公开(公告)号：US20100126762A1

公开(公告)日：2010-05-27

申请号：US12452479

申请日：2008-06-23

Applicant: Harumi Nagao ,  Yoshiyuki Asakawa

Inventor： Harumi Nagao ,  Yoshiyuki Asakawa

IPC: H05K1/11 ,  H05K3/06 ,  C09K13/04

CPC classification number: H05K3/067 ,  C23F1/26 ,  C23F1/28 ,  H05K1/0393 ,  H05K3/26 ,  H05K3/388 ,  H05K2201/0761 ,  H05K2203/0796 ,  Y10T428/12569 ,  Y10T428/31681

Abstract: A method for manufacturing a printed circuit board enables a metal residue between wirings to be removed inexpensively without side etching of a copper layer while having sufficient insulation reliability for micro wiring working. The method includes forming a base metal layer directly at least on one face of an insulator film without an adhesive, and a copper coat layer formed on the base metal layer to form adhesiveless copper clad laminates, then forming a pattern on the adhesiveless copper clad laminates by an etching method. The etching method includes a process of etching treatment for the adhesiveless copper clad laminates with an iron (III) chloride solution or a copper (II) chloride solution containing hydrochloric acid and then, a process of treatment with an acid oxidant containing potassium permanganate.

Abstract translation: 印刷电路板的制造方法能够廉价地除去布线之间的金属残留物，而不会对铜层进行侧蚀刻，同时具有足够的微布线工作的绝缘可靠性。 该方法包括直接在绝缘膜的至少一个表面上形成基底金属层，而无需粘合剂，以及形成在基底金属层上的铜涂层，以形成无粘合剂的铜包覆层压板，然后在无粘合剂覆铜层压板上形成图案 通过蚀刻方法。 蚀刻方法包括用氯化铁（III）溶液或含有盐酸的氯化铜（II）溶液对无粘合剂覆铜层压板进行蚀刻处理的方法，然后使用含有高锰酸钾的酸式氧化剂进行处理。

公开(公告)号：US20100120203A1

公开(公告)日：2010-05-13

申请号：US12693096

申请日：2010-01-25

Applicant: Takashi OKADA ,  Kiyokazu OKADA ,  Akinori ONO ,  Taku NISHIYAMA

Inventor： Takashi OKADA ,  Kiyokazu OKADA ,  Akinori ONO ,  Taku NISHIYAMA

IPC: H01L21/50 ,  H01L21/56

CPC classification number: H05K1/0256 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/0761 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2203/0228 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.

Abstract translation: 电路板具有设置在其外部形状的至少一侧的弯曲部分。 外部连接端子设置在电路板的第一主表面上。 半导体元件安装在电路板的第二主表面上。 第一布线网络设置在除了第一主表面上的端子区域之外的区域中。 第二配线网络设置在第二主表面上。 从包括弯曲部分到第一布线网络的一侧的距离大于从另一侧至第一布线网络中的至少一个的距离，并且从包括弯曲部分到第二布线网络的一侧的距离大于距离 至少一个对方到第二布线网络。

公开(公告)号：US20100078208A1

公开(公告)日：2010-04-01

申请号：US12585754

申请日：2009-09-24

Applicant: Seiichi Inoue

Inventor： Seiichi Inoue

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K3/246 ,  H05K1/0256 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/1208 ,  H05K3/125 ,  H05K3/28 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0761 ,  H05K2201/0769 ,  H05K2201/09036 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/1147 ,  H05K2203/1173 ,  Y10T29/49155

Abstract: A method of forming a wiring board comprises: a step of forming a receptive layer having a porous structure on a substrate; a step of forming wiring portions in a desired conductive pattern on a surface of the receptive layer by ejecting a colloidal metal solution for drawing by an ink-jet system based on image date of the conductive pattern; and a step of performing a migration-proof treatment on at least part of the receptive layer exposed between mutually adjacent wiring portions.

Abstract translation: 形成布线板的方法包括：在基板上形成具有多孔结构的接收层的步骤; 基于导电图案的图像日期，通过喷射通过喷墨系统进行拉伸的胶体金属溶液，在接收层的表面上形成所需导电图案中的布线部分的步骤; 以及对相互相邻的布线部之间露出的接受层的至少一部分进行防迁移处理的步骤。

公开(公告)号：US20090314145A1

公开(公告)日：2009-12-24

申请号：US12470135

申请日：2009-05-21

Applicant: Jacqueline Bablet ,  Mohamed Benwadih

Inventor： Jacqueline Bablet ,  Mohamed Benwadih

IPC: B26D3/00 ,  B44C1/22

CPC classification number: H05K3/26 ,  B08B3/02 ,  H05K1/0393 ,  H05K3/027 ,  H05K3/22 ,  H05K2201/0761 ,  H05K2203/0346 ,  H05K2203/0746 ,  Y10T83/0591

Abstract: The invention relates to a method for eliminating mask projection laser ablation engraving defects from a metal film deposited on a flexible carrier. According to the invention, the method comprises spraying onto said defects a liquid pressurized at between about 1500 PSI and about 3000 PSI.

