公开(公告)号：US06534124B2

公开(公告)日：2003-03-18

申请号：US10157883

申请日：2002-05-31

Applicant: Eiji Tamura ,  Wataru Kosaka ,  Toshimi Arashi

Inventor： Eiji Tamura ,  Wataru Kosaka ,  Toshimi Arashi

IPC: B05D312

CPC classification number: H05K3/381 ,  C23C18/1653 ,  C23C18/2013 ,  C23C18/285 ,  C23C18/30 ,  C23C18/34 ,  C23C18/40 ,  H05K1/0373 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/09118 ,  H05K2203/025

Abstract: A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.

公开(公告)号：US20020187267A1

公开(公告)日：2002-12-12

申请号：US10157883

申请日：2002-05-31

Applicant: IDEMITSU PETROCHEMICAL CO., LTD.

Inventor： Eiji Tamura ,  Wataru Kosaka ,  Toshimi Arashi

IPC: B05D003/12 ,  C08L067/00

CPC classification number: H05K3/381 ,  C23C18/1653 ,  C23C18/2013 ,  C23C18/285 ,  C23C18/30 ,  C23C18/34 ,  C23C18/40 ,  H05K1/0373 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/09118 ,  H05K2203/025

Abstract: A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.

Abstract translation: 一种无电镀模塑制品的制造方法，其包括将具有特定艾佐德冲击强度的热塑性树脂和洛氏硬度的无机填料制成的树脂组合物成型，然后使用空气吹扫处理模制品的表面 研磨剂具有尖锐的颗粒形状，然后进行催化剂涂覆，活化处理和化学镀。 可以对热塑性树脂组合物的成型体施加高粘合强度的无电镀，而不进行化学蚀刻处理。

公开(公告)号：US06419981B1

公开(公告)日：2002-07-16

申请号：US09620524

申请日：2000-07-20

Applicant: Bruce E. Novich ,  Kami Lammon-Hilinski ,  Walter J. Robertson ,  Xiang Wu ,  Vedagiri Velpari ,  Ernest L. Lawton ,  William B. Rice

Inventor： Bruce E. Novich ,  Kami Lammon-Hilinski ,  Walter J. Robertson ,  Xiang Wu ,  Vedagiri Velpari ,  Ernest L. Lawton ,  William B. Rice

IPC: B05D302

CPC classification number: B05D3/02 ,  C03C25/00 ,  C03C25/10 ,  C03C25/26 ,  C03C25/28 ,  C03C25/32 ,  C03C25/42 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: Methods for inhibiting abrasive wear of a fiber strand comprising at least one glass fiber by sliding contact with surface asperities of a solid object, comprising (a) applying a composition to at least a portion of a surface of at least one glass fiber of a glass fiber strand; (b) at least partially drying the composition to form a sized glass fiber strand having a residue of the composition upon at least a portion of the surface of the at least one class fiber; and (c) sliding at least a portion of the glass fiber strand to contact surface asperities of a solid object, the surface asperities having a hardness value which is greater than a hardness value of the at least one glass fiber, such that abrasive wear of the at least one glass fiber of the glass fiber strand by contact with the surface asperities of the solid object is inhibited by the inorganic solid lubricant particles.

Abstract translation: 通过与固体物体的表面粗糙度滑动接触来抑制包含至少一种玻璃纤维的纤维束的磨损磨损的方法，包括（a）将组合物施加到玻璃的至少一个玻璃纤维的至少一部分表面上 纤维束; （b）至少部分地干燥所述组合物以在所述至少一种类纤维的表面的至少一部分上形成具有所述组合物残基的尺寸的玻璃纤维线; 和（c）将所述玻璃纤维线的至少一部分滑动以接触固体物体的粗糙度，所述表面粗糙度的硬度值大于所述至少一种玻璃纤维的硬度值，使得所述玻璃纤维线的磨损 通过与固体物体的表面粗糙度接触的玻璃纤维线束的至少一个玻璃纤维被无机固体润滑剂颗粒抑制。

公开(公告)号：US06348737B1

公开(公告)日：2002-02-19

申请号：US09517847

申请日：2000-03-02

Applicant: Gerald G. Advocate, Jr. ,  Francis J. Downes, Jr. ,  Luis J. Matienzo ,  Ronald A. Kaschak ,  John S. Kresge ,  Daniel C. Van Hart

Inventor： Gerald G. Advocate, Jr. ,  Francis J. Downes, Jr. ,  Luis J. Matienzo ,  Ronald A. Kaschak ,  John S. Kresge ,  Daniel C. Van Hart

IPC: H01L2348

CPC classification number: H01L23/5226 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/06 ,  H05K3/383 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0248 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0353 ,  H01L2924/00

