材料包括在镍涂层和/或金或银涂覆的镍颗粒上具有银或金的涂层的镍涂覆的颗粒。 在一个实施方案中，粘合剂由催化剂和包含芳族环氧树脂，二聚脂肪酸二缩水甘油酯和环氧乙烷的化合物的反应产物形成。 在另一个实施方案中，粘合剂由诺瓦克树脂，催化剂和热聚合的芳族环氧树脂或苯氧基改性的环氧树脂酚醛树脂的反应产物形成。

公开(公告)号：US20040016911A1

公开(公告)日：2004-01-29

申请号：US10205251

申请日：2002-07-25

Applicant: Shiva Consulting, Inc.

Inventor： S. Kumar Khanna

IPC: H01B001/00 ,  H01C001/00

CPC classification number: H01L24/29 ,  H01B1/22 ,  H01C17/06526 ,  H01C17/06586 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/10727 ,  H01L2924/00

Abstract: An anisotropic conductive compound includes an electrically conducting material suspended in a binder. The electrically conducting material includes nickel coated particles having a coating of silver or gold over the nickel coat and/or gold or silver coated nickel particles. In one embodiment, the binder is formed from the reaction product of a catalyst and a compound comprising an aromatic epoxy resin, a dimer fatty acid diglycidyl ester and oxirane. In another embodiment, the binder is formed from the reaction product of a novalac resin, a catalyst and either a heat polymerized aromatic epoxy resin or a phenoxy modified epoxy novalac resin.

Abstract translation: 各向异性导电化合物包括悬浮在粘合剂中的导电材料。 导电材料包括在镍涂层和/或金或银涂覆的镍颗粒上具有银或金的涂层的镍涂覆的颗粒。 在一个实施方案中，粘合剂由催化剂和包含芳族环氧树脂，二聚脂肪酸二缩水甘油酯和环氧乙烷的化合物的反应产物形成。 在另一个实施方案中，粘合剂由诺瓦克树脂，催化剂和热聚合的芳族环氧树脂或苯氧基改性的环氧树脂酚醛树脂的反应产物形成。