Abstract translation: 本发明涉及一种从沉积在柔性载体上的金属膜消除掩模投影激光烧蚀雕刻缺陷的方法。 根据本发明，该方法包括向所述缺陷喷涂在约1500psi至约3000psi之间加压的液体。

公开(公告)号：US20090120901A1

公开(公告)日：2009-05-14

申请号：US12246643

申请日：2008-10-07

Applicant: Lawrence Keith White ,  Joseph Thomas McGinn

Inventor： Lawrence Keith White ,  Joseph Thomas McGinn

IPC: B44C1/22

CPC classification number: H05K3/26 ,  H05K3/048 ,  H05K3/06 ,  H05K3/22 ,  H05K2201/0326 ,  H05K2201/0761 ,  H05K2203/0346 ,  H05K2203/0789

Abstract: Aspects of the present invention provide patterned electrodes with substantially reduced or removed residue. Aspects of the present invention for removing residue are applicable to any fabricated structure including transparent electrodes. By substantially reducing or removing residue typically associated with methods used to form patterned electrodes, an improvement in performance can be realized by ensuring that the deposition of subsequent materials onto a substrate is not adversely affected by any such residue. In turn, better interconnects can be formed and better coverage of subsequent layers can be achieved. The method for producing patterned electrodes with substantially reduced or removed residue in accordance with the present invention can be used in conjunction with any known method for patterning conductors or electrodes.

Abstract translation: 本发明的方面提供具有显着减少或去除的残余物的图案化电极。 用于除去残留物的本发明的方面适用于包括透明电极的任何制造结构。 通过显着减少或除去通常与用于形成图案化电极的方法相关联的残余物，可以通过确保随后的材料沉积到基底上而不受任何这种残留物的不利影响来实现性能的改善。 反过来，可以形成更好的互连，并且可以实现后续层的更好的覆盖。 根据本发明的用于制造具有显着减少或去除的残余物的图案化电极的方法可以与用于图案化导体或电极的任何已知方法结合使用。

公开(公告)号：US07333346B2

公开(公告)日：2008-02-19

申请号：US10983977

申请日：2004-11-09

Applicant: Tomoyuki Miyagawa ,  Toshiharu Shiratsuchi ,  Isao Tanooka ,  Hideaki Sugiura

Inventor： Tomoyuki Miyagawa ,  Toshiharu Shiratsuchi ,  Isao Tanooka ,  Hideaki Sugiura

IPC: H05K1/00

CPC classification number: H05K1/0268 ,  H01L22/32 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/28 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/0761 ,  H05K2201/09781 ,  H01L2924/00

Abstract: A circuit board includes: a substrate; a conductive pattern disposed on a surface of the substrate; a lower insulation layer disposed on the conductive pattern to cover the conductive pattern except for an opening, through which the conductive pattern is partially exposed from the lower insulation layer; a conductor disposed on the lower insulation layer and connecting to the conductive pattern through the opening; an upper insulation layer disposed on the conductor for covering the conductor and the lower insulation layer; and a test coupon disposed on the substrate for evaluating the conductor.

Abstract translation: 电路板包括：基板; 设置在所述基板的表面上的导电图案; 设置在所述导电图案上的下绝缘层，以覆盖所述导电图案，除了开口，所述导电图案通过所述开口部分地从所述下绝缘层露出; 导体，其设置在所述下绝缘层上并通过所述开口连接到所述导电图案; 设置在所述导体上用于覆盖所述导体和所述下绝缘层的上绝缘层; 以及设置在基板上用于评估导体的试样。

公开(公告)号：US07312145B2

公开(公告)日：2007-12-25

申请号：US10502129

申请日：2003-10-22

Applicant: Takeshi Hashimoto

Inventor： Takeshi Hashimoto

IPC: H01L21/4763

CPC classification number: H01L23/49572 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/0032 ,  H05K3/202 ,  H05K3/22 ,  H05K3/386 ,  H05K2201/0761 ,  H05K2203/0522 ,  H01L2924/00

Abstract: The present invention provides an electronic device having high insulating reliability, in which metal portions of a circuit are not electrically conductive with each other via an adhesive layer even when the electronic device is used in high-temperature low-humidity conditions or high-temperature high-humidity conditions, and provides a production method for the electronic device, and a semiconductor device comprising the electronic device. In the electronic device in which a circuit formed by pattern formation of metal portions is attached via an adhesive layer to an insulating base, the adhesive layer, which contacts adjacent metal portions, is divided. Typically, the electronic device is one of a lead frame having a lead frame fixing tape, a TAB tape, and a flexible printed circuit board.