Abstract: An electronic structure including a metallic interlocking structure for bonding a conductive plated layer to metal surface, and a method of forming the electronic structure. The method provides a substrate having a metallic sheet within a dielectric layer. The metallic sheet includes a metal such as copper. An opening in the substrate, such as a blind via, is formed by laser drilling through the dielectric layer and partially through the metallic sheet. If the opening is a blind via, then the laser drilling is within an outer ring of the blind via cross section using a laser beam having a target diameter between about 20% and about 150% of a radius of the blind via cross section. A surface at the bottom of the opening, called a “blind surface,” includes a metallic protrusion formed by the laser drilling, such that the metallic protrusion is integral with a portion of the blind surface. The metallic protrusion includes the metal of the metallic sheet and at least one constituent element from the dielectric layer. The metallic protrusion is then etched to form a metallic interlocking structure that is integral with the portion of the blind surface. The metallic interlocking structure includes discrete metallic fibers, with each metallic fiber having a curved (or curled) geometry. Each metallic fiber has its own unique composition that includes the metal, at least one constituent element of the dielectric layer, or both.

Abstract translation: 一种电子结构，包括用于将导电镀层接合到金属表面的金属互锁结构，以及形成电子结构的方法。 该方法提供了在电介质层内具有金属片的衬底。 金属片包括铜等金属。 通过激光钻孔穿过电介质层并且部分地穿过金属片，形成诸如盲孔之类的衬底中的开口。 如果开口是盲孔，则激光钻孔是通过横截面的盲孔通过横截面的半径的约20％至约150％之间的目标直径的激光束在盲孔的外环内。 在开口底部的称为“盲面”的表面包括通过激光钻孔形成的金属突起，使得金属突起与盲表面的一部分成一体。 金属突起包括金属片的金属和来自电介质层的至少一个构成元件。 然后蚀刻金属突起以形成与盲表面的一部分成一体的金属互锁结构。 金属互锁结构包括分立的金属纤维，每个金属纤维具有弯曲（或卷曲）的几何形状。 每种金属纤维具有其独特的组成，其包括金属，介电层的至少一个构成元件，或两者。

公开(公告)号：US06299942B1

公开(公告)日：2001-10-09

申请号：US09510674

申请日：2000-02-22

Applicant: Eiji Tamura ,  Wataru Kosaka ,  Toshimi Arashi

Inventor： Eiji Tamura ,  Wataru Kosaka ,  Toshimi Arashi

IPC: B05D312

CPC classification number: C23C18/22 ,  C23C18/1641 ,  C23C18/2013 ,  C23C18/285 ,  C23C18/30 ,  C23C18/405 ,  H05K1/0373 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/09118 ,  H05K2203/025

Abstract: A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.

Abstract translation: 一种无电镀模塑制品的制造方法，其包括将具有特定艾佐德冲击强度的热塑性树脂和洛氏硬度的无机填料制成的树脂组合物成型，然后使用空气吹扫处理模制品的表面 研磨剂具有尖锐的颗粒形状，然后进行催化剂涂覆，活化处理和化学镀。 可以对热塑性树脂组合物的成型体施加高粘合强度的无电镀，而不进行化学蚀刻处理。

公开(公告)号：US5120384A

公开(公告)日：1992-06-09

申请号：US742080

申请日：1991-08-07

Applicant: Tokio Yoshimitsu ,  Kouji Sato ,  Yoshihide Sawa

Inventor： Tokio Yoshimitsu ,  Kouji Sato ,  Yoshihide Sawa

IPC: B29C70/86 ,  B32B15/14 ,  B32B37/00 ,  B32B38/00 ,  H05K1/03 ,  H05K3/38 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: B32B37/0038 ,  B29C70/865 ,  B32B15/14 ,  H05K3/445 ,  H05K3/4641 ,  B29K2105/0854 ,  B29K2105/16 ,  B29L2031/3425 ,  B32B2311/12 ,  B32B2457/08 ,  B32B38/0012 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0293 ,  H05K2201/09309 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K2203/143 ,  H05K3/385 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4611 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer laminate provides in metal plates each forming a substrate apertures at positions where through holes are to be formed, fills the apertures with a synthetic resin including a first filler, and prepares prepregs to be disposed on both sides of each substrate by impregnating nonwoven fabric with a thermosetting synthetic resin containing a second filler. The metal plates forming the substrates are thereby allowed to be thicker for realizing larger capacity power supply with an improvement also in heat dissipation characteristics.

