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公开(公告)号：US09814166B2
公开(公告)日：2017-11-07
申请号：US13955149
申请日：2013-07-31
Inventor： Jen-Chun Chen , Tsung-Jung Cheng , Chia-Cheng Liu
IPC: H01L21/56 , H05K9/00 , H01L23/00 , H01L23/31 , H01L23/552 , H01L27/146 , H05K3/28 , H05K1/02
CPC classification number: H05K9/0024 , H01L21/56 , H01L23/3114 , H01L23/552 , H01L24/02 , H01L27/14618 , H01L2924/0002 , H05K1/0224 , H05K3/288 , H05K2201/0707 , H05K2201/1056 , H05K2203/0191 , H05K2203/107 , H05K2203/1105 , H01L2924/00
Abstract: A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.
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公开(公告)号：US20170202100A1
公开(公告)日：2017-07-13
申请号：US15284690
申请日：2016-10-04
Applicant: PEGATRON CORPORATION
Inventor： YAO-ZHENG LIN , YU-CHUN CHANG
CPC classification number: H05K7/1439 , H05K1/0216 , H05K1/111 , H05K1/141 , H05K9/0015 , H05K9/006 , H05K2201/0707 , H05K2201/10386
Abstract: A circuit board assembly includes a main board, a daughter board, a metal bracket, and a conductive gasket. The daughter board includes a circuit board and an electronic module with a plurality of pins connected to the circuit board. The metal bracket clamps at one side of the circuit board and the electronic module to shield the plurality of pins. The metal bracket has a connection part connecting the main board. The conductive gasket is disposed between the metal bracket and the plurality of pins.
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63.发明申请公开(公告)号：US20170118833A1
公开(公告)日：2017-04-27
申请号：US15398803
申请日：2017-01-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yang Je LEE , Dek Gin YANG , Dong Gi AN , Jae Ho SHIN
CPC classification number: H05K3/06 , H05K1/0218 , H05K1/0278 , H05K1/028 , H05K1/09 , H05K3/0035 , H05K3/281 , H05K3/386 , H05K3/4644 , H05K3/4652 , H05K3/4691 , H05K2201/0154 , H05K2201/0187 , H05K2201/0707 , H05K2203/0554 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165
Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
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公开(公告)号：US20170110229A1
公开(公告)日：2017-04-20
申请号：US14885953
申请日：2015-10-16
Applicant: Keyssa Licensing, Inc.
Inventor： Stephen Robert Venuti , Steve Novak
CPC classification number: H01F7/0242 , H05K1/18 , H05K1/181 , H05K2201/0707 , H05K2201/10098 , H05K2203/104 , H05K2203/166 , Y02P70/611
Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.
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公开(公告)号：US20170093456A1
公开(公告)日：2017-03-30
申请号：US15276179
申请日：2016-09-26
Applicant: Electrochem Solutions, Inc.
Inventor： Gregory G. Decker , Brian R. Peterson , Eric Jankins
CPC classification number: H04B1/40 , H02J7/0029 , H02J7/025 , H02J50/10 , H02J50/12 , H02J50/80 , H02J2007/0037 , H02J2007/004 , H02M7/155 , H04B5/0031 , H04B5/0037 , H05K1/0216 , H05K1/0218 , H05K1/0298 , H05K1/115 , H05K2201/0707 , H05K2201/09609
Abstract: A system for harnessing and conditioning wirelessly transmitted electrical energy by near field magnetic induction configured with various magnetic field shielding embodiments is disclosed. The shielding embodiments are designed to minimize electromagnetic interference and induced electrical current. The system comprises an electrical energy capture circuit and an RF communication circuit. The electrical energy capture circuit conditions and modifies the wirelessly received electrical energy. The RF communication circuit enables the system to wirelessly communicate with its sub-circuits and other energy capture systems. The system comprises a tunable band stop filter that is electrically connected to the RF communication sub-circuit. In addition, the RF communication sub-circuit is configured with opposing electrically conductive plates that isolate and shield the circuit from an oscillating magnetic field.
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Patent Agency Ranking
公开(公告)号：US09566429B2
公开(公告)日：2017-02-14
申请号：US14834267
申请日：2015-08-24
Applicant: Youngtack Shim
Inventor： Youngtack Shim
IPC: G02F1/1333 , A61N1/16 , H05K9/00
CPC classification number: A61N1/16 , H05K9/0054 , H05K9/0071 , H05K2201/0707
Abstract: The present invention relates to an electromagnetically-countered display system including at least one wave source and at least one counter unit, where such a wave source irradiates harmful electromagnetic waves and the counter unit emits counter electromagnetic waves for countering the harmful waves therewith. More particularly, the present invention relates to various counter units for the electromagnetically-countered display system and to various mechanisms to counter the harmful waves with the counter units, e.g., by matching configurations of the counter units with those of the wave sources, by matching wavefronts of the harmful waves with those the counter waves, and so on. The present invention also relates to various methods of countering the harmful waves with such counter waves by source and/or wave matchings, various methods of providing the counter units for emitting the counter waves defining desired wave characteristics, and the like. The present invention further relates to various processes for providing the electromagnetically-countered display systems and their counter units. The present invention further relates to various electric and magnetic shields employed either alone or in conjunction with the counter units for minimizing irradiation of the harmful waves from the shaving system.
