中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

415 records (took 0.013 seconds)

    Method of making an electronic package with enhanced heat sinking
    61.
    发明授权
    Method of making an electronic package with enhanced heat sinking 失效
    制造具有增强散热的电子封装的方法

    公开(公告)号：US5263245A

    公开(公告)日：1993-11-23

    申请号：US19408

    申请日：1993-02-16

    Applicant: Maganlal S. Patel ,  John J. Zopff

    Inventor： Maganlal S. Patel ,  John J. Zopff

    IPC: H01L23/31 ,  H01L23/367 ,  H05K1/02 ,  H05K7/20 ,  H05K3/34

    CPC classification number: H05K1/0204 ,  H01L23/3121 ,  H01L23/367 ,  H01L2224/32188 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01039 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/181 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2203/049 ,  Y10T29/4913 ,  Y10T29/49144

    Abstract: An electronic package which includes a substrate having a dielectric layer, a circuitized layer located on one surface of the dielectric and a thermally and electrically conductive layer located on a second surface of the dielectric, this thermally and conductive layer designed for providing enhanced heat removal from the package's semiconductor device. A pedestal element is located on or formed as part of the thermal and electrically conductive layer, and extends through the dielectric and circuitized layers for having the semiconductor device positioned thereon. The semiconductor device is thus in substantially direct thermal communication with the pedestal element and thus the adjacent, thick thermal conductive layer which functions as the package's heat sink. In one embodiment, solder is provided on the pedestal element to interconnect desired portions of the circuitized layer with the pedestal element (e.g., to provide electrical ground). A method of making such an electronic package is also defined herein.

    Abstract translation: 一种电子封装，其包括具有电介质层的基板，位于电介质的一个表面上的电路层，以及位于电介质的第二表面上的导热层，该导热层被设计用于提供从 封装的半导体器件。 基座元件位于或形成为导热层的一部分，并且延伸穿过介电层和电路层，以使半导体器件位于其上。 因此，半导体器件与基座元件基本上直接热连通，并且因此与用作封装散热器的相邻厚的导热层基本上直接热连通。 在一个实施例中，在基座元件上提供焊料以将电路化层的所需部分与基座元件（例如，以提供电接地）相互连接。 制造这样的电子封装的方法也在本文中定义。

    Methods of producing printed circuit boards
    62.
    发明授权
    Methods of producing printed circuit boards 失效
    生产印刷电路板的方法

    公开(公告)号：US4912844A

    公开(公告)日：1990-04-03

    申请号：US230460

    申请日：1988-08-10

    Applicant: Frederick Parker

    Inventor： Frederick Parker

    IPC: H05K1/02 ,  H05K1/05 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/04 ,  H05K3/10 ,  H05K3/24 ,  H05K3/34

    CPC classification number: H05K3/107 ,  H05K3/0014 ,  H05K3/041 ,  H05K3/045 ,  H05K3/3457 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/09 ,  H05K1/183 ,  H05K2201/0129 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/025 ,  H05K2203/1105 ,  H05K2203/1469 ,  H05K3/0061 ,  H05K3/244 ,  H05K3/3468 ,  Y10T29/49139 ,  Y10T29/49158

    Abstract: A punch has a planar surface and raised portions extending from the planar surface. First ones of the raised portions may have a height of approximately 3-25 mils. Second ones of the raised portions may have a greater depth than the first raised portions. The punch may be heated and/applied to the planar surface of a substrate which may also be pre-heated and which has properties of becoming deformed when subjected to heat and pressure. The punch produces cavities and grooves in the substrate at the positions of the raised portions. Electrical components may be disposed in the cavities in the substrate and an electrically conductive material may be disposed in the grooves to communicate with the electrical components. The raised portions in the punch may be provided by printed circuit techniques or by matching or by laser techniques. Alternatively, a foil may be disposed on the planar surface of the punch and the raised portions of the punch. When the punch is applied to the substrate, the grooves and cavities are formed and the foil is transferred to the substrate on the planar surface and in the grooves and cavities in the substrate. The portions of the foil on the planar surface of the substrate may then be removed as by printed circuit techniques or machining or laser techniques so that only the portions of the foil in the grooves and the cavities remain. If desired, these portions of the foil may be electrically plated.

    Abstract translation: 冲头具有从平面表面延伸的平坦表面和凸起部分。 凸起部分中的第一个可以具有大约3-25密耳的高度。 第二凸起部分可以具有比第一凸起部分更深的深度。 冲头可以被加热和/施加到也可以被预热的基底的平坦表面上，并且当经受热和压力时具有变形的性质。 冲头在凸起部分的位置处在基板中产生空腔和凹槽。 电气部件可以设置在基板的空腔中，并且导电材料可以设置在凹槽中以与电气部件连通。 冲头中的凸起部分可以通过印刷电路技术或通过匹配或通过激光技术来提供。 或者，箔可以设置在冲头的平面表面和冲头的凸起部分上。 当冲头施加到基板上时，形成凹槽和空腔，并且箔片被转移到基板上的平面表面和基板中的凹槽和空腔中。 然后可以通过印刷电路技术或机械加工或激光技术去除衬底的平面表面上的箔的部分，使得只有凹槽和空腔中的箔的部分保留。 如果需要，箔的这些部分可以被电镀。

    Method of forming contact bumps in contact pads
    63.
    发明授权
    Method of forming contact bumps in contact pads 失效
    在接触焊盘中形成接触凸块的方法