Abstract translation: 制造多层叠层体的方法提供在金属板中，每个在要形成通孔的位置处形成基底孔，在包含第一填料的合成树脂中填充孔，并制备待设置在每个基底两侧的预浸料 通过用含有第二填料的热固性合成树脂浸渍无纺布。 因此，形成基板的金属板可以更厚以实现更大容量的电源，并且散热特性也得到改善。

公开(公告)号：US20170086290A1

公开(公告)日：2017-03-23

申请号：US15099212

申请日：2016-04-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Keun-Yong LEE ,  Jun-Young KIM ,  Sa-Yong LEE ,  Sang-Hyun SHIN

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K1/0366 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/026

Abstract: A prepreg, a printed circuit board and a method of manufacturing the same are provided. A prepreg includes a core layer including nanofibers having a thickness in a range of 10 to 100 nm, a first insulating layer on a first surface of the core layer, and a second insulating layer on a second surface of the core layer.

公开(公告)号：US20170012013A1

公开(公告)日：2017-01-12

申请号：US15271744

申请日：2016-09-21

Applicant: FUJITSU LIMITED

Inventor： KOZO SHIMIZU ,  Seiki Sakuyama

IPC: H01L23/00 ,  H01L23/498 ,  B23K35/26 ,  H01L23/31 ,  B23K1/00 ,  B23K35/02

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Abstract translation: 电子设备包括具有第一端子的第一电子部件，与第一端子相对的第二端子的第二电子部件和与第一端子和第二端子连接的接合部。 接合部分包含在第一端子和第二端子彼此相对的方向上延伸的极性化合物。 接合部分包含杆状化合物，从而提高接合部分的强度。 当第一端子和第二端子接合时，第一电子部件和第二电子部件之一的温度被制成高于另一端子的温度。 在该状态下将接合材料冷却并固化。 通过这样做，形成极点状化合物。

公开(公告)号：US20160353570A1

公开(公告)日：2016-12-01

申请号：US15136231

申请日：2016-04-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Chul LEE

IPC: H05K1/03 ,  C08K3/36 ,  H05K3/10 ,  C08K3/26 ,  C08J5/18 ,  C08K7/00 ,  C08K3/40

CPC classification number: H05K1/0373 ,  C08K3/013 ,  C08K3/26 ,  C08K3/36 ,  C08K3/40 ,  C08K7/00 ,  C08K2003/265 ,  C08K2201/016 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0376 ,  C08L63/00

Abstract: A resin composition for packaging, an insulating film and a printed circuit board manufactured with the resin composition, and a method of manufacturing a printed circuit board with the resin composition are provided. The resin composition for packaging includes an epoxy resin, and inorganic filler particles dispersed in the epoxy resin, and an aspect ratio of the inorganic filler particles is 1.0 or more and 3.0 or less.

Abstract translation: 提供了一种用于包装的树脂组合物，绝缘膜和用树脂组合物制造的印刷电路板，以及制造具有树脂组合物的印刷电路板的方法。 用于包装的树脂组合物包括环氧树脂和分散在环氧树脂中的无机填料颗粒，无机填料颗粒的纵横比为1.0以上至3.0以下。

公开(公告)号：US09293384B2

公开(公告)日：2016-03-22

申请号：US13522218

申请日：2011-01-13

Applicant: Yuusaku Ishimine ,  Masayuki Moriyama ,  Kenji Komatsubara

Inventor： Yuusaku Ishimine ,  Masayuki Moriyama ,  Kenji Komatsubara

IPC: H01L23/15 ,  H05K7/20 ,  H05K1/00 ,  B32B33/00 ,  H01L23/13 ,  H01L35/32 ,  C04B35/587 ,  C04B37/02 ,  H05K1/03 ,  H05K3/38

CPC classification number: H01L23/13 ,  C04B35/587 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3878 ,  C04B2235/3882 ,  C04B2235/5276 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/6581 ,  C04B2235/6582 ,  C04B2235/6587 ,  C04B2235/721 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/945 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2201/0269 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/25 ,  Y10T428/259 ,  H01L2924/00

Abstract: A silicon nitride substrate comprises a substrate comprising a silicon nitride sintered body, and a plurality of granular bodies containing silicon and integrated to a principal surface of the substrate, wherein a plurality of needle crystals or column crystals comprising mainly silicon nitride are extended from a portion of the granular bodies. A brazing material is applied to a principal surface of the substrate, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies integrated to the principal surface of the substrate, and a plurality of the needle crystals or the column crystals extended from a portion of the granular bodies, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate.

Abstract translation: 氮化硅衬底包括含有氮化硅烧结体的衬底和多个含有硅的颗粒体并且与衬底的主表面集成在一起，其中主要包含氮化硅的多个针状晶体或柱状晶体从一部分 的颗粒体。 将钎焊材料施加到基板的主表面，并且将电路构件和散热构件布置在所施加的钎焊材料上，并通过加热粘合。 由于集成到基板的主面的多个粒状体以及从一部分粒状体延伸的多个针状晶体或柱状晶体，产生高的锚定效应，使得电路部件和热量 辐射构件牢固地结合到氮化硅衬底上。