Abstract translation: 本发明涉及一种电磁反射显示系统，其包括至少一个波源和至少一个计数器单元，其中这种波源照射有害的电磁波，并且该计数器单元发射反电磁波以抵抗有害波。 更具体地，本发明涉及用于电磁反射显示系统的各种计数器单元以及用于通过与计数器单元对抗有害波的各种机制，例如通过匹配计数器单元与波源的配置，通过匹配 有波浪的波浪与那些反浪，等等。 本发明还涉及通过源和/或波匹配来对抗有害波的各种方法，提供用于发射限定所需波特性的反波的计数器单元的各种方法等。 本发明还涉及用于提供电磁反射显示系统及其计数器单元的各种方法。 本发明还涉及单独使用或与计数器单元结合使用的各种电磁屏蔽件，用于最小化来自剃刮系统的有害波的照射。
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公开(公告)号：US20150091674A1
公开(公告)日：2015-04-02
申请号：US14564140
申请日：2014-12-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru KATO , Satoshi ISHINO , Jun SASAKI , Kuniaki YOSUI , Takahiro BABA , Nobuo IKEMOTO
IPC: H01P3/08
CPC classification number: H01P3/02 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/082 , H01P3/085 , H01P5/00 , H01P5/028 , H05K1/0218 , H05K1/0221 , H05K1/0237 , H05K1/0242 , H05K1/025 , H05K1/028 , H05K1/0296 , H05K1/14 , H05K1/148 , H05K1/186 , H05K3/361 , H05K2201/0707 , H05K2201/09218
Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.
Abstract translation: 扁平电缆的传输线部分包括交替连接的第一区域和第二区域。 在第一区域中，传输线部分是包括具有信号导体的介质元件，包括开口部分的第一接地导体和作为固体填充导体的第二接地导体的柔性三板传输线。 在第二区域中，传输线部分是包括具有曲折导体的宽电介质元件和固体填充导体的第一接地导体和第二接地导体的硬三板传输线。 第二区域中的特性阻抗的变化幅度大于第一区域中的特性阻抗的变化宽度。
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公开(公告)号：US20140218606A1
公开(公告)日：2014-08-07
申请号：US14248150
申请日：2014-04-08
Applicant: Apple Inc.
Inventor： Shayan Malek , Benjamin J. Pope , Daniel W. Jarvis , Tang Yew Tan , Richard H. Dinh , Robert J. Steinfeld , Ramachandran Chundru
CPC classification number: H05K9/0064 , H04M1/0274 , H04M1/0277 , H04N5/2254 , H05K1/0215 , H05K1/0216 , H05K2201/0707
Abstract: Various systems of an electronic deice and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield and electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
Abstract translation: 提供电子设备的各种系统及其制造方法。 在一些实施例中，提供了路线组件，其可以不仅沿着电路板路由电缆，而且还可以屏蔽电子部件或将电子部件固定到电路板。 在一些其他实施例中，提供了一种用于电耦合电子设备的两个部件的机构，其在电子设备的其它部分的上下文中也可以是视觉上吸引人的。
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公开(公告)号：US20130048368A1
公开(公告)日：2013-02-28
申请号：US13370881
申请日：2012-02-10
Applicant: Shayan Malek , Benjamin John Pope , Daniel William Jarvis , Tang Tan , Richard Hung Minh Dinh , Robert Steinfeld , Ramachandran Chundru
Inventor： Shayan Malek , Benjamin John Pope , Daniel William Jarvis , Tang Tan , Richard Hung Minh Dinh , Robert Steinfeld , Ramachandran Chundru
IPC: H05K9/00
CPC classification number: H05K9/0064 , H04M1/0274 , H04M1/0277 , H04N5/2254 , H05K1/0215 , H05K1/0216 , H05K2201/0707
Abstract: Various systems of an electronic device and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield an electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
Abstract translation: 提供电子设备的各种系统及其制造方法。 在一些实施例中，提供了路线组件，其可以不仅沿着电路板路由电缆，而且还可以屏蔽电子部件或将电子部件固定到电路板。 在一些其他实施例中，提供了一种用于电耦合电子设备的两个部件的机构，其在电子设备的其它部分的上下文中也可以是视觉上吸引人的。
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公开(公告)号：US20130012017A1
公开(公告)日：2013-01-10
申请号：US13614563
申请日：2012-09-13
Applicant: Daniel C. Edelstein , David V. Horak , Elbert E. Huang , Satyanarayana V. Nitta , Takeshi Nogami , Shom Ponoth , Terry A. Spooner
Inventor： Daniel C. Edelstein , David V. Horak , Elbert E. Huang , Satyanarayana V. Nitta , Takeshi Nogami , Shom Ponoth , Terry A. Spooner
IPC: H01L21/768
CPC classification number: H05K1/0216 , H01L21/7682 , H01L21/76832 , H01L21/76834 , H01L21/76849 , H01L21/76852 , H05K1/0298 , H05K1/03 , H05K2201/0707 , H05K2201/09063
Abstract: A microelectronic structure and a method for fabricating the microelectronic structure provide a plurality of voids interposed between a plurality of conductor layers. The plurality of voids is also located between a liner layer and an inter-level dielectric layer. The voids provide for enhanced electrical performance of the microelectronic structure.
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