    公开(公告)号：US4891014A

    公开(公告)日：1990-01-02

    申请号：US319130

    申请日：1989-03-03

    Applicant: Scott S. Simpson ,  Bruce G. Kosa

    Inventor： Scott S. Simpson ,  Bruce G. Kosa

    IPC: H05K3/34 ,  H01L21/60 ,  H01R12/79 ,  H05K3/24 ,  H05K3/40

    CPC classification number: H05K3/4007 ,  H01R12/79 ,  H05K2201/0187 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0394 ,  Y10T29/49155 ,  Y10T29/49222

    Abstract: A process for forming a contact bump in an electrically conductive contact pad having top and bottom surfaces supported on a dielectric substrate that includes the steps of removing a portion of the substrate underlying the contact pad to form an aperture and expose a portion of the bottom surface of the pad; upwardly deforming the pad by applying force to its exposed bottom surface to form the bump; and filling the aperture behind the bump with a supporting substance.

    Abstract translation: 一种用于在导电接触焊盘中形成接触凸块的工艺，其具有支撑在电介质基板上的顶表面和底表面，该方法包括以下步骤：去除接触焊盘下方的一部分基板以形成孔，并暴露底表面的一部分 的垫子 通过向其暴露的底部表面施加力而向上使鞋垫变形以形成凸块; 并用支撑物质填充凸起后面的孔。

    Composites of glass-ceramic to metal seals and method of making the same
    65.
    发明授权
    Composites of glass-ceramic to metal seals and method of making the same 失效
    玻璃陶瓷与金属密封的复合材料及其制造方法

    公开(公告)号：US4491622A

    公开(公告)日：1985-01-01

    申请号：US369699

    申请日：1982-04-19

    Applicant: Sheldon H. Butt

    Inventor： Sheldon H. Butt

    IPC: H05K3/46 ,  B32B15/04 ,  H05K1/03 ,  H05K1/05 ,  H05K3/42 ,  B32B17/06

    CPC classification number: H05K1/053 ,  H05K1/0306 ,  H05K2201/0382 ,  H05K2203/068 ,  H05K3/42 ,  Y10T29/49126 ,  Y10T428/12611 ,  Y10T428/1291

    Abstract: A composite comprises a first metal or alloy component having a thin refractory oxide layer on a first surface thereof. A second metal or alloy component has a second thin refractory oxide on the first surface thereof. Means are provided having a closely matched coefficient of thermal expansion to the first and second metal or alloy components for bonding the first and second thin refractory oxide layers and for electrically insulating the first component from the second component whereby thermal stress between the metal or alloy components and the bonding means is substantially eliminated.

    Abstract translation: 复合材料包括在其第一表面上具有薄的难熔氧化物层的第一金属或合金组分。 第二金属或合金组分在其第一表面上具有第二薄耐火氧化物。 提供具有与第一和第二金属或合金部件紧密匹配的热膨胀系数的装置，用于将第一和第二薄耐火氧化物层接合并将第一部件与第二部件电绝缘，由此金属或合金部件之间的热应力 并且基本上消除了接合装置。

    Method of forming aperture with rounded edges in sheet material
    66.
    发明授权
    Method of forming aperture with rounded edges in sheet material 失效
    在片材中形成具有圆形边缘的孔的方法

    公开(公告)号：US4248075A

    公开(公告)日：1981-02-03

    申请号：US36189

    申请日：1979-05-04

    Applicant: George J. Whitley

    Inventor： George J. Whitley

    IPC: H05K3/00 ,  B21D19/00 ,  B21D28/24 ,  H05K1/05 ,  H05K3/44 ,  B21D28/26 ,  B21D37/10

    CPC classification number: B21D19/005 ,  B21D28/24 ,  H05K3/445 ,  H05K1/053 ,  H05K2201/0382 ,  H05K2201/09827 ,  H05K2203/0108 ,  H05K2203/0323 ,  H05K3/005 ,  Y10T29/49124

    Abstract: A procelain on steel printed circuit board includes apertures whose edges are rounded. An aperture is formed by first punching or otherwise making an aperture in the uncoated steel of somewhat larger size than desired, then employing a pair of dies, each with rounded shoulders and a center region of smaller area than the aperture. When the board is placed between the dies with the center region of the latter aligned with an aperture, and pressure is applied to the dies, they engage and round the edges of the aperture. The excess displaced material is forced into space between the original peripheral edge of the aperture and the center region of the dies, thereby decreasing the size of the aperture to the desired size and forming a relatively smooth tapered transition region between opposite surfaces of the board and the outer circumference of the aperture of reduced size. The steel is coated with porcelain after the finished apertures are formed.

    Abstract translation: 钢印刷电路板上的一个原版包括边缘为圆形的孔。 通过首先冲压或以其它方式制造比所需的更大尺寸的未涂覆钢的孔，然后使用一对模具，每个模具具有圆形的肩部和比孔小的区域的中心区域来形成孔。 当板被放置在模具之间，其中心区域与孔对准时，并且压力施加到模具，它们接合并围绕孔的边缘。 过量移位的材料被迫进入孔的原始外围边缘和模具的中心区域之间的空间，从而将孔的尺寸减小到所需尺寸，并在板的相对表面之间形成相对平滑的锥形过渡区域，以及 孔径的外圆周减小。 在成型孔形成后，钢被涂上瓷。

Patent Agency Ranking