Abstract translation: 本发明提供一种具有高绝缘可靠性的电子器件，其中电路中的金属部分通过粘合剂层彼此不导电，即使电子器件用于高温低湿条件或高温高 并且提供了一种电子设备的制造方法以及包括该电子设备的半导体器件。 在通过金属部分的图案形成形成的电路经由粘合剂层附着到绝缘基底的电子装置中，与邻接的金属部分接触的粘合剂层被分割。 通常，电子设备是具有引线框架固定带，TAB带和柔性印刷电路板的引线框架之一。

公开(公告)号：US07285229B2

公开(公告)日：2007-10-23

申请号：US10979267

申请日：2004-11-02

Applicant: Masayo Kuriyama ,  Ryo Ogushi ,  Daisaku Akiyama ,  Kaoru Urushibata

Inventor： Masayo Kuriyama ,  Ryo Ogushi ,  Daisaku Akiyama ,  Kaoru Urushibata

IPC: C09K13/00 ,  C09K13/04 ,  C03C25/68 ,  C23F1/00 ,  C25F3/00 ,  B44C1/22

CPC classification number: H05K3/26 ,  C23F1/28 ,  C23F1/30 ,  H05K3/181 ,  H05K2201/0761 ,  H05K2203/0789 ,  H05K2203/124

Abstract: An etchant of the present invention includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source. An etching method of the present invention includes bringing the etchant into contact with at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium. Another etching method of the present invention includes bringing a first etchant that includes an aqueous solution containing at least the following components A to C (A. hydrochloric acid; B. at least one compound selected from the following (a) to (c): (a) compounds with 7 or less carbon atoms, containing a sulfur atom(s) and at least one group selected from an amino group, an imino group, a carboxyl group, a carbonyl group, and a hydroxyl group; (b) thiazole; and (c) thiazole compounds; and C. a surfactant) into contact with a surface of the metal, and then bringing a second solution that includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source into contact with the surface of the metal. According to the etchant and the etching methods of the present invention, it is possible to etch at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium quickly and suppress excessive dissolution of copper.

Abstract translation: 本发明的蚀刻剂包括含有盐酸，硝酸和铜离子源的水溶液。 本发明的蚀刻方法包括使蚀刻剂与选自镍，铬，镍 - 铬合金和钯中的至少一种金属接触。 本发明的另一种蚀刻方法包括使包含至少含有以下组分A至C的水溶液的第一蚀刻剂（A.盐酸; B.至少一种选自以下（a）至（c）的化合物： （a）具有7个以下碳原子的含有硫原子和至少1个选自氨基，亚氨基，羧基，羰基和羟基的基团的化合物;（b）噻唑 ;和（c）噻唑化合物;和C.a表面活性剂）与金属的表面接触，然后使包含含有盐酸，硝酸和铜离子源的水溶液的第二溶液与 金属表面。 根据本发明的蚀刻剂和蚀刻方法，可以快速地蚀刻选自镍，铬，镍 - 铬合金和钯中的至少一种金属并抑制铜的过度溶解。

公开(公告)号：US20070228509A1

公开(公告)日：2007-10-04

申请号：US11691716

申请日：2007-03-27

Applicant: Takashi OKADA ,  Kiyokazu Okada ,  Akinori Ono ,  Taku Nishiyama

Inventor： Takashi OKADA ,  Kiyokazu Okada ,  Akinori Ono ,  Taku Nishiyama

IPC: H01L29/00

CPC classification number: H05K1/0256 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/0761 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2203/0228 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.

Abstract translation: 电路板具有设置在其外部形状的至少一侧的弯曲部分。 外部连接端子设置在电路板的第一主表面上。 半导体元件安装在电路板的第二主表面上。 第一布线网络设置在除了第一主表面上的端子区域之外的区域中。 第二配线网络设置在第二主表面上。 从包括弯曲部分到第一布线网络的一侧的距离大于从另一侧至第一布线网络中的至少一个的距离，并且从包括弯曲部分到第二布线网络的一侧的距离大于距离 至少一个对方到第二布线网络。

公开(公告)号：US07129710B2

公开(公告)日：2006-10-31

申请号：US11178772

申请日：2005-07-11

Applicant: Ralf Bager

Inventor： Ralf Bager

IPC: G01R31/08

CPC classification number: H05K1/0256 ,  H05K1/0268 ,  H05K2201/0761

Abstract: A printed circuit card made of plastic has a carbonization sensor for protection against smoldering electrical fires. The carbonization sensor contains a first and a second conductor track disposed on the printed circuit card and also a monitoring device. The two conductor tracks are electrically insulated from one another by the plastic, and the monitoring device monitors an insulating state of the two conductor tracks in relation to one another and produces a fault signal. Local overheating of the printed circuit card is detected at an early time by the carbonization sensor, before an avalanche effect caused by the carbonization, which makes the printed circuit card electrically conductive, leads to a smoldering electrical fire.

Abstract translation: 由塑料制成的印刷电路卡具有用于防止阴燃电火焰的碳化传感器。 碳化传感器包括布置在印刷电路卡上的第一和第二导体轨迹以及监测装置。 两个导体轨道通过塑料彼此电绝缘，并且监测装置相对于彼此监测两个导体轨道的绝缘状态并产生故障信号。 在由于碳化引起的雪崩效应之前，由碳化传感器早期检测到印刷电路卡的局部过热，导致印刷电路卡导电，导致阴燃电火花。