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    Printed circuit board and electronic parts to be mounted thereon
    61.
    发明授权
    Printed circuit board and electronic parts to be mounted thereon 失效
    印刷电路板和要安装在其上的电子部件

    公开(公告)号：US5438480A

    公开(公告)日：1995-08-01

    申请号：US151103

    申请日：1993-11-12

    Applicant: Masayasu Yamashita

    Inventor： Masayasu Yamashita

    IPC: H05K3/28 ,  H05K3/34 ,  H05K7/02 ,  H01L23/28

    CPC classification number: H05K3/284 ,  H05K2201/09872 ,  H05K2201/10977 ,  H05K2203/1322 ,  H05K3/3447

    Abstract: Disclosed are a printed circuit board which buries the leads of electronic parts mounted on a printed board into a coating material to prevent the occurrence of a leak between the leads, and an electronic part designed to suppress the occurrence of cracks in a coating layer formed by coating a coating material on the electronic part and a printed board after the former is mounted on the latter. The printed circuit board comprises a printed board, a frame provided on the soldering-surface side of the printed board to surround all or a part of the soldering surface of the printed board in such a way that the amount of protrusion of the frame from the soldering surface of the printed board is made larger than that of protrusion of the leads of the electronic parts from the soldering surface side of the printed board, and a coating material injected inside the frame to bury the leads that protrude from the printed board. The electronic part comprises a case body having side walls nearly perpendicular to the mount surface of the electronic part. The electronic part has a mount surface at which the electronic part is to be attached to the printed board when mounted thereon. The mount-surface side outer peripheral portions of the side walls of the case body are each formed to have a curved surface so that as the outer peripheral portions approach the mount surface, the outer peripheral portions extend further outward.

    Abstract translation: 公开了一种印刷电路板，其将安装在印刷电路板上的电子部件的引线埋入涂层材料中，以防止引线之间发生泄漏;以及电子部件，其被设计成抑制由涂覆层形成的涂层中的裂纹的发生 在将前者安装在其上之后，在电子部件上涂覆涂层材料和印刷板。 印刷电路板包括印刷电路板，设置在印刷电路板的焊接表面侧上的框架，以围绕印刷电路板的焊接表面的全部或一部分，使得框架的突出量从 使得印刷电路板的焊接表面比电子部件的引线从印刷电路板的焊接表面侧突出的焊接表面大，并且注入到框架内部以将从印刷电路板突出的引线埋入的涂层材料。 电子部件包括壳体，其具有与电子部件的安装表面几乎垂直的侧壁。 电子部件具有安装表面，电子部件将安装在印刷电路板上。 壳体的侧壁的安装面侧外周部分各自形成为具有弯曲表面，使得当外周部接近安装表面时，外周部分进一步向外延伸。

    Apparatus for performing related operations on workpieces
    62.
    发明授权
    Apparatus for performing related operations on workpieces 失效
    用于对工件执行相​​关操作的装置

    公开(公告)号：US5370745A

    公开(公告)日：1994-12-06

    申请号：US960637

    申请日：1992-10-14

    Applicant: Mary O. Litteral

    Inventor： Mary O. Litteral

    IPC: B05B13/02 ,  B05B5/00 ,  B05C9/12 ,  B05C13/02 ,  B23Q41/04 ,  C23F1/00 ,  C23F1/08 ,  G05B19/418 ,  H05K3/00 ,  H05K3/28 ,  H05K13/00

    CPC classification number: H05K3/0091 ,  H05K13/0061 ,  H05K13/0469 ,  H05K3/00 ,  H05K2201/09872 ,  H05K2203/0165 ,  H05K2203/1366 ,  H05K2203/1509 ,  Y10T29/49126 ,  Y10T29/49829 ,  Y10T29/53404

    Abstract: Related operations are performed on workpieces, e.g., coating and curing circuit boards, of different types in random order in assembly line fashion on a rotary table of an apparatus under programmed control. The table is rotated stepwise to move successive sections thereof from a load-unload station at which the respective workpieces are loaded and unloaded in random order, to a sensing station at which the type and orientation of the workpiece is sensed, next to an initial work station at which initial work, e.g., coating, is performed on the workpiece in dependence upon its type and orientation previously sensed at the sensing station, then to a subsequent work station at which related subsequent work is performed on the workpiece, e.g., curing of the coating, and in turn back to the load-unload station to complete a cycle. The workpiece is either changed in orientation on the table section for a repeat cycle to perform further work thereon or is replaced by another workpiece in random order.

    Abstract translation: 在编程控制下的装置的旋转台上以组装线的方式在不同类型的工件（例如，涂覆和固化电路板）上进行相关操作。 工作台逐步旋转以将相应工件的相继部分以相应的工件以随机顺序装载和卸载到其上感测工件的类型和定向的感测站，在初始工作旁边 根据其在感测站处先前感测到的类型和取向，在工件上对工件进行初始工作（例如涂层）的工作站，然后再到工件上进行相关后续工作的后续工作站，例如固化 涂层，然后又返回到装载站完成一个循环。 工件在工作台部分上的方向上改变重复循环，以在其上执行进一步的工作，或者以其他工件以随机顺序替换。

    Resin coated electric circuit board device
    65.
    发明授权
    Resin coated electric circuit board device 失效
    树脂涂层电路板装置

    公开(公告)号：US5010212A

    公开(公告)日：1991-04-23

    申请号：US357929

    申请日：1989-05-30

    Applicant: Chiaki Sumi ,  Wataru Kuwayama

    Inventor： Chiaki Sumi ,  Wataru Kuwayama

    IPC: H05K3/00 ,  H05K3/28

    CPC classification number: H05K3/284 ,  H05K2201/09872 ,  H05K3/0091 ,  Y10T29/49146

    Abstract: A printed circuit board having electrical components connected thereto in spaced relation is coated with a resin material by immersion in a container of resin material. The flow of resin between the electrical devices and the circuit board is facilitated by the provision of holes through the circuit board in alignment with each electrical component so that the formation of blow-holes is prevented.

    Abstract translation: 具有以间隔关系连接的电气部件的印刷电路板通过浸渍在树脂材料容器中而被树脂材料涂覆。 电气装置和电路板之间的树脂流动通过与每个电气部件对齐设置通过电路板的孔来促进，从而防止了气孔的形成。

    Conformal coating and potting system
    67.
    发明授权
    Conformal coating and potting system 失效
    保形涂料和灌封系统

    公开(公告)号：US4415604A

    公开(公告)日：1983-11-15

    申请号：US441164

    申请日：1982-11-12

    Applicant: Larry A. Nativi

    Inventor： Larry A. Nativi

    IPC: C09D155/00 ,  C08F283/00 ,  C08G18/10 ,  C08G18/48 ,  C09D175/14 ,  B05D3/06

    CPC classification number: C08G18/4812 ,  C08F283/006 ,  C08G18/10 ,  H05K2201/09872

    Abstract: Ultraviolet curable polymerizable coating system having a built-in secondary curing mechanism is disclosed. The polymerizable coating system is a one component system comprising at least one isocyanate-capped polyether diol and triol, an acrylate or methacrylate reactive diluent, and a polymerization initiator of the photo-initiator type. The coating system is also moisture curable.

    Abstract translation: 公开了具有内置二次固化机理的紫外线固化可聚合涂覆体系。 可聚合涂覆体系是包含至少一种异氰酸酯封端的聚醚二醇和三醇，丙烯酸酯或甲基丙烯酸酯反应性稀释剂和光引发剂类型的聚合引发剂的单组分体系。 涂层系统也可湿固化。

    Encapsulating composition for electronic circuit boards and process for applying same
    68.
    发明授权
    Encapsulating composition for electronic circuit boards and process for applying same 失效
    电子电路板的封装组合物及其应用方法

    公开(公告)号：US3652333A

    公开(公告)日：1972-03-28

    申请号：US3652333D

    申请日：1970-02-02

    Applicant: GEN DYNAMICS CORP

    Inventor： WARREN JOHN M

    IPC: C09D175/06 ,  H01B3/30 ,  H01B3/44 ,  H05K3/28 ,  H05K3/34 ,  B44D1/42

    CPC classification number: H05K3/284 ,  C09D175/06 ,  H01B3/302 ,  H01B3/447 ,  H05K3/3447 ,  H05K2201/09872 ,  H05K2201/10977 ,  H05K2203/1322 ,  Y10S428/901 ,  Y10T428/31576 ,  Y10T428/31909 ,  C08L2666/34

    Abstract: A process for applying a polyurethane gel composition for coating and encapsulating the electronic circuitry on a circuit board wherein the said composition consists essentially of an admixture of an elastomeric linear polyesterurethane of high molecular weight; a tetrahydrofuran intermediate monomer solvent and ethylene glycol monoethylether acetate, which composition is preferably sprayed over the object circuitry and onto the related electronic circuit board or other substrate as a vaporized gel of minute viscous globules which simultaneously forms a substantially uniform protective film over the substrate and encapsulates the circuit''s conduit and conduit terminals as well as other protrusions, including elements having sharp points, knife edges and the like. This prime coat is then dried and may be subsequently followed by one or more dip coatings which are formed by immersion of the dried workpiece into a mixture of polymethyl methacrylate with a copolymer of ethyl acrylate/methyl methylacrylate.

    Abstract translation: 一种用于将电子电路涂覆和封装在电路板上的聚氨酯凝胶组合物的方法，其中所述组合物基本上由高分子量的弹性线性聚酯聚氨酯的混合物组成; 四氢呋喃中间体单体溶剂和乙二醇单乙醚乙酸酯，该组合物优选在物体电路上喷射到相关电子电路板或其它基底上，作为微小粘性球的蒸发凝胶，其同时在基底上形成基本均匀的保护膜， 封装电路的管道和导管端子以及其他突起，包括具有尖锐点，刀刃等的元件。 然后将该底涂层干燥，随后可以通过将干燥的工件浸入聚甲基丙烯酸甲酯与丙烯酸乙酯/甲基丙烯酸甲酯的共聚物的混合物中而形成的一个或多个浸渍涂层。

    Conformal coating stripping method and composition
    69.
    发明授权
    Conformal coating stripping method and composition 失效
    一致的涂层剥离方法和组合

    公开(公告)号：US3625763A

    公开(公告)日：1971-12-07

    申请号：US3625763D

    申请日：1968-12-04

    Applicant: BUNKER RAMO

    Inventor： MELILLO MANLIO B

    IPC: H05K3/28 ,  B08B7/00 ,  C09D9/00 ,  C23G5/02

    CPC classification number: H05K3/288 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2203/0257 ,  H05K2203/0769 ,  H05K2203/0783

    Abstract: A liquid composition for stripping resin coatings such as epoxy embedment or conformal coatings from substrates such as printed circuit boards. The composition is a substantially anhydrous combination of organic liquids comprising on a volume basis above about 60 percent of a halogenated hydrocarbon liquid, a minor amount below 12 percent but above 4 percent of an alcohol and below 5 percent but at least 1 percent of a ketone. The resin coating is contacted with the composition for a period sufficient to loosen and solvate said resin. The removal of the softened resin may be facilitated by brushing.

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